Intel Corporation

Yee (William) Li

Hasnain Lakdawala

Greg F Taylor

Arijit Raychowdhury

Soumyanath Krishnamurthy

A thermal sensor is provided that includes a front-end component, an analog-to-digital converter and a digital backend. The front-end component including an array of current sources, a dynamic element matching (DEM) device, an analog chopper and two diodes to sense temperatures on the die. The front-end component to provide analog signals at two output nodes based on currents through the two diodes. The analog-to-digital converter to receive the analog signals from the front-end component and to provide an output signal. The digital backend to receive the output signal from the analog-to-digital converter and to provide a calculated temperature.

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Beaverton, OR, United States of America

Yee (William) Li