Denso Ten Limited

Fujitsu Ten Limited

Senju System Technology Co., Ltd.

Yasuyuki Watanabe

Hisaki Hayashi

Noboru Hashimoto

Toshiyuki Tanaka

Yoshiyuki Andoh

Katsuhiro Yoshimura

Kotaro Hosogi

Nobuhisa Katada

Shigeki Fukaya

Yasuo Nishioka

An application device according to an embodiment includes a liquid nozzle part, an air nozzle part, and an ejection controlling unit. The liquid nozzle part ejects liquid to be applied to an electronic component mounted on a substrate. The air nozzle part ejects air toward the substrate. The air nozzle is concentrically arranged with respect to the liquid nozzle part. The ejection controlling unit ejects the air from the air nozzle part at a timing in synchronization with an ejection timing of the liquid to be applied by the liquid nozzle part.

Application device and application method

A soldering device according to an embodiment includes a jet nozzle and a cover. The jet nozzle jets a molten solder. The cover is filled with an inert gas in an inside thereof and has a hole part at a position that corresponds to the jet nozzle. The cover causes the jet nozzle to protrude from the hole part for an application time period when the solder is applied to an application target and houses the jet nozzle in the inside thereof for a waiting time period other than the application time period.

Soldering device and control method for soldering device

A printed wiring board according to an embodiment includes a wiring board body, a first connection part and a second connection part. In the first connection part, a heat-receiving front surface is a first land formed on a front surface of the wiring board body. A heat-receiving back surface is formed on a back surface of the wiring board body. A main-heat conducting part is a through-hole that inter-connects the heat-receiving front surface and the heat-receiving back surface. In the second connection part, a second land is formed on the front surface of the wiring board body. The second land is not connected to any conductor pattern formed on the back surface of the wiring board body.

Printed wiring board

There is provided a flux applying method using a flux applying apparatus configured to jet and apply a flux to a target. The flux is supplied to a nozzle of the flux applying apparatus. A gas is applied to a foaming pipe with a porous filter included in the nozzle. The gas is jetted from the porous filter of the foaming pipe to the flux supplied to the nozzle, thereby jetting foamed flux to the target.

Flux applying method and flux applying apparatus

Growing community of inventors

Kobe, Japan

Yasuyuki Watanabe