Sumitomo Electric Industries, Limited

Sumitomo Electric Device Innovations, Inc.

Mitsubishi Chemical Coporation

Yasuyuki Yamauchi

Kazuhiro Yamaji

Yasushi Fujimura

Toru Watanabe

Tomoya Saeki

Munetaka Kurokawa

Tsutomu Abe

Keiji Tanaka

Taizo Tatsumi

Naoya Kono

Chie Fukuda

Naoki Itabashi

Itaru Sawaki

Tatsuya Ihara

Morihiro Seki

Yoshihiro Tateiwa

Yoshiaki Iizuka

Mamoru Sawano

A method of manufacturing an electronic component having an electrode at an end portion thereof is disclosed. The method includes placing a jig on a heater block, wherein the jig includes a path inclined with respect to a pedestal including a placement surface and extending toward the pedestal; placing an electronic component main body having the electrode on the placement surface with the electrode facing the path; rolling a ball-shaped solder in the path to reach the electrode; and melting the solder through the pedestal to attach the molten solder to the electrode.

Method of manufacturing electronic component and method of manufacturing semiconductor device

A semiconductor module is disclosed. The semiconductor module includes a housing that encloses on a bottom thereof a spacer and a wiring substrate that mounts a semiconductor element thereon. The housing includes a feedthrough that secures one end of a transmission substrate. The other end of the transmission substrate faces the wiring substrate and the spacer. The other end of the transmission substrate provides a lower end and an upper end that form an extension protruding toward the wiring substrate. The upper end is set so close to the wiring substrate but the lower end forms a space for receiving a surplus adhesive oozing between the spacer and the wiring substrate.

Semiconductor module

An optical module and a method of assembling the optical module are disclosed. The optical module comprises a laser unit, a modulator unit, and a detector unit mounted on respective thermo-electric coolers (TECs). The modulator unit, which is arranged on an optical axis of the first output port from which a modulated beam is output, modulates the continuous wave (CW) beam output from the laser unit. On the other hand, the laser unit and the detector unit are arranged on another optical axis of the second output port from which another CW beam is output. The method of assembling the optical module first aligns one of the first combination of the laser unit and the modulator unit with the first output port and the second combination of the laser unit and the detector unit, and then aligns another of the first combination and the second combination.

Optical module implementing with optical source, optical modulator, and wavelength detector, and a method to assemble the same

An optical receptacle and an optical module that implements the optical receptacle are disclosed. The optical receptacle provides a stub holding a coupling fiber in a center thereof, a bush press-fitting the stub therein, a sleeve, and a metal cover that is to be welded to an external metallic member. The coupling fiber has a type of polarization maintaining fiber. The bush is inserted into the cover as leaving a gap between the cover and the bush. The gap between the cover and the bush effectively relaxes or absorbs stresses induced during the welding caused in the coupling fiber.

Optical receptacle relaxing mechanical stress induced by welding and optical module implementing the same

An optical module providing a semiconductor optical amplifier (SOA), and a process to assembly the optical module are disclosed. The optical module provides front and rear coupling units each optically coupled with the SOA and fixed to the housing enclosing the SOA. The housing has a slim wall fixing a lens holder soldered to the slim wall. The front and/or rear coupling unit is fixed to the lens holder by YAG laser welding after the active alignment by using a spontaneous emission of the SOA, and amplified emission of externally provided test beam.

Optical module installing a semiconductor optical amplifier

Optical module installing a semiconductor optical amplifier and process of assembling the same

An optical module that processes an input optical signal and outputs a processed optical signal is disclosed. The optical module provides a housing and an optical processing device in the housing. The housing provides an optical input port and an optical output port in a first wall thereof in side-by-side arrangement. A third wall of the housing only provides RF terminals. Second and fourth walls of the housing provide DC terminals. Electrical connection between the DC terminals with DC pads on the device is realized through a wiring substrate whose top avoids an optical path from the optical input port to the input port of the device.

Optical module including semiconductor optical modulator

A transmitter optical module for emitting a polarization polarized combined beam is disclosed. The transmitter optical module includes optical sources each emitting optical beams with substantially the same polarizations, an optical isolator, and a polarization beam combiner. The optical isolator, by receiving the optical beams, outputs the optical beams with polarizations perpendicular to each other to the polarization beam combiner.

Optical module outputting polarization combined optical beam

A semiconductor optical modulator includes optical input and output portions; a plurality of Mach-Zehnder modulators, each including first and second waveguide arms having first and second modulation electrodes, respectively; an optical demultiplexer coupled between the optical input portion and the Mach-Zehnder modulators through an optical waveguide; an optical multiplexer coupled between the optical output portion and the Mach-Zehnder modulators; a plurality of electrical inputs; and a plurality of differential transmission lines electrically connecting the electrical inputs to the Mach-Zehnder modulators. The first modulation electrode and the second modulation electrode of at least one of the Mach-Zehnder modulators, one of the electrical inputs, and one of the differential transmission lines that connects such one electrical input to such one Mach-Zehnder modulator form an electrical circuit having a differential impedance in a range of 80&#x3a9; to 95&#x3a9;.

Optical modulator module and semiconductor optical modulator

An optical assembly (OSA) that installs a semiconductor optical device mounted on a thermo-electric controller (TEC) is disclosed. The TEC in the upper plate thereof is mechanically connected to the housing, or to the block stiffly fixed to the housing by a bridge made of stiff material. The bridge preferably extends along the optical axis to show enhanced durability against the impact caused by an external ferrule abutting against the receptacle of the OSA.

Optical module with enhanced robustness of temperature controlling device

An optical semiconductor device includes: a beam splitter that splits an input optical axis into a first split axis having a first split angle and a second split axis having a second split angle larger than the first split angle; a first unit that is located on the first split axis of the beam splitter and has one or more optical components, an interval between a more distant end of the first unit and the beam splitter having a first length; a second unit that is located on the second split axis of the beam splitter and has one or more optical components, an interval between a more distant end of the second unit and the beam splitter having a second length larger than the first length; and an optical semiconductor element that has a first outputting end having a first output axis coupled optically to the input optical axis of the beam splitter, a second outputting end having a second output axis, and optical gain, the optical semiconductor element being inclined so that the second output axis is arranged away to a side of the second split axis from the first output axis.

Growing community of inventors

Yokohama, Japan

Yasuyuki Yamauchi