Tokuyama Corporation

Yasuyuki Yamamoto

Masakatsu Maeda

Yukihiro Kanechika

Naoto Takahashi

Masataka Himeno

Osamu Yatabe

Ken Sugawara

Emi Ushioda

Yoshitaka Inaki

Yasushi Imoto

Kunihiro Gotoh

Hideki Satou

Kouichi Yamamoto

To produce aluminum nitride in the form of a lump that can easily be broken down by light pulverization, which could not be obtained by a conventional combustion synthesis method. A method for producing aluminum nitride powder by a combustion synthesis method using a metallic aluminum powder, characterized in that a powder mixture in which an aluminum nitride powder having an average primary particle diameter of 3 μm or less as a diluent is mixed with a metallic aluminum powder in a ratio of 150 to 400 parts by mass of the aluminum nitride powder relative to 100 parts by mass of the metallic aluminum powder, is ignited to combust in a nitrogen atmosphere.

Method for producing aluminum nitride powder, aluminum nitride powder, and package

An aluminum nitride powder containing a very small amount of coarse particles. An aluminum nitride powder which provides a resin composition having high affinity for resins and high moisture resistance. The aluminum nitride powder has a volume average particle diameter D50 of 0.5 to 7.0 &#x3bc;m in particle size distribution measured with a laser diffraction scattering particle size distribution meter, a D90/D50 ratio of 1.3 to 3.5 and a BET specific surface area of 0.4 to 6.0 m/g and classified by removing coarse particles whose particle diameter is more than 5 times as large as D90. When resin paste obtained from this aluminum nitride powder and a resin is measured with a grind gauge, the upper limit particle diameter at which a streak is produced is not more than 5 times as large as D90. Since the classified aluminum nitride powder is surface modified, the aluminum nitride powder which has high filling property in a resin and is excellent in the moisture resistance and insulating property of a resin composition is obtained.

Aluminum nitride powder containing no coarse particles

The present invention provides: a method for manufacturing a metallized substrate by which a fine pattern can be formed more easily; a metallized substrate manufactured by the method; and a metal paste composition to be used in the method. The metallized substrate has: a sintered nitride ceramic substrate (); a titanium nitride layer () on the sintered substrate (); an adhesion layer () on the titanium nitride layer (); and a copper plating layer () on or above the adhesion layer (), wherein the adhesion layer () contains copper and titanium, and has a thickness of no less than 0.1 &#x3bc;m and no more than 5 &#x3bc;m.

Metallized substrate, metal paste composition, and method for manufacturing metallized substrate

The present invention provides a metallized via-holed ceramic substrate having (1) a sintered ceramic substrate, (2) an electroconductive via formed in the sintered ceramic substrate, having an electroconductive metal closely filled in a through-hole of the sintered ceramic substrate, wherein the electroconductive metal contains a metal (A) with melting point of 600&#xb0; C. to 1100&#xb0; C., a metal (B) with higher melting point than the metal (A), and an active metal, (3) a wiring pattern on at least one face of the sintered ceramics substrate, having an electroconductive surface layer and a plating layer thereon, wherein the electroconductive surface layer consists of an electroconductive metal containing the metal (A), the metal (B), and an active metal, (4) an active layer formed in the interface between the electroconductive via and the sintered ceramic substrate, and (5) an active layer formed in the interface between the electroconductive surface layer and the sintered ceramic substrate.

Metallized via-holed ceramic substrate, and method for manufacture thereof

A via-holed ceramic substrate can be manufactured in a simple method by providing a via-holed ceramic substrate comprising: a sintered ceramic substrate; an electroconductive via formed in the sintered ceramic substrate, the electroconductive via having an electroconductive metal closely filled in a through-hole, the electroconductive metal containing a metal (A) having a melting point of 600&#xb0; C. to 1100&#xb0; C., a metal (B) having a melting point higher than the melting point of the metal (A), and an active metal; and an active layer formed in the interface between the electroconductive via and the sintered ceramic substrate.

Via-holed ceramic substrate, metallized via-holed ceramic substrate, and method for manufacturing the same

A metallized ceramics substrate including: a ceramics body; a wiring pattern formed on one surface of the ceramics body; and a lead electrically-connected to the wiring pattern. The ceramics body has a through-hole, the lead penetrates the through-hole and sticks out from another surface of the ceramics body, and the lead is fixed by filling an electroconductive filler between the lead and the through-hole for keeping airtightness. The metallized ceramics substrate does not cause a problem of interlayer peeling and is excellent in airtightness and electric conductivity.

Lead-embedded metallized ceramics substrate and package

A method for manufacturing a ceramic substrate having a via hole(s) and a surface wiring pattern electrically connected to the via hole(s). The method includes: preparing a sintered ceramic substrate having a via hole(s); forming over the sintered ceramic substrate a sintered ceramic layer having a hole(s) or opening(s) whose bottom is configured to be at least a part of an exposed end surface of the via hole(s) by post-firing method; forming inside the hole(s) or opening(s) a conductive portion which electrically connects the surface of the sintered ceramic layer and the via hole(s); and forming over the surface of the sintered ceramic layer a surface wiring pattern electrically connected to the conductive portion.

Ceramic substrate manufacturing method and ceramic substrate

A fabrication method for metallized a ceramics substrate including the steps of: forming a first conductive paste layer containing metallic powder on a sintered ceramics substrate; forming a second conductive paste layer containing metallic powder of which average particle diameter is different from that of metallic powder constituting the first conductive paste layer; and forming a first conductive layer and a second conductive paste layer. The surface roughness of the first conductive layer and the second conductive layer is different. By this method, it is possible to secure airtightness of the metallized ceramics substrate even if it is a multilayered substrate having a plurality of metallized layers.

Method for fabricating metallized ceramics substrate, metallized ceramics substrate fabricated by the method, and package

A metallized aluminum substrate for mounting a semiconductor device such as LD or LED is provided and a metallized aluminum nitride substrate having excellent dimensional accuracy and high bonding strength of a wiring pattern. An intermediate material substrate is provided, comprising a sintered aluminum nitride substrate having on its surface a wiring pattern constituted of a conductor layer composed of a composition containing at least high-melting point metal powder, aluminum nitride powder and a sintering auxiliary agent for aluminum nitride is prepared. Then, the intermediate material substrate is fired while the sintered aluminum nitride obtained by sintering using a sintering auxiliary agent of the same kind as that of the sintering auxiliary agent contained in the composition is placed so as to be brought into contact with the conductor layer on the surface of the intermediate material substrate or so as to be present in the vicinity of the conductor layer.

Process for producing metallized aluminum nitride substrate

An insulating material high both in thermal conductivity and light reflectance, and a submount high in heat radiatability for mounting an LED element thereon, capable of raising a light utilization factor and quickly radiating heat generated from the element. For example, used as a substrate material of a submount is a nitride sintered body having a reflectance of light in the wavelength region of from 350 nm to 800 nm of 50% or more and a reflectance of light with a wavelength of 700 nm of 60% or more, obtained by sintering a preform consisting of a composition containing 100 parts by mass of aluminum nitride powder and 0.5 to 10 parts by mass of a compound containing an alkaline earth metal such as 3CaO&#xd7;Al2O3 in an inert atmosphere containing a specific quantity of carbon vapor, or by burning a coat of a nitride paste applied on a base substrate having a heat resistance at a predetermined temperature.

Nitride sintered body and method for manufacturing thereof

An element-mounting substrate includes a ceramic substrate, an electrode layer formed on the substrate and a ceramic coating layer which is formed on a part of the electrode layer and has a thickness of 5 to 50 &#x3bc;m. A process for producing the element-mounting substrate includes the steps of forming an electrode precursor layer in the shape of a pattern of an electrode layer on a ceramic plate or a green sheet of a large diameter, forming a ceramic coating precursor layer on a part of the electrode precursor layer and then firing the resulting precursor. In this process, it is preferable to form the ceramic coating layer so as to cover the electrode layer on a predetermined cutting line of the firing product. According to the element-mounting substrate in which a part of the electrode layer is covered with a ceramic, a failure in mounting an element attributable to the thickness of the ceramic coating layer can be prevented when the element is mounted. In addition, peeling or cracking of the electrode layer caused by impact during dicing can be prevented.

Element mounting substrate and method for manufacturing same

A ceramic substrate for mounting a light emitting element. The ceramic substrate has a placement surface for placing a light emitting element having an electrode; and an electrode electrically-connected with the electrode of the light emitting element, wherein the ceramic substrate comprises a substrate body consisting of a nitride ceramics; and a coat layer coating at least a part of a surface of the substrate body and consisting of a ceramics different from the nitride ceramics forming the substrate body; and the coat layer has an optical reflectance of 50% or more for any light having a wavelength of from 300 to 800 nm, which can increase a luminance of the light emitting element by reflecting the light emitted from the element efficiently with certainty, and which has a high heat radiation property; and a manufacturing method therefor.

Ceramic substrate for mounting a light emitting element and method for manufacturing the same

A light-emitting element storing package which ensures the efficient reflection of light emitted by a light-emitting element by a reflector frame and thereby improves the brightness of the emitted light, and a method of manufacturing the same are provided. In a light-emitting element storing package includes: an insulating substrate consisting of a ceramic board, a reflector frame composed of a ceramic material, joined to the upper surface of the substrate along its outer edge and having an inner wall surface defining a light-reflecting surface, and a wiring pattern layer formed on the upper surface of the substrate for connection with a light-emitting element, a light-emitting element storing concave portion, which is defined by the substrate and the reflector frame, and in which the light-emitting element is mounted on the wiring pattern layer, the reflector frame is mainly composed of nitride ceramics and its light-reflecting surface is composed of white ceramics.

Package for storing light emitting element and method for producing package for storing light emitting element

A package for housing a light-emitting element wherein a via hole for wiring provided so as to pass through an insulating substrate is arranged in such a manner that it is positioned under a reflector frame; a method for manufacturing the above package for housing a light-emitting element which comprises the steps of separately providing a green sheet for the substrate and a green sheet for the frame, causing a paste containing a ceramic powder to be present between the two green sheets to bind them, and subjecting them to degreasing and sintering, to thereby integrate them.

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Yamaguchi, Japan

Yasuyuki Yamamoto