Advanced Semiconductor Engineering, Inc.

Yen-Liang Huang

Teck-Chong Lee

Yung-Shun Chang

Sheng-Wen Yang

A package structure is provided. The package structure includes an encapsulant and an interposer. The encapsulant has a top surface and a bottom surface opposite to the top surface. The interposer is encapsulated by the encapsulant. The interposer includes a main body, an interconnector, and a stop layer. The main body has a first surface and a second surface opposite to the first surface. The interconnector is disposed on the first surface and exposed from the top surface of the encapsulant. The stop layer is on the second surface, wherein a bottom surface of the stop layer is lower than the second surface.

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Kaohsiung, Taiwan

Yen-Liang Huang