Shell Oil Comapny

Japan Epoxy Resins Co., Ltd.

Resolution Performance Products LLC

Yasuyuki Murata

Yoshinori Nakanishi

Atsuhito Hayakawa

Norio Tohriiwa

Akihiro Itou

Isako Konishi

Ryohei Tanaka

Mitsukazu Ochi

Tetsuro Imura

Ken Tanaka

Kiyotaka Ikebata

Masayuki Tsutsumi

A production method of granular epoxy resin includes an epoxy resin preparing step of preparing an epoxy resin which is solid at ordinary temperature by reaction between a phenol compound and epihalohydrin; a purifying processing step of refining the prepared epoxy resin which is solid at ordinary temperature so that the total content of compounds having a molecular weight of 200 or less is 0.28% by mass or less of the entire epoxy resin; and a pulverizing step of pulverizing the refined epoxy resin obtained by the purifying processing step under conditions so as not to make the total content of compounds having a molecular weight of 200 or less exceeding 0.3% by mass, wherein the epoxy resin which is solid at ordinary temperature prepared by the epoxy resin preparing step is mainly composed of at least one selected from oligomers represented by the following general formula (1) and oligomers represented by the following general formula (2). 

Producing granular epoxy resin by refining and pulverizing solid epoxy resin

A granular epoxy resin is made by pulverizing an epoxy resin which is solid at ordinary temperature and can exhibit excellent fluidity during molding because of its low melt viscosity in which the total content of components having a molecular weight of 500 or less among components of n=0 in the following general formula (1) and/or components of n=0 in the following general formula (2) is 50% by mass or more of the entire epoxy resin, or, the total content of components having a molecular weight 400 or less among components of n=0 in the following general formula (1) and/or components of n=0 in the following general formula (2) is 20% by mass or more of the entire epoxy resin. The content of low molecular weight compounds having a molecular weight 200 or less in the granular epoxy resin is 0.3% by mass or less. The granular epoxy resin allows easy handling because it hardly causes blocking during storage and transportation 

Granular epoxy resin, production method thereof, and granular epoxy resin package

A curing agent for epoxy resins, comprising (a) 30 to 99 parts by weight of (i) a modified phenol resin, which is obtained by polycondensation of a heavy oil or pitch, a phenol and an aldehyde compound in the present of an acid catalyst, and/or of (ii) a a phenol resin having a hydrocarbon group with small polarity between phenol nuclei represented by the following general formula (I): wherein R's may be the same or different from each other and each represent an alkyl group having 1 to 10 carbon atoms, substituted or nonsubstituted phenyl group, substituted or nonsubstituted aralkyl group or alkoxy group; Z's may be the same or different from each other and each represent a divalent hydrocarbon group having 1 to 20 carbon atoms to which a nitrogen atom, oxygen atom, phosphorus atom or sulfur atom may be bonded, at least one Z in one molecule is a divalent hydrocarbon group having 5 to 20 carbon atoms to which a nitrogen atom, oxygen atom, phosphorus atom or sulfur atom may be bonded; n is a number of 0 to 8 as an average value; and p's may be the same or different from each other and each represent an integer of 0 to 3, (b) 1 to 70 parts by weight of a thiodiphenol compound represented by the following general formula (II): wherein R's may be the same or different from each other and each represent an alkyl group having 1 to 12 carbon atoms, substituted or nonsubstituted phenyl group, substituted or nonsubstituted aralkyl group or alkoxy group, and p's may be the same or different from each other and each represent an integer of 0 to 3, and (c) 0 to 100 parts by weight of a polyhydric phenol compound having a structure other than the components (a) and (b), and epoxy resin composition comprising them, in particular to be used for semiconductor encapsulation

Curing agent for epoxy resins and epoxy resin composition

Epoxy resin composition and process for producing the same

A crystallized epoxy resin which is easy to blend with a hardener or the like is a crystallized product of an epoxy resin derived from 4,4&prime;-dihydroxy-3,3&prime;,5,5&prime;-tetramethylbiphenyl and an epihalohydrin, and the ratio of an endotherm between 50&deg; C. and 130&deg; C. to an endotherm between 80&deg; C. and 125&deg; C., measured by raising the temperature at a rate of 10&deg; C. per minute using a DSC device, is 1.03 or more.

Crystallized epoxy resins, their production method, and curable compositions comprising them

Epoxy resin composition for semiconductor encapsulation

An epoxy resin composition which can be crushed at an ordinary temperature and which comprises respective components described below,

Epoxy resin composition and epoxy resin composition for encapsulating

The present invention provides an epoxy resin composition which can provide a cured composite product having a high heat resistance, and an excellent mechanical strength at a high temperature. The present invention provides an epoxy resin composition comprising, as essential components: (a) an epoxy resin; (b) a curing agent for epoxy resins, (c) a silane compound having at least one epoxy group or a group being capable of reacting by addition to an epoxy group in a molecule, and at least two alkoxy groups connected to silicone atom in a molecule, and (d) a catalyst for condensation polymerization of a silane compound, and a cured composite product obtained by curing the composition.

Epoxy resin composition and cured composite product

The process for producing a modified epoxy resin comprises reacting (a) an epoxy resin having at least two epoxy groups per one molecule, and (b) a specific active ester group-containing compound having at least two aromatic ring-bonded active ester groups per one molecule, in proportions such that the amount of the active ester groups in the active ester group-containing compound is from about 0.05 to about 0.95 mol per mole of the epoxy group in the epoxy resin, and the modified epoxy obtained by this process, and a composition of the epoxy resin and a curing agent are encompassed.

Process for producing modified epoxy resin, modified epoxy resin

To provide an epoxy resin composition for encapsulation of semiconductors, which is superior in curability and can yield a cured product having low moisture absorption. The epoxy resin composition comprises the following components (a), (b), (c), and (d):

Epoxy resin composition for encapsulation of semiconductors

The present invention relates to an epoxy composition represented by the formula (I) below, wherein G is a glycidyl group or a halogen atom. It is produced by reacting a halogenated polyhydric phenol compound with epihalohydrin in the presence of an alkali metal hydroxide. It is incorporated into a resin to render it flame retardant. ##STR1##

Halogenated epoxy resin, production of said resin, flame retardant, and

The invention relates to an epoxy resin composition for semiconductor encapsulation comprising at least an epoxy resin, hardener, inorganic filler, and accelerator, wherein said epoxy resin is one which is composed of about 20 to about 90 parts by weight of 4,4'-bisphenol F type epoxy resin and about 10 to about 80 parts by weight of either a polyhydric phenolic type epoxy resin which has slightly polar hydrocarbon groups (Z) lying between the phenyl nuclei, or a biphenol type epoxy resin.

A modified liquid epoxy resin composition is provided by reacting a crystalline epoxy resin, from about 3 to about 20 parts by weight, based on the epoxy resin, of a compound having two or more phenolic hydroxyl groups and/or carboxyl groups in one molecule and from about 3 to about 20 parts by weight of a compound having one phenolic hydroxyl group or carboxyl group in one molecule. The crystalline epoxy resin is preferably selected from various glycidylethers of biphenol compounds. The modified liquid epoxy resin composition has a low viscosity and good liquid stability at low temperatures, resulting in cured resins having excellent heat resistance and water resistance.

Modified liquid epoxy resin composition

An epoxy resin composition is provided comprising a biphenol-type epoxy resin and a polyhydric phenol resin curing agent derived from a polyhydric phenol compound having 2 or more phenolic hydroxyl groups attached at adjacent positions on the aromatic ring. A cured product with excellent stability and strength at high temperatures can be obtained useful as adhesives, castings, sealing materials, moldings, and laminates.

Epoxy resin composition containing novolac with adjacent hydroxyl groups

An electrical encapsulation formulation is provided comprising a diglycidyl ether of a 4,4'-dihydroxybiphenyl, a trisphenolic curing agent, a cure accelerator and an inorganic filler. The composition cures rapidly and exhibits excellent resistance to cracking under high-temperature operation.

Growing community of inventors

Yokkaichi, Japan

Yasuyuki Murata