Linxens Holding

Yean-Wei Yeap

Valerie Mousque

Patrice Glaris

Olivier Thienard

Method for the manufacture of a chip card module in which a polymer material including conductive particles is deposited in two connection wells or on two conductive pads formed in a conductive sheet positioned on the back face of the module. This polymer material forms, after deposition, an excess thickness on the back face which comes, during the insetting of the module, into contact with the ends of an antenna. Between the manufacture of the modules and their insetting, the modules are positioned on a strip which can be rolled up on itself for the purpose of its storage.

Growing community of inventors

Singapore, Singapore

Yean-Wei Yeap