Vanguard International Semiconductor Corporation

Macronix International Co., Ltd.

Yen-Tai Lin

Howard C Kirsch

Howard Clayton Kirsch

Jack-Lian Kuo

Chiun-chi Shen

Jiang-Hong Ho

Yu-Ming Hsu

Tzong-Shi Jan

Hon-Sco Wei

A novel capacitor design and construction method that uses a stacked structure which is sometimes otherwise used for a so-called floating gate transistor. A first electrical contact is electrically coupled with a conductive region formed in the substrate and with a control gate layer. A second electrical contact is electrically coupled with a floating gate layer, forming a plate between the substrate and control gate layers. The footprint of this capacitor is reduced by using both sides of the floating gate layer as capacitive plate. Parasitic capacitance is relatively reduced. One or more dielectric layers can be formed for both capacitors and for floating gate transistors on the substrate in the same process step or steps.

Triple plate capacitor and method for manufacturing

A circuit and a method are disclosed for a Schmitt trigger stage which converts transistor-transistor logic (TTL) into metal oxide semiconductor (MOS) logic signal levels using all MOS devices. The circuit reduces the standby current of the n-channel transistor of the input section of the Schmitt trigger stage by adding a MOS diode to the bottom the input section. When higher than normal supply voltages are used, the standby current of the p-channel transistor of the input section can be reduced by adding a MOS diode to the top of the input section. In addition, a small MOS transistor, connected across the output Schmitt trigger inverter, eliminates leakage currents in that inverter.

Schmitt trigger input stage

A first mask includes a well mask formed over a first portion of the wafer to define a first conductive type well in the wafer. A first polysilicon mask is formed over the well mask including a plurality of first structures and a plurality of second structures to cover a first polysilicon layer, thereby defining polysilicon gates. A first implanting mask is formed over the first polysilicon mask for forming second conductive type region. A second implanting mask is formed over the first polysilicon mask for forming first conductive type region. A second polysilicon mask is formed between gates of a second conductive type MOS and gates of a first conductive type MOS. A contact hole mask is formed over the second polysilicon mask for forming contact holes. A metal mask is formed over the contact hole mask for forming connection.

Layout structure of multi-use coupling capacitors in reducing ground

This invention describes a delay circuit for integrated circuits that has the capability to delay the rising and falling transitions separately and independent of each other. A signal is fed through an RC network to a Schmitt trigger and then through an inverter to the output of the delay circuit. Two MOS transistors are connected as capacitors and in parallel but in opposing directions between the delay circuit output and the input to the Schmitt trigger to form part of the RC network. The biasing of the two transistors is such that the inversion layer capacitance is active in only one transistor for each signal transition. Thus the falling and rising transition of an input signal can be delayed separately. Changing the gate and channel size in one transistor acting as a capacitor changes the delay in one signal transition. Changing the other gate and channel size changes the delay in the other transition. The output of the delay circuit is fed back through the transistor capacitors to hasten the switching of the Schmitt trigger.

RC delay circuit for integrated circuits

A method, a circuit, and a structure are disclosed by which the semiconductor area is reduced that a local word line decoder for a memory array requires. This reduction in area size has been achieved by eliminating one transistor of a three transistor local wordline decoder and introducing a fifth transistor which is shared by two local wordline decoders. The area occupied by the two eliminated transistors is no longer needed because the fifth transistor can be fitted between two existing transistors without an increase in area.

Local word line decoder for memory with 2 1/2 MOS devices

A method and a circuit are disclosed by which the semiconductor area is reduced that a local word line decoder for a memory array requires. This reduction in area size has been achieved by eliminating one transistor of a three transistor local wordline decoder and by reducing the number of inputs to the decoder from three to two. The reduction in inputs is made possible by the method of applying to one of the inputs, when low, a voltage signal v.sub.b which is at least one threshold lower than the voltage signal to the other input, when low. This voltage v.sub.b can be derived from the p-substrate bias voltage.

Local word line decoder for memory with 2 MOS devices

Circuits and a method are described that integrate memory arrays, a redundant memory array, their associated decoders, sense amplifiers, and outputs into one module. This integration is achieved through the use of a column decoder with a fuse, which, when blown, permanently deselects the failing array and selects the redundant array. By OR'ing the redundant column select line of each column decoder, any column decoder can select the redundant array. Higher level array structures are produced by replication of the lower level array structure. The system output is generated by OR'ing together the respective data outputs of each array.

Semiconductor memory with a novel column decoder for selecting a

A circuit for the control of a power or ground distribution transient voltage or power bounce or ground bounce is described. The circuit has a driver transistor of a first conductivity type and a driver transistor of a second conductivity type connected so as to be able to transfer a voltage to a data output terminal from a I/O voltage distribution network or a I/O ground distribution network. As the output terminal changes from a logic 1 to a logic 0 the driver transistor of the first conductivity type will conduct and a ground distribution voltage transient will begin to appear. A suppression transistor of the first conductivity type that will begin to conduct to begin cessation of conduction of the driver transistor of the first conductivity type decreasing the slew rate of the driver transistor of the first conductivity type. As the output terminal changes from a logic 0 to a logic 1 the driver transistor of the second conductivity type will conduct and a power distribution voltage transient will begin to appear. A suppression transistor of the second conductivity type that will begin to conduct to begin cessation of conduction of the driver transistor of the second conductivity type decreasing the slew rate of the driver transistor of the second conductivity type. The transistors may be PMOS, NMOS, NPN bipolar, or PNP bipolar integrated upon a silicon or compound semiconductor substrate.

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Hsinchu, Taiwan

Yen-Tai Lin