Asm Technology Singapore Pte Ltd

Asm Assembly Automation Limited

Yen Hsi Tang

Kui Kam Lam

Ka Yee Mak

Kai Siu Lam

Wai Yuen Cheung

Wing Kin Lam

Shun Ming Fung

Yiu Yan Wong

Wenling Chan

Hok Man Wan

Hung Kit Chan

Electronic components are transferred from a source surface for supplying electronic components to a destination surface for receiving electronic components by an ejector device that is locatable at an ejection position for pushing an electronic component mounted on the source surface towards the destination surface. A support device that is locatable at a receiving position supports the electronic component that is pushed onto the destination surface. Further, a pre-transfer imaging device inspects the electronic component before it is transferred from the source surface and a post-transfer imaging device inspects the electronic component after it has been transferred onto the destination surface, wherein the pre-transfer and post-transfer imaging devices are located on opposite sides of the source and destination surfaces.

Direct transfer apparatus for electronic components

Disclosed is an optical apparatus for locating a plurality of placement positions on a carrier object. The optical apparatus comprises: i) an imaging device having a plurality of imaging sensors, each imaging sensor being operative to capture an image of a part of a selected row of placement positions on the carrier object and the plurality of imaging sensors defining a combined field of view that includes all the selected row of placement positions; ii) a positioning device coupled to the imaging device, the positioning device being operative to position the imaging device relative to successive rows of placement positions on the carrier object; and iii) a processor connected to the imaging device and which is configured to receive the images captured by the plurality of imaging sensors for image processing in order to identify exact locations of the placement positions comprised in the selected row of placement positions. A method of locating a plurality of placement positions on a carrier object is also disclosed.

Apparatus and method for locating a plurality of placement positions on a carrier object

An apparatusfor delivering semiconductor componentsto a substrateduring semiconductor package manufacturing. The apparatuscomprises a platformand a plurality of delivery modulesaffixed to the platform. Each of the plurality of delivery moduleshas a support devicefor supporting the substrate, as well as a delivery devicefor delivering the semiconductor componentsto the substrate. In particular, heights of the support devicesare mutually leveled for conveying the substratebetween the plurality of delivery modules

Apparatus for delivering semiconductor components to a substrate

Adhesive is dispensed for conducting die bonding onto a substrate including rows of bond pads aligned along a first axis and columns of bond pads aligned along a second axis transverse to the first axis where target dispensing positions are located. A first dispensing head incorporating a first nozzle and a second dispensing head incorporating a second nozzle are provided and the substrate is fed along the first axis to a position where the first and second dispensing heads are located. Pattern recognition of a columnar section of the substrate comprising one or more consecutive columns of bond pads with an optical system may be conducted by moving the optical system along the second axis relative to the substrate. Thereafter, the first nozzle and the second nozzle are driven concurrently to dispense adhesive from the first and second nozzles onto the target dispensing positions in the same columnar section of the substrate.

Die bonder incorporating dual-head dispenser

Growing community of inventors

Hong Kong, China

Yen Hsi Tang