Taiwan Semiconductor Manufacturing Comp. Ltd.

Macronix International Co., Ltd.

Feng Chia University

Yen-Hao Chen

Shin-Puu Jeng

Han-Hsiang Huang

Chien-Sheng Chen

Yu-Sheng Lin

Chih-Hsin Shih

Ho-Chin Wu

A bonded assembly including a first structure and a second structure is provided. The first structure includes first metallic connection structures surrounded of which a passivation dielectric layer includes openings therein, and first metallic bump structures having a respective first horizontal bonding surface segment that is vertically recessed from a first horizontal plane including a distal horizontal surface of the passivation dielectric layer. The second structure includes second metallic bump structures having a respective second horizontal bonding surface segment that protrudes toward the first structure. The first metallic bump structures is bonded to the second metallic bump structures through solder material portions.

Bridging-resistant microbump structures and methods of forming the same

A semiconductor structure includes a semiconductor die containing an array of first bonding structures. Each of the first bonding structures includes a first metal pad located within a dielectric material layer and a basin-shaped underbump metallization (UBM) pad located within a respective opening in a passivation dielectric layer and contacting the first metal pad. An interposer includes an array of second bonding structures, wherein each of the second bonding structures includes an underbump metallization (UBM) pillar having a respective cylindrical shape. The semiconductor die is bonded to the interposer through an array of solder material portions that are bonded to a respective one of the first-type bonding structures and to a respective one of the second-type bonding structures.

Basin-shaped underbump plates and methods of forming the same

The present disclosure relates to a microfluidic-based analyzer, including a drive module and a microfluidic disc. On the microfluidic disk, a capillary is connected between a mixing chamber and a waste chamber. More particularly, the capillary is connected to the mixing chamber through a first access on the first radius of the microfluidic disc, and the capillary is connected to the waste chamber through a second access on the second radius of the microfluidic disk. Specifically, a turn of the capillary is disposed between the first access and the second access, in which a folding is configured on a third radius of the microfluidic disc. Overall, the aforementioned microfluidic-based analyzer is able to be operated in different rotational speeds and is capable of evacuating the mixing chamber and enhancing the washing efficiency.

Microfluidics based analyzer and method for fluid control thereof

The present invention includes a method and device useful for decoding a Reed-Solomon (N, K) encoded message of m-bit symbols and corresponding syndromes, where N<&equals;2 &minus;1 and N&minus;K&equals;2t. Systolic calculation cells are used, organized to minimize complexity and computation time. Aspects of the invention include designs for syndrome calculation, division of polynomials over a Galois field, applying Euclid's algorithm, partitioning calculation cell arrays to reduce storage requirements, complexity and computation time, and evaluating an error location and polynomial and an error evaluator polynomial.

Growing community of inventors

Taichung, Taiwan

Yen-Hao Chen