Ebara Corporation

Yasuyuki Motojima

Mitsuru Miyazaki

Seiji Katsuoka

Teruyuki Watanabe

Kenichi Kobayashi

Toshio Yokoyama

Masahiko Sekimoto

Takahiro Ogawa

A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment.

Substrate processing method and apparatus

The present invention relates to a substrate processing apparatus and a substrate processing method suitable for processing a substrate with a plurality of liquids. A substrate processing apparatus comprises a substrate holding device for holding a substrate, a container having an opening portion disposed so that the opening portion is opposed to a surface, to be processed, of the substrate, a driving device for moving the container or the substrate holding device between a position at which the container approaches the substrate or a position at which the substrate enters the container, and a position at which the container is positioned away from the substrate, a first treatment liquid supply device for bringing the surface, to be processed, of the substrate which has approached or entered the container into a first treatment liquid, a covering member for covering the opening portion of the container at the position at which the container is positioned away from the substrate, and a second treatment liquid supply device for bringing the surface, to be processed, of the substrate into a second treatment liquid in a state in which the opening portion of the container is covered with the covering member.

Substrate processing apparatus and substrate processing method

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Tokyo, Japan

Yasuyuki Motojima