Industrial Technology Research Institute

Yen-Chun Liu

Kuo-Chan Chiou

Hui-Wen Chang

Min-Chian Wang

Hsiang-Yen Tsao

Kuei-Yi Chuang

Chen-Lung Lin

Shou-Yi Ho

Hsien-Lin Hu

Yi-Chi Yang

Tsung-Jen Ho

Sheng-Fu Huang

Chun-Yi Chou

Ying-Xuan Lai

A conductive material composition and a conductive material prepared therefrom are provided. The conductive material composition includes 40-80 parts by weight of disulfide resin having at least one terminal reactive functional group and 20-60 parts by weight of metal material. The terminal reactive functional group is independently acrylate group, methacrylate group, glycidyl group, oxiranyl group, oxetanyl group, or 3,4-epoxycyclohexyl group.

Conductive material composition and conductive material prepared therefrom

A device for capturing particles includes a gas-guiding unit, a gas-guiding unit and a mist-elimination unit. The gas-guiding unit has opposing first and second ends. The mist-elimination unit is disposed at the second end. The liquid-circulation unit, disposed under the mist-elimination unit by surrounding the gas-guiding unit, includes through holes below the gas-guiding unit by a gap. A gas containing particles enters the channel via the first end and then the mist-elimination unit via the second end. While the gas flows into the channel, the liquid in the liquid-circulation unit is inhaled into the channel via the gap to form droplets containing particles. After the droplets are captured by the mist-elimination unit, the liquid formed at the mist-elimination unit flows down into the liquid-circulation unit to reform the liquid to be further inhaled back to the channel of the gas-guiding unit via the gap.

Device for capturing particles

A degradation method of thermosetting resin is provided. The method includes the following steps, for example, a first resin composition is provided. The resin in the first resin composition includes a carbon-nitrogen bond, an ether bond, an ester bond or a combination thereof. The first resin composition and a catalyst composition are mixed to perform a degradation reaction to form a second resin composition. The catalyst composition includes a transition metal compound and a group IIIA metal compound. The second resin composition includes a resin monomer or an oligomer thereof having functional groups. The functional group includes an amine group, a hydroxyl group, an ester group, an acid group or a combination thereof. A catalyst composition used in the degradation method and a resin composition obtained by the degradation method are also provided.

Method for degradating thermosetting resin, catalyst composition used therein and resin composition obtained thereby

A method for manufacturing a thermally conductive material is provided, which includes mixing 1 part by mole of (a) aromatic epoxy resin monomer, 0.25 to 1 part by mole of (b) cycloaliphatic epoxy resin monomer, and 1 to 9 parts by mole of (c) aliphatic epoxy resin monomer to form a resin composition. The method also includes heating and curing the resin composition to form a thermally conductive material.

Resin composition and method for manufacturing thermally conductive material

A thermally conductive resin is provided. The thermally conductive resin has the formula In the formula, Xis Xis m is an integer ranging from 0 to 95, n is an integer ranging from 1 to 50, and o is an integer ranging from 1 to 80. A thermal interface material including the thermally conductive resin is also provided.

Thermally conductive resin and thermal interface material comprising the same

An epoxy resin composition is provided. The epoxy resin composition includes a first aromatic epoxy resin represented by formula (I), and an amino compound selected from a group that includes 4,4'-methylenedianiline, 4,4&#x2032;-ethylenedianiline, 4,4&#x2032;-bis(4-aminophenoxy)biphenyl and 1,4-bis(4-aminophenoxy)benzene, wherein the ratio between the epoxy groups of the first aromatic epoxy resin and the amino groups of the amino compound ranges from 1:1 to 2:1.

Epoxy resin compositions and thermal interface materials comprising the same

A polyamide-imide represented by the following formula is provided. A graphite film prepared by performing a thermal treatment process on the polyamide-imide represented by the above-mentioned formula is also provided. In the thermal treatment process, the temperature range of the thermal treatment process ranges from 25&#xb0; C. to 2,900&#xb0; C.

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Taipei, Taiwan

Yen-Chun Liu