Hon Hai Precision Industry Co., Ltd.

Foxconn Technology Co., Ltd.

Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.

Yaxiong Wang

Chung-Yuan Huang

Shun Chi Dong

Aimin Huang

A heat dissipating device is adapted to remove heat from an electronic package. The heat dissipating device includes a heat sink () and a fan () generating airflow. The heat sink has a base () and a plurality of first fins () extending therefrom. First airflow channels () are defined between the first fins. A plurality of second fins () are transversely attached to the first fins. The second fins have second airflow channels () defined therebetween. The second airflow channels communicate with the first airflow channels.

Heat dissipating device

A heat dissipation device includes a column () for being positioned on an electronic device for dissipating heat therefrom, a plurality of fin units () attached to and stacked along the column, an H-shaped securing member () attached to the column below the fin units for securing the heat dissipation device to the electronic device, a pair of fan supports () extending from opposite sides of the securing member, and a fan () mounted on the fan supports. The fin units define a plurality of sprial air passages along an axis of the column which consist with air flow of the fan. Each of the fin units is configured by a metal disc with a plurality of sectors (&#x2033;) and channels (&#x2033;) between adjacent sectors.

Heat dissipation device for electronic device

A heat dissipating device includes a retention module () around an electronic component (), a heat sink () attached to the retention module, and a fan (). The heat sink includes a plurality of fins () and spacers () interleaved between the fins, two heat pipes () sequentially extending through lower portions of the fins, the spacers and upper portions of the fins to bond the fins and the spacers together. Each spacer includes a flat bottom face for contacting the electronic component, and an arcuate top face. The fins includes two outer fins, and a plurality of inner fins each defining a cutout () cooperatively defining a chamber between the outer fins. The chamber and the arcuate spacers facilitate cooling air from the fan to blow to opposite sides of the heat sink thereby improving heat dissipation efficiency of the heat sink.

Heat dissipating device for electronic component

A heat pipe () includes a first substrate () including a plurality of first low fins () and high fins (), and a second substrate () opposing the first substrate and including a plurality of second low fins () and high fins (). A plurality of micro grooves () is formed between adjacent fins to form liquid channels () of the heat pipe. The first and second high fins are received in corresponding micro grooves of the heat pipe and soldered to the second and first substrates, respectively.

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Austin, TX, United States of America

Yaxiong Wang