Hitachi Chemical Company, Ltd.

Yasuyuki Seki

Tomohisa Ohta

Akihiko Dobashi

Hisashige Kanbara

Hiroyuki Hagiwara

A radiation curable pressure sensitive adhesive composition comprising:

Radiation curable pressure sensitive adhesive composition

A radiation curable pressure-sensitive adhesive composition comprising a liquid oligomer having one or more acrylic double bonds in its molecule, a chain transfer agent and an aliphatic polar monomer having a carboxyl group can give an adhesive tape excellent in rubber-like properties, high in cohesive force and good in adhesiveness at low temperatures.

Radiation curable pressure-sensitive adhesive composition

A radiation curable adhesive composition comprising a liquid oligomer, a chain transfer agent, and an N-methyl compound can give a surface protective film which is slightly influenced in adhesive strength with the lapse of time, and excellent in weather resistance and heat resistance.

Radiation curable adhesive composition for surface protective film

A radiation curable pressure-sensitive adhesive composition comprising 100 parts by weight of a liquid oligomer having one or more acrylic unsaturated double bonds in its molecule, 0.2 to 20 parts by weight of a thiol compound and 0.5 to 30 parts by weight of acrylic monomer has high cohesion and is excellent in adhesiveness.

In a process for producing a radiation curable pressure sensitive adhesive tape, when a quaternary ammonium salt is coated on a substrate as an undercoating before the coating of an adhesive composition comprising a liquid oligomer and a thiol compound, the resulting adhesive tape has good adhesive strength and higher cohesion with no unpleasant odor of the thiol compound.

Growing community of inventors

Hitachi, Japan

Yasuyuki Seki