Ningbo Sunny Opotech Co., Ltd.

Sunny Opotech North America Inc.

Ye Wu

Mingzhu Wang

Bojie Zhao

Nan Guo

Feifan Chen

Zhenyu Chen

Takehiko Tanaka

Heng Jiang

Zhen Huang

Liang Ding

Zhongyu Luan

Fengsheng Xi

Zilong Deng

Baozhong Zhang

Jingfei He

Zhewen Mei

Wei Guo

The present disclosure provides a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device with the camera module, wherein the circuit board assembly comprises at least one electronic component, a substrate, and a molding unit. At least one of the electronic components is connected to the substrate conductively on a back face of the substrate. The molding unit comprises a back molding portion and a molding base, wherein the molding base is bonded to a front face of the substrate integrally when the back molding portion is bonded to at least a part of an area of the back face of the substrate integrally. There may be no need to reserve a position on the front face of the substrate to conductively connect the electronic components, so that the length and width of the camera module can be reduced, thereby reducing the volume of the camera module.

Camera module, circuit board assembly and manufacturing method thereof, and electronic device with camera module

A photosensitive component, and a camera module and a manufacturing method therefor. The photosensitive component comprises at least a photosensitive element, at least a window-form circuit board and at least a packaging body, wherein the photosensitive element and the window-form circuit board are integrally packaged through the packaging body. The window-form circuit board comprises a circuit board main body which comprises at least one window arranged thereon, wherein the photosensitive element is arranged within the window.

Photosensitive component, and camera module and manufacturing method therefor

A method for manufacturing semiconductor modules for image-sensing devices is disclosed. The method may comprise applying a removable layer on a first surface of a printed circuit board (PCB) which comprises a plurality of PCB units; mounting a photosensitive member to a second surface of each of the PCB units; and encapsulating the photosensitive member with an encapsulation layer on each PCB unit. Each PCB unit may comprise at least a semiconductor component on a second surface of the PCB and one or more opening across the first surface and the second surface. The photosensitive member and the removable layer separate the one or more opening from outside, and the photosensitive member is positioned to receive light through the opening. At least one semiconductor component is also encapsulated by the encapsulation layer on each PCB unit.

Systems and methods for manufacturing semiconductor modules

A photosensitive assembly includes a circuit board, a photosensitive element mounted on the circuit board and including a first edge, a first metal wire electrically connecting the photosensitive element and the circuit board and spanning the first edge, a first electronic element mounted on the circuit board and having a mounting area corresponding to an extension line of the first edge, and a molding portion formed on the circuit board, surrounding the photosensitive element, extending to the photosensitive element, covering the first electronic element and the first metal wire, and contacting with a surface of the photosensitive element. Also included are a corresponding camera module, a photosensitive assembly jointed panel and a manufacturing method thereof. The damage risk of a gold wire in a molding process can be reduced to a certain extent without adding additional components and changing a die.

Photosensitive assembly, photographing module, and photosensitive assembly jointed board and corresponding manufacturing method thereof

A camera module includes an optical lens, a light-sensitive chip and an electrical support. The electrical support includes a circuit module embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit module, and a camera component coupled at the support body and electrically connected to the connecting member. Therefore, the electrical support not only forms a circuit board to electrically connect with the camera component but only serves as a base to support the camera component.

System-level camera module with electrical support and manufacturing method thereof

A method for manufacturing a semiconductor module for an image-sensing device is disclosed. The method may comprise forming a first molding component on a first surface of a printed circuit board (PCB); mounting at least a photosensitive member to a second surface of the PCB; and forming a second molding component on the second surface of the PCB. The PCB may comprise at least an electric component on the first surface of the PCB. The first molding component may encapsulate the at least one electric component with the PCB. The second molding component may secure the photosensitive member on the PCB.

Manufacture of semiconductor module with dual molding

A camera module includes an optical lens, a photosensitive chip and an electrical support. The electrical support includes a circuit module embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit module, and a camera component coupled at the support body and electrically connected to the connecting member. Therefore, the electrical support not only forms a circuit board to electrically connect with the camera component but only serves as a base to support the camera component.

The present disclosure provides a camera module and an electrical bracket thereof. The electrical bracket is provided with a clear aperture. The electrical bracket not only has the functions of a conventional circuit board (conduction of the electrical signal of an electronic device such as a chip and a motor), but also has the effects of a conventional base to support an optical filter and serve as a motor base bracket.

Image capturing module and electrical support thereof

A camera module includes an optical lens unit and a light sensing unit. The light sensing unit is provided along a light outgoing path of the optical lens unit so that the light sensing unit is able to sense light emitted from the optical lens unit. The light sensing unit further includes a photoelectric converting element and a conducting unit connected to the photoelectric converting element. The conducting unit transfers electrical signals converted and generated during operation of the photoelectric converting element, and conducts heat generated during operation of the photoelectric converting element outside.

Camera module with heat dissipation arrangement and manufacturing method thereof

A camera module includes an optical lens, a photosensitive sensor and an electrical support. The electrical support includes a circuit arrangement embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit arrangement, and a camera component coupled at the support body and electrically connected to the connecting member. Therefore, the electrical support not only forms a circuit board to electrically connect with the camera component but only serves as a base to support the camera component.

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Ningbo, China

Ye Wu