Taiwan Semiconductor Manufacturing Comp. Ltd.

Anpec Electronics Corporation

Yen-Ming Chen

Feng-Cheng Yang

Wei-Yang Lee

Sai-Hooi Yeong

Dian-Hau Chen

Kai-Hsuan Lee

Sheng-Chen Wang

Chih-Fan Huang

Hui-Chi Chen

Yen-Ting Chen

Feng-Ching Chu

Chia-Ta Yu

Tsung-Lin Lee

Hsiang-Ku Shen

Fu-Jier Fan

Kai-Ming Ching

Hsin-Hui Lee

Chi On Chui

Jian-Hao Chen

Kuo-Feng Yu

Wei-Yuan Lu

Yee-Chia Yeo

Cheng-Yi Peng

Chih-Hao Wang

Kuan-Lun Cheng

Kuo-Cheng Chiang

Fu-Kai Yang

Shih-Hao Lin

Shih-Chi Lin

Ru-Gun Liu

Ziwei Fang

Hung-Li Chiang

Chung-Te Lin

Yung-Sung Yen

Ming-Huan Tsai

Chih-Chieh Yeh

Yen-Chieh Huang

Chun-Yi Lee

Chun-Fai Cheng

Chih-Hsin Ko

Chun Hsiung Tsai

Shahaji B More

Chih Chieh Yeh

Cheng-Hsien Wu

Liang-Yin Chen

Ka-Hing Fung

Chan-Lon Yang

Chung-Cheng Wu

Xiong-Fei Yu

Yih-Ann Lin

Chien-I Kuo

Min-Chang Liang

Ching-Yu Chang

Chin-Hsiang Lin

Jiann-Tyng Tzeng

Mei-Yun Wang

Chen-Ming Lee

Hsueh-Chang Sung

Ta-Pen Guo

Chih-Yuan Ting

Chi-Cheng Hung

Wei-Liang Lin

Kuei-Shun Chen

David Barry Scott

Min Cao

Chi-On Chui

Shun-Liang Hsu

Chien-Wei Wang

Li-Li Su

Ya Hui Chang

Chih-Ning Chen

Jeng-Ya David Yeh

Wen-Chih Chiou

Kuo-Cheng Ching

Chih-Ming Lai

Tien-I Bao

Chih-Liang Chen

Shi Ning Ju

Li-Zhen Yu

Da-Yuan Lee

Kam-Tou Sio

Yasutoshi Okuno

Chun-Kuang Chen

Chien-Hao Chen

Kuan-Ting Pan

Pang-Yen Tsai

Yung-Lung Hsu

Yung-Chi Lin

Chih-Tang Peng

Han-Ting Tsai

Jr-Hung Li

Sheng-Liang Pan

Kang-Min Kuo

Kai-Wen Cheng

Chia-Cheng Ho

De-Wei Yu

I-Wen Wu

Chih-Hung Lu

Ying-Liang Chuang

Yu-Hua Lee

A method includes providing a workpiece including a gate structure (MG), a first spacer along a sidewall of the MG, a second spacer along a sidewall of the first spacer, and a source/drain (S/D) feature adjacent to the second spacer. The method further includes forming a contact trench over the S/D feature, removing the second spacer to form an air gap between the MG and the S/D feature, depositing a first dielectric layer over the S/D feature and partially filling the air gap, removing a portion of the first dielectric layer to expose a central portion of a top surface of the S/D feature while a side portion of the top surface of the S/D feature remains under the first dielectric layer, forming an S/D contact in the contact trench, removing the first dielectric layer to extend the air gap, and depositing a second dielectric layer over the air gap.

Methods of reducing parasitic capacitance in semicondutor devices

The present disclosure is directed to a semiconductor device. The semiconductor device includes a multi-layer interconnect structure disposed over a substrate, a dielectric layer disposed over the multi-layer interconnect structure, and a metal-insulator-metal (MIM) capacitor disposed over the dielectric layer. The MIM capacitor includes a bottom electrode disposed on a top surface of the dielectric layer, a top electrode disposed above the bottom electrode, and an insulating layer interposed between the bottom electrode and the top electrode. The bottom electrode has a slanted sidewall with respect to the top surface of the dielectric layer. The top electrode has a vertical sidewall with respect to the top surface of the dielectric layer. The insulating layer covers the slanted sidewall of the bottom electrode.

Metal-insulator-metal structure and methods of fabrication thereof

A semiconductor device includes a substrate; two source/drain (S/D) regions over the substrate; a gate stack over the substrate and between the two S/D regions; a spacer layer covering sidewalls of the gate stack; an S/D contact metal over one of the two S/D regions; a first dielectric layer covering sidewalls of the S/D contact metal; and an inter-layer dielectric (ILD) layer covering the first dielectric layer, the spacer layer, and the gate stack, thereby defining a gap. A material of a first sidewall of the gap is different from materials of a top surface and a bottom surface of the gap, and a material of a second sidewall of the gap is different from the materials of the top surface and the bottom surface of the gap.

Semiconductor device with air-spacer

Semiconductor device and the manufacturing method thereof are disclosed. An exemplary semiconductor device comprises a first semiconductor stack and a second semiconductor stack over a substrate, wherein each of the first and second semiconductor stacks includes semiconductor layers stacked up and separated from each other; a dummy spacer between the first and second semiconductor stacks, wherein the dummy spacer contacts a first sidewall of each semiconductor layer of the first and second semiconductor stacks; and a gate structure wrapping a second sidewall, a top surface, and a bottom surface of each semiconductor layer of the first and second semiconductor stacks.

Post gate dielectric processing for semiconductor device fabrication

A semiconductor device including a fin field effect transistor (FinFET) with a cut metal gate (CMG) and a method of manufacturing the semiconductor device are described herein. The method includes forming a CMG protective helmet structure at a top portion of a CMG dummy gate plug formed within a semiconductor substrate. The CMG protective helmet structure prevents consumption and damage of a dummy filler material in a CMG region and prevents undesirable polymer/residue byproducts from forming on top surfaces of epitaxial regions of the FinFET during etching processes.

Semiconductor device and method

In a method of manufacturing a semiconductor device including a magnetic random access memory (MRAM) cell, a first layer made of a conductive material is formed over a substrate. A second layer for a magnetic tunnel junction (MTJ) stack is formed over the first conductive layer. A third layer is formed over the second layer. A first hard mask pattern is formed by patterning the third layer. The MTJ stack is formed by patterning the second layer by an etching operation using the first hard mask pattern as an etching mask. The etching operation stops at the first layer. A sidewall insulating layer is formed over the MTJ stack. After the sidewall insulating layer is formed, a bottom electrode is formed by patterning the first layer to form the MRAM cell including the bottom electrode, the MTj stack and the first hard mask pattern as an upper electrode.

Magnetic random access memory and manufacturing method thereof

A chip structure is provided. The chip structure includes a semiconductor substrate. The chip structure includes a first conductive layer over the first dielectric layer. The chip structure includes a conductive via passing through the first conductive layer and electrically connected to the first conductive layer. The chip structure includes a conductive pad over and in direct contact with the conductive via. The chip structure includes a second conductive layer over and spaced apart from the first conductive layer. The chip structure includes a first dielectric layer conformally covering a second lower portion of a sidewall of the second conductive layer. The chip structure includes a third conductive layer over the first dielectric layer.

Chip structure with conductive layer

A method includes etching a first semiconductor fin and a second semiconductor fin to form first recesses. The first and the second semiconductor fins have a first distance. A third semiconductor fin and a fourth semiconductor fin are etched to form second recesses. The third and the fourth semiconductor fins have a second distance equal to or smaller than the first distance. An epitaxy is performed to simultaneously grow first epitaxy semiconductor regions from the first recesses and second epitaxy semiconductor regions from the second recesses. The first epitaxy semiconductor regions are merged with each other, and the second epitaxy semiconductor regions are separated from each other.

Flexible merge scheme for source/drain epitaxy regions

A method for fabricating a semiconductor device that includes a merged source/drain feature extending between two adjacent fin structures is provided. An air gap is formed under the merged source/drain feature. Forming the epitaxial feature includes growing a first epitaxial feature having a first portion over the first fin structure and a second portion over the second fin structure, growing a second epitaxial feature over the first and second portions of the first epitaxial feature, and growing a third epitaxial feature over the second epitaxial feature. The second epitaxial feature includes a merged portion between the first fin structure and the second fin structure.

Semiconductor device with phosphorus-doped epitaxial features

A method and semiconductor device including a substrate having one or more semiconductor devices. In some embodiments, the device further includes a first passivation layer disposed over the one or more semiconductor devices. The device may further include a metal-insulator-metal (MIM) capacitor structure formed over the first passivation layer. In addition, the device may further include a second passivation layer disposed over the MIM capacitor structure. In various examples, a stress-reduction feature is embedded within the second passivation layer. In some embodiments, the stress-reduction feature includes a first nitrogen-containing layer, an oxygen-containing layer disposed over the first nitrogen-containing layer, and a second nitrogen-containing layer disposed over the oxygen containing layer.

Method of forming a stress reduction structure for metal-insulator-metal capacitors

A semiconductor structure includes a third metal layer immediately above a second metal layer that is over a first metal layer. The second metal layer includes magnetic tunneling junction (MTJ) devices in a memory region and a first conductive feature in a logic region. Each MTJ device includes a bottom electrode and an MTJ stack over the bottom electrode. The third metal layer includes a first via electrically connecting to the first conductive feature, and a slot via over and electrically connecting to the MTJ stack of the MTJ devices. The slot via occupies space extending continuously and laterally from a first one to a last one of the MTJ devices. The first via is as thin as or thinner than the slot via. The third metal layer further includes second and third conductive features electrically connecting to the first via and the slot via, respectively.

Structure and method for MRAM devices with a slot via

A method includes forming a structure having a dummy gate stack over a fin protruding from a substrate. The fin includes an ML of alternating semiconductor layers and sacrificial layers. The method further includes forming a recess in an S/D region of the ML, forming a recess of the ML, and forming inner spacers on sidewalls of the sacrificial layers. Each inner spacer includes a first layer embedded in the sacrificial layer and a second layer over the first layer. The method further includes forming an S/D feature in the recess, such that the second layer of the inner spacers is embedded in the S/D feature. The method further includes removing the dummy gate stack to form a gate trench, removing the sacrificial layers from the ML, thereby forming openings interleaved between the semiconductor layers, and subsequently forming a high-k metal gate stack in the gate trench and the openings.

Dielectric inner spacers in multi-gate field-effect transistors

A method includes forming a magnetic tunnel junction (MTJ) stack over a substrate. The MTJ stack including a top magnetic layer, a barrier layer, and a bottom magnetic layer. The method also includes patterning the top magnetic layer in a first etch process, after the patterning of the top magnetic layer depositing a spacer on sidewalls of the patterned top magnetic layer, and patterning the bottom magnetic layer in a second etch process.

Semiconductor memory device with spacer protection and method for forming same using multi-step patterning

A method includes attaching a wafer to a wafer chuck having a curved surface. The method further includes placing a device die on the wafer, such that a first dielectric layer of the device die is in contact with a second dielectric layer of the wafer, and performing an annealing process to bond the first dielectric layer to the second dielectric layer. The method further includes encapsulating the device die with an encapsulating material, forming redistribution lines overlapping the encapsulating material and the device die, and sawing the encapsulating material to form a plurality of packages.

Method of forming package structure by using a wafer chuck with adjustable curved surface

In one example aspect, a method for integrated circuit (IC) fabrication comprises providing a device structure including a substrate, a source/drain (S/D) feature on the substrate, a gate stack on the substrate, a contact hole over the S/D feature; and a dummy feature over the S/D feature and between the gate stack and the contact hole. The method further comprises forming in the contact hole a contact plug that is electrically coupled to the S/D feature, and, after forming the contact plug, selectively removing the dummy feature to form an air gap that extends higher than a top surface of the gate stack. The method further comprises forming over the contact plug a seal layer that covers the air gap.

Self-aligned contact air gap formation

Growing community of inventors

Chu-Pei, Taiwan

Yen-Ming Chen