Basf Se Corporation

Yeni Burk

Daniel Loeffler

Timo Mangel

Marcel Brill

Ekkehard Jahns

Joachim Pakusch

Andreas Klipp

Volodymyr Boyko

Lothar Engelbrecht

Christian Bittner

Guenter Oetter

Ingolf Hennig

Szilard Csihony

Frank O Pirrung

Francisco Javier Lopez Villanueva

Jean-Pierre Berkan Lindner

Christine Roesch

Miran Yu

Simon Braun

Birgit Gerke

Patrick Wilke

Bogdan Moraru

Frank Pirrung

Paola Romanato

Jan Ole Mueller

Lucas Benjamin Henderson

Sheng Hsuan Wei

Reiner Liedy

Martina Feil

Mei Chin Shen

Maike Bergeler

Rui De Oliveira

The invention relates to the use of a composition comprising a Cto Calkanol and a carboxylic acid ester of formula (I) wherein Ris selected from a Cto Calkyl, which may be unsubstituted or substituted by OH or F, and —X—[O—X]—H; Ris selected from a Cto Calkyl, which may be unsubstituted or substituted by OH or F, and —X—[O—X]—H; X, Xare independently selected from Cto Calkandiyl, which may be unsubstituted or substituted by OH or F; n is an integer from 1 to 5. wherein, the Cto Calkanol and the carboxylic acid ester are selected so as to form an azeotropic mixture and are present in an amount from 20% by weight below to 20% by weight above such azeotropic mixture.

Use of compositions comprising a solvent mixture for avoiding pattern collapse when treating patterned materials with line-space dimensions of 50 nm or below

Described herein is a composition for selectively etching a layer including a silicon germanium alloy (SiGe) in the presence of a silicon-containing layer, particularly a layer comprising a-Si, SiOx, SiON, SiN, or a combination thereof, the composition including:

Composition, its use and a process for selectively etching silicon-germanium material

The use of an organic compound as cleavable additive, preferably as cleavable surfactant, in the modification and/or treatment of at least one surface of a semiconductor substrate is described. Moreover, it is described a method of making a semiconductor substrate, comprising contacting at least one surface thereof with an organic compound, or with a composition comprising it, to treat or modify said surface, cleaving said organic compound into a set of fragments and removing said set of fragments from the contacted surface. More in particular, a method of cleaning or rinsing a semiconductor substrate or an intermediate semiconductor substrate is described. In addition, a compound is described which is suitable for the uses and methods pointed out above and which preferably is a cleavable surfactant.

Cleavable additives for use in a method of making a semiconductor substrate

The present invention relates to the use of liquid aqueous polymer compositions containing an aqueous polymer latex and at least one inorganic particulate material for providing flexible roof coatings. The present invention also relates to a method for providing flexible roof coatings, which comprises applying said liquid aqueous polymer compositions to a flat roof. The liquid aqueous polymer composition contain, a. an aqueous polymer latex, where the polymer in the polymer latex is made of polymerized monomers M, where the polymerized ethylenically unsaturated monomers M comprise a combination of) at least two different monoethylenically unsaturated, non-ionic monomers M1, whose homopolymers have a theoretical glass transition temperature T(th) of at least 25&#xb0; C. and ii) at least two different monoethylenically unsaturated, non-ionic monomers M2, whose homopolymers have a theoretical glass transition temperature T(th) of at less than 25&#xb0; C., where each of the monomers M1 and M2 have a solubility in deionized water of at most 50 g/L and where the total amount of monomers M1 and M2 contributes with at least 90% by weight to the total amount of the monomers M, and b. at least one inorganic particulate material selected from inorganic pigments, inorganic fillers and mixtures thereof.

Aqueous polymer compositions for flexible roof coatings

The invention relates to the use of a non-aqueous composition comprising an organic solvent and at least one particular siloxane-type additive for treating substrates comprising patterns having line-space dimensions of 50 nm or below and aspect ratios of 4 or more as well as a method for manufacturing integrated circuit devices, optical devices, micromachines and mechanical precision devices, the said method comprising the steps of (1) providing a substrate having patterned material layers having line-space dimensions of 50 nm, aspect ratios of greater or equal 4, or a combination thereof, (2) contacting the substrate at least once with a non-aqueous composition, and (3) removing the non-aqueous composition from the contact with the substrate, wherein the non-aqueous composition comprising an organic solvent and at least one of such siloxane-type additives.

Use of compositions comprising a siloxane-type additive for avoiding pattern collapse when treating patterned materials with line-space dimensions of 50 nm or below

The present invention provides an aqueous polyurethane (PU)-polyacrylate hybrid dispersion obtainable by free radical polymerization of at least one acrylate polymer (A1) in the presence of at least one polyurethane (P1), a process for preparing these aqueous polyurethane-polyacrylate hybrid dispersions, wherein said process comprises a) preparing an aqueous polyurethane dispersion and b) using the polyurethane dispersion thus prepared as raw material for the further synthesis of a polyacrylate dispersion, and the use of the hybrid dispersion thus obtained as binder in filled coating materials, particularly as a binder for flexible roof coatings.

Methods for producing and using aqueous polyurethane/polyacrylate hybrid dispersions and use of said aqueous polyurethane/polyacrylate hybrid dispersions in coating agents

A process for preparing an aqueous polymer dispersion of a polymer P by radically initiated aqueous emulsion polymerization of ethylenically unsaturated compounds, which comprises radically initiated aqueous emulsion polymerizing a monomer composition. The use of the aqueous polymer in tile adhesives is also provided.

Process for preparing an aqueous polymer dispersion

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Ludwigshafen, Germany

Yeni Burk