Avery International Corporation

Avery Dennison Corporation

Celanese Gmbh

Gaf Corporation

Yehuda Ozari

Prakash Mallya

Sebastian S Plamthottam

Chandrasen Gajria

Suzanne B Nelsen

Dru W Alwani

Earl W McFeaters

Edward Wotier

Binoy K Bordoloi

Eugene S Barabas

Andrew Klein

Shiaonung J Su

Colin C Smith

Richard R Vargas

Henry Lum, Jr

Robert V Ham

Sebastian S Plamthottan

Gerald R Dever

Ramesh Lhila

Vance Hall

Lalit Kochar

A hand-tearable masking tape comprising a tearable backing and an adherable face which permits the tape to be readily removable from a surface to which the tape is applied, the backing comprising a plastic film containing sufficient filler to bring the Elmendorf tear strength of the film to between about 150 and 300 gms.

Masking tape

A low viscosity hot melt acrylic pressure sensitive adhesive polymer is formed by bulk polymerization of at least one alkyl acrylate monomer containing from about 4 to 8 carbon atoms in the alkyl group and present in an amount of from about 60 to about 95% by weight of the polymer, from 1 to about 10% by weight of a copolymerizable amide monomer, from 1 to 10% by weight of a copolymerizble carboxylic acid, and a positive amount up to about 6% by weight of the monomers of a copolymerizable anhydride, said polymer formed thermally reversible crosslinks with a metal cation having a valence of from 2 to 4. Viscosity of the polymer is typically from 2 to 8 Pa.s at 150.degree. C. as formed and increases up to 100 Pa.s at 150.degree. C. on addition of the metal cation.

Low viscosity acrylic hot melt adhesives

Electron-beam cure by itself or in combination with multifunctional additives is used to improve the high-temperature shear properties of emulsion polymerized pressure-sensitive adhesives.

Electron-beam cured emulsion pressure-sensitive adhesives

There is provided a radiation-curable, pressure-sensitive-adhesive layer formed of at least one monomer having a glass-transition temperature greater than about -25.degree. C. and an entanglement molecular-weight less than about 20,000; at least one monomer having a glass-transistion temperature less than about -25.degree. C. and an entanglement molecular-weight greater than about 20,000; and at least one tackifier monomer having a glass-transistion temperature greater than -25.degree. C. and an entanglement molecular-weight of at least about 20,000 and present in an interpolymerized amount sufficient to form an interpolymer having a glass-transition temperature less than about -25.degree. C. and an entanglement molecular-weight greater than about 20,000. Cure is preferably by electron beam, and a multifunctional monomer is preferably provided to improve shear.

Energy-curable acrylic pressure-sensitive adhesives

A pressure sensitive adhesive tape comprises a carrier layer having a thickness of 0.25 to 2.0 millimeter and comprising an electron beam cured pressure sensitive adhesive matrix, 10 to 20% by volume low density microspheres and at least one pigment in an amount sufficient to color the tape. Preferably, fumed silica is present in an amount up to 5% by weight. The tape preferably has a kin layer on each side of the carrier layer. The skin layer has a coating thickness of 25 to 125 g/m.sup.2 and comprises a pressure sensitive adhesive matrix free of rigid, low density microspheres. The process comprises first preparing an adhesive composition containing electron beam-curable adhesive polymer matrix, fillers and solvent. The composition is introduced and conveyed through a twin screw extruder. In the extruder, solvent is removed in one or more solvent removal units, and a solvent-free composition is extruded as the carried layer. Skin layers may be co-extruded with the carrier layer.

High performance pressure sensitive adhesive tapes and process for

Inherently tacky infusible pressure-sensitive adhesive microspheres prepared by polymerizing at least one monomer which when polymerized will form a pressure-sensitive adhesive having a glass transition temperature less than about -20.degree. C. in a medium in which the monomer is substantially insoluble and in the presence of a surfactant and a suspension stabilizer which are soluble in the organic medium and substantially insoluble in the monomer under conditions of shear sufficient to form suspended particles of a size less than 200 microns. The formed microspheres are transferred to a volatile organic medium and separated from the medium in which they were formed by a centrifugal separator at a force of at least 2,000 times the force of gravity.

Suspension polymerization in an organic medium

A process includes first preparing an adhesive composition containing electron beam-curable PSA polymer matrix, fillers and solvent. The composition is introduced and conveyed through a twin screw extruder. In the extruder, solvent is removed in one or more solvent removal units, and a solvent-free composition is extruded as the carrier layer. Skin layers may be co-extruded with the carrier layer.

Process for making high performance pressure sensitive adhesive tapes

Inherently tacky infusible pressure-sensitive adhesive microspheres are prepared by polymerizing at least one monomer which when polymerized will form a pressure-sensitive adhesive having a glass transition temperature less than abotu -20.degree. C. in an organic medium in which the monomer is substantially insoluble and in the presence of a surfactant and a suspension stabilizer which are soluble in the organic medium and substantially insoluble in the monomer under conditions of shear sufficient to form suspended particles of a size less than 200 microns. A monomer soluble initiator is preferably employed. The preferred media are ethylene glycol and glycerol and the preferred monomers are 2-ethyl hexyl acrylate and methacrylic acid.

A heat-sensitive material is incorporated into a fluid prepolymer precursor of a pressure-sensitive adhesive to form a stable mixture. The mixture is cast onto a substrate, and the prepolymer is polymerized into a pressure-sensitive adhesive by the action of ultraviolet radiation, electron-beam radiation, or a combination thereof.

Pressure-sensitive adhesive containing heat-sensitive materials, and

Disclosed are carboxylic acid containing polymeric microgel particles which are prepared by polymerizing in aqueous emulsion a monomer mixture containing about 10-50% by weight of polymerizable carboxylic acid monomers, up to 5% of a difunctional crosslinking monomer and one or more carboxyl-free relatively water insoluble polymerizable vinyl monomers. The resulting microgel particles are water-swellable and may be employed as stabilizers for use in the preparation of aqueous dispersions of film-forming resins containing smaller amounts of organic solvents than conventional aqueous dispersions of this type. Such dispersions are useful as coating compositions, yielding coatings having less water sensitivity and improved adhesion as compared with coatings obtained from conventional aqueous dispersions of film-forming resins.

Water-swellable crosslinked polymeric microgel particles and aqueous

This invention relates to a polyvinyl chloride resin composition containing said resin and a significant amount of a polymer of butadiene in the form of a shell-core polymer wherein a polymer of methylmethacrylate forms said shell and completely encapsulates the core containing the butadiene polymer.

Growing community of inventors

Arcadia, CA, United States of America

Yehuda Ozari