Shenzhen China Star Optoelectronics Technology Co., Ltd.

Shenzhen China Star Optoelectronics Co., Ltd

Yawei Liu

Yifan Wang

Jiajia Qian

Yuan-Chun Wu

Chihche Liu

Weijing Zeng

Yunan Zhang

Changcheng Lo

Tsungyuan Wu

Yi-Fan Wang

Qingdou Yang

Longqiang Shi

Yuanchun Wu

Hejing Zhang

Qiaosheng Liao

Taipi Wu

Tai-pi Wu

Chih-Che Liu

Kui Ni

Boyan Lv

The present invention discloses a planar glass sealing structure and a manufacturing method thereof, the planar glass sealing structure comprises, in a top-down order: a first glass substrate, an insulating layer, a metal sealing frame and a second glass substrate. The insulating layer is formed as a frame shape, and disposed on a peripheral margin of the first glass substrate; the metal sealing frame is formed by heating to melt a metal solder layer between the first and second glass substrate, and it can keep a fixed gap between the first and second glass substrate, so that an inner space thereof is kept in an excellent sealed condition. The present invention can ensure the sealing structure of two correspondingly assembled glass substrates, so that the inner space thereof is insulated from moisture and oxygen, so as to increase the performance and quality of the device.

Planar glass sealing structure and manufacturing method thereof

The present disclosure relates to a packaging assembly and a glass packing method. The method includes the following steps: coating ring-shaped glass adhesive on the glass cover; coating outer frame glue of ring-shaped at an outer side of the glass adhesive, wherein the outer frame glue is spaced apart from the glass adhesive; coating inner frame glue at an inner side of the glass adhesive; filling packing material to an inner side of the inner frame glue; bonding the glass substrate on the glass cover; and radiating the glass adhesive by laser to weld the glass substrate on the glass cover by the glass adhesive. The method prevents the oxygen and the moisture from entering the glass adhesive so as to extend the life cycle of the components within the glass adhesive.

Package assemblies and the packaging method thereof

The invention provides a groove structure for printing OLED display and manufacturing method for OLED display. By dividing the causeway surrounding the groove into a first and a second branch causeway layers provided in stack, the inclining inner peripheral surface of groove formed by first branch causeway forms a contact angle ranging 10-45&#xb0; with the HIL ink, and the inclining inner peripheral surface of groove formed by second branch causeway forms a contact angle ranging 30-60&#xb0; with the HIL ink, the inclining inner peripheral surface of groove formed by second branch causeway forms a contact angle ranging 10-45&#xb0; with HTL ink and EML ink to restrict the height of HIL climbing upwards so that the top surface of HIL is flat or has a slightly convex in the middle to prevent current leakage at the edge of HIL, and improve the OLED display quality.

Groove structure for printing OLED display and manufacturing method for OLED display

Disclosed is an organic light-emitting diode structure which includes a substrate, an optically-modified layer, a planarization layer, a pixel definition layer, and an organic light-emitting layer. The optically-modified layer can improve non-uniform luminance of OLEDs manufactured based on the ink-jet printing technology.

Organic light-emitting diode structure

Provided is a multilayer-structured organic electroluminescent diode, and a method of manufacturing a hole transporting layer thereof. The hole transporting layer included in the organic electroluminescent diode is a thin film formed through electrochemical polymerization. The method of manufacturing the hole transporting layer includes the steps of: preparing an electrolyte; electro-polymerizing the electrolyte; controlling thickness of an electropolymerized film; and washing and drying the electropolymerized film as obtained. Specific electropolymerization parameters are set to finely regulate a crosslinking degree and reactivity of the electropolymerized film, thereby solving a prior-art problem that the crosslinking degree and reactivity of a polymer or small molecule hole transporting material in a film state cannot be effectively controlled.

Organic electroluminescent diode and method for manufacturing hole transporting layer thereof

The disclosure provides an organic electroluminescent display device, including a substrate, an organic electroluminescent device disposed on the substrate, and a thin film packaging structure disposed on the substrate and packaging the organic electroluminescent device. The thin film packaging structure has desiccant particles. The disclosure further provides a manufacturing method of the organic electroluminescent display device, which can reduce the influence of vapor attached on surfaces of multiple layers of packaging thin films or infiltrated in the multiple layers of packaging thin films on the packaged organic electroluminescent device, so as to prolong the service life of the organic electroluminescent device.

Organic electroluminescent display device and manufacturing method thereof

Disclosed are a manufacture method of quantum dots printing ink and manufactured quantum dots printing ink manufactured with the manufacture method. In the manufacture method, by mixing the first solvent and the second solvent, the viscosity of the quantum dots printing ink is adjusted to be in a predetermined range. Then, by mixing the third solvent with the first and second solvent, the surface tension thereof is adjusted to be in a predetermined range while maintaining the viscosity to be in the predetermined range. Furthermore, by adding the fourth solvent in the quantum dots printing ink, the vapor pressure is adjusted to be in a reasonable range. With mixture of kinds of solvents, the quantum dots printing ink of which the performance indicators, the viscosity, the surface tension, the dry condition are suitable for jet ink printing can be formulated to avoid adding the surfactant in the ink.

Manufacture method of quantum dots printing ink and quantum dots printing ink manufactured with the manufacture method

The present invention provides a package method of a substrate. By forming a plurality of support parts which are separately located at the border position of the package cover plate, the gap of the package cover plate and the substrate is limited after para bonding the package cover plate and the substrate. Thus, the seal height of the seal which does not contain the spacers can be ensured, and under circumstance of certain seal coating volume, the seal width of the seal also can be ensured. Furthermore, by cutting off the plurality of support parts, and border parts of the substrate and the package cover plate contacting with the support parts, the substrate packaged with the seal which does not contain the spacers can be obtained, and it is ensured that the seal has the consistent height and width.

Package method of substrate

The present invention provides an OLED color display device, comprising a substrate (), an anode (), a thin film transistor array (), a Hole Injection Layer (), a Hole Transport Layer (), a light emitting layer (), an Electron Transport Layer (), a cathode (), a package cover plate (), a color conversion layer () and a seal frame (); the light emitting layer () comprises a first light emitting layer () and the second light emitting layer (), and both the first light emitting layer () and the second light emitting layer () are manufactured by host material doped with guest material, and the guest material comprises luminescent material and electron transport material; the first light emitting layer () is a blue light emitting layer, and the second light emitting layer () is a red, green lights commonly emitting layer, a yellow light emitting layer or a green light emitting layer; lights emitted by the first light emitting layer () and the second light emitting layer () synthesize white light or blue, green light possessing higher energy efficiency and luminescence efficiency. The power consumption is low.

OLED color display device

The present invention provides a color display device, including a substrate, an anode formed on the substrate, a TFT array formed on the anode, a hole injection layer formed on the TFT array, a hole transporting layer formed on the hole injection layer, a white light emission layer formed on the hole transporting layer, an electron transporting layer formed on the white light emission layer, a cathode formed on the electron transporting layer, a cover plate disposed above the cathode and bonded to the substrate, a color change layer formed on an inside surface of the cover plate, and a sealing enclosure resin bonding the substrate and the cover plate together, wherein the color change layer includes a blue sub-pixel zone, a green sub-pixel zone, a red sub-pixel zone, and a white sub-pixel zone that are spaced from each other, the blue sub-pixel zone including a blue light filter layer formed therein, the green sub-pixel zone including a green light filter layer or a green light change layer formed therein, the red sub-pixel zone including a red light filter layer or a red light change layer formed therein, the white sub-pixel zone comprising no filter layer formed therein.

Color display device

The present invention provides a glass packaging structure, comprising an active glass substrate and a packaging glass substrate. An active area is formed upon the active glass substrate. Glass packaging lines are formed on a surface of the packaging glass substrate and the glass packaging lines protruding from the packaging glass substrate. The packaging glass substrate entirely overlapping upon the active glass substrate and then the glass packaging lines are irradiated by a laser to couple the packaging glass substrate and the active glass substrate.

Glass packaging structure and glass packaging method of utilizing the same

The invention provides a recess structure for print deposition process and manufacturing method thereof. By disposing the dam () enclosing the recess () as comprising at least two stacked branch dam layers, and increasing the contact angle between the inclined inner circumferential surface of recess () enclosed by the branch dam layers and ink in a layer-by-layer manner, to limit height the ink able to climb on the inclined inner circumferential surface of the recess (), the invention can improve the thickness uniformity of the organic functional layers printed in the recess and the photoelectric properties of organic functional layers. The recess () fabricated by the manufacturing method can limit height the ink able to climb on inclined inner circumferential surface of the recess () to improve the thickness uniformity of the organic functional layers printed in the recess and the photoelectric properties of organic functional layers.

Recess structure for print deposition process and manufacturing method thereof

The present invention provides an OLED material vacuum thermal evaporating mask plate, comprising a mask frame (), a quickset () fixed on the mask frame () and a mask () fixed on the quickset (); the mask frame () comprises four edges, and the four edges surround to form an opening corresponding to the mask (); each edge of the mask frame () comprises a groove () dented at the upper surface; the quickset () is fixed in the groove (); the mask () is fixed on the quickset () by point weld, and welding points () are on the quickset (). When the mask deforms and the replacement is necessary, only the quickset is extracted for polishing or is replaced. The mask frame can be repeatedly used to diminish the waste amount and to raise the availability of the mask frame. Meanwhile, the spare amount of the mask frame can be reduced to save material and production cost.

OLED material vacuum thermal evaporating mask plate

The present invention provides a 2D/3D switchable display device, comprising a backlight module () and a liquid crystal panel () located on the backlight module (); the liquid crystal panel () comprises a plurality of element images () sequentially aligned, and the backlight module () comprises a plurality of light-emitting elements () corresponding to the plurality of element images (), and each light-emitting element () comprises a middle region () in a middle position and a surrounding region () at periphery of the middle region (), and the middle regions () of the plurality of light-emitting elements () respectively correspond to the plurality of element images (), and the middle region () and the surrounding region () are respectively controlled by different circuits to be lightened or dimmed; as the middle region () and the surrounding region () are lightened at the same time, the display device shows a 2D display mode, and as the middle region () is lightened and the surrounding region () is dimmed, the display device shows a 3D display mode of two dimensional integral imaging to achieve a switch of 2D/3D display modes.

2D/3D switchable display device

The present invention discloses a method for packaging an organic light emitting diode: allocating a position for attaching a glass cloth tape on the packaging substrate; attaching the glass cloth tape on the position; bonding an organic light emitting diode substrate to the packaging substrate; melting the glass cloth tape, so that the organic light emitting diode substrate welds together with the packaging substrate. The present invention can avoid the presence of a welding gap, so that external gas cannot enter into an internal part of the packaging body, thereby increasing the service life of the OLED device.

Growing community of inventors

Guangdong, China

Yawei Liu