Mitsubishi Materials Corporation

Yasuyuki Ogata

Hiroshi Tanaka

Tatsunori Kobayashi

Kanji Hosoki

Yasushi Kojima

Seiji Yamanaka

Yoshimasa Hayashi

Eturo Morita

Seiji Harada

Kohji Shirota

A polishing apparatus has a plurality of polishing stations for polishing materials to be polished and a plurality of cleaning stations for cleaning the materials being polished, the polishing stations and the cleaning stations being alternately arranged; and an arm for holding the materials being polished and transferring the materials being polished between the polishing stations and the cleaning stations successively. The arm includes a polishing head for holding the material being polished. Each of the cleaning stations comprises a retainer stand on which the material being polished is placed, and a cleaning device for cleaning the material being polished in a state held by the polishing head, cleaning the material being polished in a state placed on the retainer stand, and cleaning the polishing head in a state where the material being polished is separated from the polishing head. A polishing method is used in a polishing apparatus having a plurality of polishing stations for polishing materials to be polished and an arm for holding the materials being polished and transferring the materials being polished between the polishing stations successively, each of the polishing stations including a platen having a polishing pad affixed to a surface of the platen, the arm including a plurality of polishing heads, each of which holds the material being polished and brings one surface of the material being polished into contact with the polishing pad, the material to be polished being polished by the polishing pad with relative movement between the polishing head and the platen. The polishing method comprises the steps of fitting a spindle for supporting the polishing head in a horizontally rotatable manner into each of fitting portions formed in each of a plurality of spindle housings provided in the arm; rotating the material being polished and the polishing pad relatively while keeping the material being polished and the polishing pad contacted with each other; and adjusting an axial position of the polishing head and changing a position of the polishing head relative to the arm by an adjusting mechanism provided on the spindle, whereby the materials to be polished are each polished while being adjusted in position thereof

Polishing apparatus, polishing method and method of conditioning polishing pad

A composite ceramic material which is available by sintering a mixed powder of a dielectric material and a magnetic material, and contains a third component serving to inhibit a chemical reaction between the dielectric material and the magnetic material during sintering of the mixed powder and reduce the sintering temperature, and particularly, an EMI filter, a composite LC pan and a composite LC chip part made from such a composite ceramic material. The starting end and the terminal end of the inductor are exposed on the both end faces of the bare chip, and signal electrodes are provided at these ends. Ends of the conductors for grounding are exposed on the other both ends of the bare chip, and grounding electrodes are provided at these ends. The conductors for inductor are spirally connected in succession in the thickness direction of the bare chip via throughholes provided in the sheets within the bare chip to form an inductor. The conductors for grounding are adjacent to, and spaced apart by a distance sufficient for insulation from the conductors for inductor in a plane within the bare chip and piled up alternately with the conductors for inductor to form capacitors each between a conductor for grounding and a conductor for the inductor.

EMI filter with a ceramic material having a chemical reaction inhibiting

A manufacturing method for ceramic microspheres including the steps of; mixing an oil which is immiscible with an aqueous solution of a water-soluble metallic compound and which has a boiling point higher than that of water in the aqueous solution; applying ultrasonic vibration to the mixed solution to form a water-in-oil type emulsion; heating the emulsion at a temperature less than a boiling point of water to evaporate free water from droplets in which the water-soluble metallic compound is dissolved and to disperse spherical particles of the water-soluble metallic compound in the oil phase; and thereafter heating the dispersed solution at a temperature higher than the temperature at which the water-soluble metallic compound is decomposed to form a metallic oxide but lower than the temperature at which grain growth in the metallic oxide starts, to evaporate and decompose the oil and to remove the oil therefrom, thereby obtaining the metallic oxide microspheres.

Method of preparing ceramic microspheres

Growing community of inventors

Omiya, Japan

Yasuyuki Ogata