International Business Machines Corporation

Yat-Kiu-Kent Fung

James Robert Rozen

Danielle DeGraw

A structure, such as a cable assembly, is provided that has a Nb/Ti substrate and a metal layer electroplated on a portion of the Nb/Ti substrate, wherein the metal layer has a metal capable of being soldered to, such as copper, and a metal coaxial connector soldered to the metal layer.

Electroplating of niobium titanium

The subject disclosure relates to electroplating niobium titanium (Nb/Ti) with a metal capable of being soldered to. According to an embodiment, a structure is provided that comprises a Nb/Ti substrate and a metal layer plated on a portion of the Nb/Ti substrate. The metal layer comprises an electroplated metal layer plated on the portion of the Nb/Ti substrate using electroplating. The metal layer can comprise a metal capable of being soldered to, such as copper. In another embodiment, a cable assembly is provided that comprises a niobium titanium wire, a metal layer plated on a first portion of the niobium titanium wire, and a metal coaxial connector soldered to the metal layer.

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Woodside, NY, United States of America

Yat-Kiu-Kent Fung