National Central University

Chung Yuan Christian University

Chuan-Yuan Christian University

Yeeu-Chang Lee

Jyh-Chen Chen

Shen-Hang Tu

Jinn-Kong Sheu

Cheng-An J Lin

Jenq-Yang Chang

Cheng-Yi Huang

Cheng-Wei Chien

Yun-Chih Lee

Che-Lung Hsu

Chien-Chieh Lee

Yi-Tang Sun

Chang-Hung Chiang

Chi-An Chen

Jenq Yang Chang

Ching-Huai Ni

Disclosed herein are a light-emitting diode (LED) package structure and a method producing the same. The LED package structure includes a substrate; and a light-emitting unit disposed on the substrate. The light-emitting unit comprises a gallium nitride-based semiconductor, and a polymeric layer encapsulating the gallium nitride-based semiconductor. Also disclosed herein is a method of producing the LED package structure. The method comprises: providing a substrate; electrically connecting a gallium nitride-based semiconductor onto the substrate; overlaying the gallium nitride-based semiconductor with a slurry comprising a resin and a plurality of composite fluorescent gold nanocluster; and curing the slurry overlaid on the gallium nitride-based semiconductor to form a solidified polymeric layer.

Light-emitting diode package structure and method for manufacturing the same

A manufacturing method of a high-efficiency light-emitting diode (LED) is provided. A soft mold is used to transfer a microstructure or a nano-scale pattern thereon onto an imprinting material. The imprinting material is distributed all over an LED wafer; and the imprinting process may be performed through forward imprinting or reverse imprinting.

Manufacturing method of high-efficiency LED

Providing a fabrication method of a periodic domain inversion structure. A nonlinear optical ferroelectric material substrate is provided. A photoresist layer is formed on the upper and the lower surface of the substrate, and periodic gratings formed by interference of two laser beams are employed to expose the photoresist layer on the upper surface. Meanwhile, the two laser beams pass through the substrate, so the periodic gratings are used to expose the photoresist layer on the lower surface. A development process is performed to form a periodic photoresist pattern on the two surfaces of the substrate. A conductive layer is formed above the substrate for covering the photoresist pattern and the surface of the exposed substrate. The photoresist pattern and a portion of the conductive layer thereon are removed by lift-off. A voltage is applied to the substrate via the remaining conductive layer to polarize parts of the substrate.

Method of fabricating periodic domain inversion structure

An mold having a sub-micron, or even nano, structure is fabricated. The mold is a porous aluminum oxide mold. With the mold, a sub-micron pattern is easily imprinted on a large surface of a substrate or a LED. No expensive equipment is necessary. The fabricating process is fast and cheap and thus meets the needs of producers.

Method of fabricating porous aluminum oxide mold having sub-micron structure and methods of imprinting to make LEDS using the mold

A structure of light emitting diode (LED) effectively reduces its spectral width. The LED structure is applied in a three color mixing of a backlight module to broaden a color space and to improve a saturation of a color display. A grating structure is used as a waveguide layer to coordinate with the LED structure. The present invention does not affect the original thermo and electrical characteristics of the LED structure and has a simple fabrication method.

LED device having reduced spectrum

Growing community of inventors

Taoyuan, Taiwan

Yeeu-Chang Lee