Miradia Inc.

Integrated Device Technology, Inc.

Moveworks, Inc.

Pixtronix, Incorporated

Ye Wang

Xiao Charles Yang

Yuxiang May Wang

Justin Allen Payne

Wook Ji

Dongmin Chen

Harmeet Bhugra

Howard Woo

William Spencer Worley, Iii

Jiang Chen

Jing Chen

Chang Liu

Seungbae Lee

Timothy J Brosnihan

Kuolung Lei

A disambiguation dialog may be generated by determining candidate responses based on an intent of a user's message. A utility value and a relevance probability may be determined for each of the candidate responses. An intermediate ranking may be computed for each of the candidate responses based on the utility value and the relevance probability. Candidate dialogs may be formed with the top candidate response, the top two candidate responses, and so on. Additional candidate dialogs may be generated by varying a presentation format of the candidate responses. Discoverability probabilities may be associated with each of the candidate responses within a candidate dialog. A joint metric for each candidate dialog may be computed as a function of the utility value, relevance probability and discoverability probability associated with each of the candidate responses included in the candidate dialog. The highest ranked candidate dialog may be selected as the disambiguation dialog.

Generic disambiguation

An automated conversation is facilitated between a user and a virtual agent. A system receives an input message from the user and analyzes an intent of the input message. Based on the intent of the input message, the system generates a plurality of bids for responding to the input message, and assigns an intent confidence score to each bid from the plurality of bids based on a confidence level of each bid from the plurality of bids. The system determines a winning bid from the plurality of bids based on the intent confidence score associated with each bid from the plurality of bids, and generates a response based on the winning bid.

Virtual conversation method or system

This disclosure provides systems, methods and apparatus incorporating display elements having light modulators that can operate in more than two states. In some implementations, the light modulator assembly includes an electrostatic actuator that includes a load electrode coupled to a shutter and a drive electrode set positioned proximate to the load electrode. The drive electrode set includes a plurality of discrete portions that are configured to drive the light modulator assembly to a plurality of different light modulator states. In some such implementations, the portions of the drive electrode set are positioned opposite to corresponding regions of the load electrode. In some implementations, the portions are arranged such that the portions are configured to electrostatically engage with adjacent regions of the load electrode.

Multi-state shutter assemblies having segmented drive electrode sets

A method for forming an optical deflection device includes providing a semiconductor substrate comprising an upper surface region and a plurality of drive devices within one or more portions of the semiconductor substrate. The upper surface region includes one or more patterned structure regions and at least one open region to expose a portion of the upper surface region to form a resulting surface region. The method also includes forming a planarizing material overlying the resulting surface region to fill the at least one open region and cause formation of an upper planarized layer using the fill material. The method further includes forming a thickness of silicon material at a temperature of less than 300&#xb0; C. to maintain a state of the planarizing material.

Fabrication of a high fill ratio silicon spatial light modulator

Methods of testing packaged thin-film piezoelectric-on-semiconductor (TPoS) microelectromechanical resonators having hermetic seals include measuring a quality factor (Q) of resonance of the packaged resonator at at least two unequal temperatures to determine whether a &#x394;Q/&#x394;T is significantly different (e.g, by at least 50%) over a temperature range (&#x394;T) spanning a smallest and largest of the at least two temperatures. These measurements are performed for a packaged resonator having a Q&#x3c;Q, where Qis the quality factor of resonance of the packaged resonator due to air damping and Qis the quality factor of resonance of the packaged resonator due to thermoelastic damping.

Methods of testing packaged thin-film piezoelectric-on-semiconductor microelectromechanical resonators having hermetic seals

A microelectromechanical resonator includes a resonator body, which is encapsulated within a sealed cavity extending between first and second substrates that are bonded together. The resonator body is anchored to the first substrate by at least a pair of tethers that suspend the resonator body opposite an underlying recess in the first substrate. A resistive heating element is provided, which is configured to indirectly heat the resonator body through convective heating of the cavity. This resistive heating element may be disposed on an inner surface of the second substrate that is exposed to the cavity. The resonator may also include first and second electrical interconnects, which extend through the second substrate and contact respective first and second portions of the resistive heating element.

Microelectromechanical resonators having resistive heating elements therein configured to provide frequency tuning through convective heating of resonator bodies

A resonator includes a CMOS substrate having a first electrode and a second electrode. The CMOS substrate is configured to provide one or more control signals to the first electrode. The resonator also includes a resonator structure including a silicon material layer. The resonator structure is coupled to the CMOS substrate and configured to resonate in response to the one or more control signals.

Method and apparatus for MEMS oscillator

A MEMS mirror for a laser printing application includes providing a CMOS substrate including a pair of electrodes, and providing a reflecting mirror moveable over the substrate and the electrodes. Voltages applied to the electrodes create an electrostatic force causing an end of the mirror to be attracted to the substrate. A precise position of the mirror can be detected and controlled by sensing a change in capacitance between the mirror ends and the underlying electrodes.

MEMS mirror system for laser printing applications

An optical deflection device for a display application includes a semiconductor substrate comprising an upper surface region defining an upper surface plane. The optical deflection device also includes one or more electrode devices provided overlying the upper surface region and a hinge device including a silicon material and coupled to the upper surface region at a predetermined height above the upper surface plane. The optical deflection device further comprises a plurality of landing pads including a silicon material and coupled to the upper surface region at the predetermined height from the upper surface plane and a mirror structure. The mirror structure includes a post portion coupled to the hinge device and a mirror plate portion coupled to the post portion.

Method and system for optical MEMS with flexible landing structures

A method of performing overlay error correction includes forming a photoresist layer over a substrate and exposing a first set of apertures to incident radiation. The method also includes determining an overlay error associated with the first set of apertures and determining an overlay correction as a function of the determined overlay error. The method further includes exposing a data area and a second set of apertures. The data area and the second set of apertures are exposed based, in part, on the determined overlay correction. Moreover, the method includes verifying the determined overlay correction.

Method and system for overlay correction during photolithography

Micro-electromechanical acoustic resonators include a substrate having a cavity therein and a resonator body suspended over the cavity. The resonator body is anchored on opposing sides thereof (by support beams) to first and second portions of the substrate. These first and second portions of the substrate, which extend over the cavity as first and second ledges, respectively, each have at least one perforation therein disposed over the cavity. These perforations may be open or filled. The first and second ledges are formed of a first material (e.g., silicon) and the first and second ledges are filled with a second material having a relatively high acoustic impedance relative to the first material. This second material may include a material selected from a group consisting of tungsten (W), copper (Cu), molybdenum (Mo).

Thin-film bulk acoustic resonators having perforated resonator body supports that enhance quality factor

Methods of forming packaged micro-electromechanical devices include forming a first substrate having a micro-electromechanical device therein, which extends adjacent a first surface of the first substrate. A first surface of a second substrate is then bonded to the first surface of the first substrate, to thereby encapsulate the micro-electromechanical device within a space provided between the first and second substrates. Subsequent to bonding, a second surface of the second substrate is selectively etched to define at least one through-substrate opening therein, which exposes an electrode of the micro-electromechanical device. Thereafter, the through-substrate opening is filled with an electrically conductive through-substrate via.

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Cupertino, CA, United States of America

Ye Wang