Tokyo Electron Limited

Yenrui Hsu

Nobuhiro Ogata

Hiroki Sakurai

Shinichi Umeno

Hiroyuki Higashi

Kazuya Goda

Minsung Kim

Shoki Mizuguchi

A substrate processing apparatus according to the present disclosure includes a substrate holding unit, a fluid supplying unit, a processing-liquid supplying unit, a nozzle, a fluid amount adjusting unit, and a controller. The substrate holding unit holds a substrate to be rotatable. The fluid supplying unit supplies fluid including pressurized vapor or mist of deionized water. The processing-liquid supplying unit supplies processing liquid including at least a sulfuric acid. The nozzle is connected to the fluid supplying unit and the processing-liquid supplying unit to discharge mixed fluid of the fluid and the processing liquid toward the substrate. The fluid amount adjusting unit adjusts a flow volume of the fluid that is flowing through the fluid supplying unit. The controller controls the fluid amount adjusting unit to adjust a ratio of the fluid to the processing liquid.

Substrate processing apparatus and substrate processing method

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Kumamoto, Japan

Yenrui Hsu