Taiwan Semiconductor Manufacturing Comp. Ltd.

Mediatek Corporation

Powerchip Technology Corporation

Industrial Technology Research Institute

National Taiwan University

Inventec Corp.

Lite-on Technology Corporation

Inventec (pudong) Technology Corporation

Lite-on Electronics (guangzhou) Limited

Pegatron Corporation

Powertip Technology Corporation

Yen-Liang Chen

Chih-Ming Ke

Hung-Chih Hsieh

Kai-Hsiung Chen

Jun-Xiu Liu

Kai Wu

Sou-Yung Hsieh

Yuh-Shyang Su

Po-Chung Cheng

An-Yeu Wu

Wen-Zhan Zhou

Cheng-Zhou Zhan

Tsai-Sheng Gau

Pang-An Ting

Heng-Jen Lee

Te-Chih Huang

Chien-Wei Kuan

Chen-Yen Ho

Ho-Yung David Hwang

Chun-Hsien Peng

Kai-Yu Cheng

Cheng-Ming Chen

Chia-Sheng Peng

Chun-Wei Yang

Yen-Hung Chen

Che-Yuan Sun

Cheng-Feng Chen

Chin-Wei Hsu

Yu-An Chen

Meng-Hsuan Shih

Chia-Hui Chen

Ying-Chou Shih

Chia-Ying Lee

Chen-Ming Wang

Yu-Ho Lin

Da-Wei Sung

Chao-Wei Wang

An-Yu Wu

Ching-Hao Yu

Shao-Wei Feng

Po-Yu Chen

Ming-Fu Tang

Jia-Yu Liu

Shyh-Yueh Wang

Chiu-Yuan Huang

Chien-Hsu Hou

Chi-Tsan Chen

Po-Chung Hsiao

Jian-Yu Chu

Wen-Sing Huang

Kuo-Feng Sung

Yu-Tse Wei

Xin-Jiu Wang

He Fan

Ting-Jhun Jheng

Kai Lin

Martijn Baller

Chi-Chen Lin

Wei-Chun Chien

Yung-Chie Huang

Chun-Hsiang Chen

Jia-Rong Lin

Hsiang-Han Hsu

Yi-Ching Chen

Yu-Ping Lan

Chia-Hsien Chou

Sin-Sheng Wong

A transmitter and a method for dynamically setting a current mode of the transmitter are provided. The transmitter includes a digital signal processing (DSP) circuit and a radio frequency (RF) circuit. The DSP circuit is configured to determine a target current mode by selecting one of multiple candidate current modes of the transmitter according to instantaneous transmitting (TX) information, wherein the instantaneous TX information includes at least one of a resource block (RB) information, a modulation and coding scheme (MCS), and an orthogonal frequency-division multiplexing (OFDM) type of an instantaneous TX signal. The RF circuit is configured to output the instantaneous TX signal, wherein at least one supply voltage and at least one bias voltage of a power amplifier (PA) of the RF circuit is controlled according to the target current mode. More particularly, the multiple candidate current modes correspond to different target power consumptions of the transmitter, respectively.

Transmitter and method for dynamically setting current mode of transmitter

According to an aspect of the present disclosure, in a method of manufacturing a semiconductor device, a lower layer pattern including first periodic patterns having a first pitch is formed, and an upper layer pattern including second periodic patterns having a second pitch different from the first pitch is formed. The first periodic patterns at least partially overlaps the second periodic patterns in plan view. A Moiré fringe pattern of the lower layer pattern and the upper layer pattern is obtained by using an electron beam, and an overlay error between the lower layer pattern and the upper layer pattern is obtained from the Moiré fringe pattern.

Method and structure for overlay measurement in semiconductor device manufacturing

The application provides a tuner codeword database construction method and a mobile device. A plurality of mobile device configuration parameters are obtained. Tuner characteristic measurement is performed on one or more testing mobile devices based on the plurality of mobile device configuration parameters to generate a plurality of tuner characteristic data. Tuner codeword selection is performed on the plurality of tuner characteristic data based on a predetermined weighting and a filtering range to generate a target tuner codeword among a plurality of tuner codewords. The target tuner codeword is stored in a tuner codeword database, the tuner codeword database storing a plurality of stored tuner codewords for controlling at least one tuner of a user mobile device.

Tuner codeword database construction method and mobile device

The present disclosure provides embodiments of a system and method for detecting processing chamber condition. The embodiments include performing a wafer-less processing step in a processing chamber to determine the condition of the chamber walls. Based on an analysis of the residual gas resulting from the wafer-less processing step, an operator or a process controller can determine whether the chamber walls have deteriorated to such an extent as to be cleaned.

System and method for residual gas analysis

A polish head of a chemical mechanical polishing system is provided. The polish head includes a carrier head, a membrane mounted to the carrier head, an inner retaining ring mounted to the carrier head and surrounding the membrane, an outer retaining ring mounted to the carrier head and surrounding the inner retaining ring, and an image capturing device. The outer retaining ring is spaced apart from the inner retaining ring. The image capturing device is mounted to the carrier head and between the inner retaining ring and the outer retaining ring.

Chemical mechanical polishing apparatus and method

Methods and systems for diagnosing a semiconductor wafer are provided. A plurality of raw images are captured with a tilt angle from the semiconductor wafer according to graphic data system (GDS) information regarding a layout of a target die, by an inspection apparatus. A first image-based comparison is performed on the plurality of raw images, by a determining circuitry, to obtain a defect image in the plurality of raw images. A second image-based comparison is performed on a reference image and the defect image, so as to classify a defect type of an image difference in the defect image, by the determining circuitry. The number of the plurality of raw images is greater than 2.

Method and system for diagnosing a semiconductor wafer

A radio frequency (RF) communication assembly includes an RF communication circuit and a compensator apparatus. The compensator apparatus receives an input including an I-component of a pre-compensated signal, a Q-component of the pre-compensated signal, and encoded operating conditions of the RF communication circuit. The RF communication circuit includes RF circuit components causing signal impairments. The compensator apparatus perform neural network computing on the input, and the RF communication assembly generates a compensated output signal that compensates for at least a portion of the signal impairments.

AI-assisted communication circuit optimization

A method of overlay error measurement includes disposing a reference pattern module over a substrate. The substrate includes first and second overlay measurement patterns in first and second locations. The reference pattern module includes first and second reference patterns. The method includes creating a first overlap of the first reference pattern with the first overlay measurement pattern and a second overlap of the second reference pattern with the second overlay measurement pattern. The method further includes determining a first overlay error between the first reference pattern of the reference pattern module and the first overlay measurement pattern of the substrate and determining a second overlay error between the second reference pattern and the second overlay measurement pattern. The method also includes determining a total overlay error between the first and second overlay measurement patterns of the substrate based on the first and second overlay errors.

Method and apparatus for diffraction-based overlay measurement

A method for performing DBO measurements utilizing apertures having a single pole includes using a first aperture plate to measure X-axis diffraction of a composite grating. In some embodiments, the first aperture plate has a first pair of radiation-transmitting regions disposed along a first diametrical axis and on opposite sides of an optical axis that is aligned with a center of the first aperture plate. Thereafter, in some embodiments, a second aperture plate, which is complementary to the first aperture plate, is used to measure Y-axis diffraction of the composite grating. By way of example, the second aperture plate has a second pair of radiation-transmitting regions disposed along a second diametrical axis and on opposite sides of the optical axis. In some cases, the second diametrical axis is substantially perpendicular to the first diametrical axis.

Aperture design and methods thereof

Methods and systems for diagnosing a semiconductor wafer are provided. A plurality of raw images of the semiconductor wafer are obtained according to GDS information regarding a layout of a target die, by an inspection apparatus. A first image-based comparison is performed on the raw images, so as to provide a comparison result, by a determining circuitry. The comparison result indicates whether an image difference is present between the images. One of the raw images having the image difference is assigned as a defect image. A second image-based comparison is performed on a reference image and the defect image, so as to classify a defect type of the image difference, by the determining circuitry. The layout of the target die includes a circuit with a duplicate layout formed by a plurality of same cells. The number of the plurality of raw images is greater than 2.

An envelope tracking supply modulator includes an amplifier circuit and a zero peaking circuit. The amplifier circuit receives an envelope input, generates a modulated supply voltage according to the envelope input, and provides the modulated supply voltage to a power amplifier. The zero peaking circuit is coupled to the amplifier circuit, and applies zero peaking to the amplifier circuit, where the zero peaking inserts a zero at a frequency.

Envelope tracking supply modulator with zero peaking and associated envelope tracking calibration method and system

An overlay error measurement structure includes a lower-layer pattern disposed over a substrate, and an upper-layer pattern disposed over the lower-layer pattern and at least partially overlapping with the lower-layer pattern. The lower-layer pattern includes a plurality of first sub-patterns extending in a first direction and being arranged in a second direction crossing the first direction. The upper-layer pattern includes a plurality of second sub-patterns extending in the first direction and being arranged in the second direction. At least one of a pattern pitch and a pattern width of at least one of at least a part of the first sub-patterns and at least a part of the second sub-patterns varies along the second direction.

Overlay measurement structures with variable width/pitch for measuring overlay errors

Growing community of inventors

Zhubei, Taiwan

Yen-Liang Chen