Playnitride Display Co., Ltd.

Yen-Mu Chen

A processing and detecting apparatus configured to process and detect an object is provided and includes a carrying platform, a laser unit, a wavelength measuring unit, and a computing unit. The carrying platform is configured to carry the object, and the object includes a substrate and a plurality of micro light emitting diodes (LEDs) disposed on the substrate. The laser unit is configured to perform a working procedure on the object on the carrying platform and excite each of the micro LEDs to radiate a light signal. The wavelength measuring unit is configured to measure the light signal radiated by exciting each of the micro LEDs in real time to obtain a spectrum of each of the micro LEDs. The computing unit is configured to analyze the spectra of the micro LEDs to determine whether the working procedure is abnormal.

Processing and detecting apparatus

A method for trimming a micro electronic element includes: providing a substrate, wherein at least one micro electronic element is disposed on the substrate, heating an interface of the substrate and the micro electronic element by a first pulse laser beam to reduce a bonding force between the micro electronic element and the substrate, and irradiating a surface layer of the micro electronic element by a second pulse laser beam to generate a shock wave due to plasma on the surface layer of the micro electronic element. The shock wave removes the micro electronic element away from the substrate. An apparatus for trimming a micro electronic element is also provided.

Growing community of inventors

MiaoLi County, Taiwan

Yen-Mu Chen