Hitachi Chemical Company, Ltd.

Showa Denko Materials Co., Ltd.

Riken Vinyl Industry Co., Ltd

Resonac Corporation

Yasuyuki Mizuno

Hikari Murai

Daisuke Fujimoto

Nozomu Takano

Tomio Fukuda

Takao Tanigawa

Yuki Nagai

Kazuhito Kobayashi

Kazutoshi Danjobara

Shinji Tsuchikawa

Shigeo Sase

Harumi Negishi

Takeshi Sugimura

Hiroshi Shimizu

Shin Takanezawa

Aya Kasahara

Nobuyuki Ogawa

Kazumasa Takeuchi

Yuusuke Kondou

Etsuo Mizushima

Masaharu Matsuura

Kenichi Tomioka

Takayuki Sueyoshi

Shigeru Haeno

Yoshinori Nagai

Masato Fukui

Yasushi Watanabe

Kazutoshi Danjoubara

Akiko Kawaguchi

The present invention relates to an adhesive film for a multilayer printed-wiring board, in which a property of filling irregularities is excellent even when silica filler is highly filled. Specifically, there is provided an adhesive film for a multilayer printed-wiring board, which includes a resin composition layer that is obtained by forming a layer of a resin composition containing: (A) a novolac type phenolic resin in which a dispersity (Mw/Mn) of a weight average molecular weight (Mw) and a number average molecular weight (Mn) ranges from 1.05 to 1.8; (B) an epoxy resin represented by general formula (1); and (C) inorganic filler, on a support film. An average particle size of the (C) inorganic filler in the resin composition layer is 0.1 μm or more, and a content of the (C) inorganic filler in a resin solid content ranges from 20% to 95% by mass.

Adhesive film for multilayer printed-wiring board

Provided is an interlayer insulating film for a multi-layered printed wiring board, including a wiring embedding layer (A) obtained by forming a thermosetting resin composition (I) into a layer, and an adhesion assisting layer (B) obtained by forming a thermosetting resin composition (II) into a layer, in which the interlayer insulating film contains a residual solvent in an amount of 1% to 10% by mass in a total amount of the wiring embedding layer (A) and the adhesion assisting layer (B), and the residual solvent contains an organic solvent having a boiling point of 150&#xb0; C. to 230&#xb0; C. in an amount of 10% by mass or more in a total amount of the residual solvent.

Interlayer insulating film and method for producing same

Provided are a thermosetting resin composition having especially good compatibility and having dielectric properties (low dielectric constant and low dielectric dissipation factor) in a high frequency range, high adhesion to conductor, excellent heat resistance, high glass transition temperature, low thermal expansion coefficient and high flame retardancy, and a prepreg, a laminate and a multilayer printed wiring board using the resin composition. Specifically, the thermosetting resin composition contains (A) a polyphenylene ether derivative having an N-substituted maleimide structure-containing group and a structural unit represented by the following general formula (I) in one molecule, (B) at least one thermosetting resin selected from the group consisting of epoxy resins, cyanate resins and maleimide compounds, and (C) a phosphorus flame retardant: wherein Reach independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and x represents an integer of 0 to 4.

Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board

Provided are a resin composition having especially good compatibility and having dielectric properties (low dielectric constant and low dielectric dissipation factor) in a high frequency range, high adhesion to conductor, excellent heat resistance, high glass transition temperature, low thermal expansion coefficient and high flame retardancy, and a prepreg, a laminate and a multilayer printed wiring board using the resin composition. Specifically, the resin composition contains (A) a polyphenylene ether derivative having an N-substituted maleimide structure-containing group and a structural unit represented by the following general formula (I) in one molecule, (B) at least one thermosetting resin selected from the group consisting of epoxy resins, cyanate resins and maleimide compounds, and (C) a styrenic thermoplastic elastomer: 

Resin composition, prepreg, laminate and multilayer printed wiring board

The present invention provides the prepreg being formed by impregnating a fiber base material with a resin composition and the resin composition comprising an acrylic resin, wherein the ratio of the peak height near 2240 cmdue to nitrile groups (P) with respect to the peak height near 1730 cmdue to carbonyl groups (P) in the IR spectrum of the cured resin composition (P/P) is no greater than 0.001 and the like in order to provide a prepreg, a film with a resin, a metal foil with a resin and a metal-clad laminate, which exhibit excellent bending resistance while also prevent ion migration and have excellent insulating reliability when printed wiring boards are fabricated, as well as a printed wiring board employing the same.

Pregreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board

A polyphenylene ether derivative having at least one N-substituted maleimide group represented by the following general formula (I) in a molecule, and a heat curable resin composition, a prepreg, a metal-clad laminate, and a multilayer printed wiring board, each of which uses the polyphenylene ether derivative: wherein Reach independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, Reach independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, Arepresents a residual group represented by a specific general formula, m is an integer of 1 or more as the number of the structural unit, and x and y each is an integer of 1 to 4.

Polyphenylene ether derivative having N-substituted maleimide group, and heat curable resin composition, resin varnish, prepreg, metal-clad laminate, and multilayer printed wiring board using same

This electromagnetic coupling structure includes a laminated body that is laminated with an inner dielectric layer interposed between inner conductive layers, one pair of outer dielectric layers facing each other with the laminated body interposed therebetween, and one pair of outer conductive layers facing each other with the one pair of outer dielectric layers interposed therebetween. The one pair of outer conductive layers include wiring portions and conductive patch portions disposed at front ends of the wiring portions, and the conductive patch portions have portions longer than the wiring portions in a direction perpendicular to an extending direction of the wiring portions. In the laminated body, a hole passing through the inner dielectric layer and the inner conductive layers is arranged, and the one pair of outer conductive layers are electromagnetically coupled through a metal film formed inside the hole.

Electromagnetic coupling structure, multilayered transmission line plate, method for producing electromagnetic coupling structure, and method for producing multilayered transmission line plate

Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil. The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same

Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil. The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1 2,-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

Provided is a process for producing a thermosetting resin varnish containing a thermosetting resin composition, which contains an uncured semi-IPN composite, an inorganic filler, and a saturated thermoplastic elastomer, wherein the process includes the steps of: (i) preliminary reacting (B) a butadiene polymer which contains in the molecule thereof 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in the side chain thereof, and which is not chemically modified and (C) a crosslinking agent, in the presence of (A) a polyphenylene ether to obtain a polyphenylene ether-modified butadiene prepolymer which is an uncured semi-IPN composite; (ii) mixing together (D) an inorganic filler and (E) a saturated thermoplastic elastomer to obtain a mixture; and (iii) mixing together the obtained mixture and the polyphenylene ether-modified butadiene prepolymer; and a resin varnish, a prepreg, and a metal-clad laminate provided using the same.

Process for producing resin varnish containing semi-IPN composite thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminate

The present invention provides a resin composition for printed wiring board to be used for electronic devices in which operating frequency exceeds 1 GHz, and a varnish, a prepreg and a metal clad laminated board using the same. One invention of the present invention is a resin composition for printed wiring board containing a cyanate ester compound having 2 or more cyanate groups in the molecule and/or a prepolymer thereof, an epoxy resin containing at least one kind of an epoxy resin having a biphenyl structure in the molecule, and a varnish, a prepreg and a metal clad laminated board using the same.

Composition of polycyanate ester and biphenyl epoxy resin

A resin composition comprising a cyanate compound (A) having 2 or more cyanato groups in the molecule; a phenol compound (B); a silicone polymer (D) having at least one siloxane unit selected from the group consisting of a tri-functional siloxane unit represented by the formula RSiOand tetra-functional siloxane unit represented by SiO, polymerization degree of 7,000 or less, and at least one terminal functional group reactive with hydroxyl group; and inorganic filler (E).

Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepeg made with these, and metal-clad laminate

A thermosetting resin composition comprising: (1) a copolymer resin comprising (a) a monomer unit and (b) a monomer unit respectively represented by the following general formulae (I) and (II): wherein Rrepresents hydrogen, a halogen, or a C&#x2013;Chydrocarbon group; Rrepresents a halogen or a C&#x2013;Chydrocarbon group; x istoand each of m and n is a natural number; and () a cyanate resin having at least two cyanate groups per molecule; is used to provide a printed wiring board material and a printed wiring board for electronic appliances, having a low dielectric constant and a low dielectric dissipation factor as well as improved heat resistance.

Growing community of inventors

Tokyo, Japan

Yasuyuki Mizuno