Hitachi, Ltd.

Hitachi Appliances, Inc

Other

Yasuyuki Kojima

Minehiro Nemoto

Nobuyasu Kanekawa

Noboru Akiyama

Seigou Yukutake

Takayuki Iwasaki

Katsuhiro Furukawa

Atsuo Watanabe

Tatsuki Inuzuka

Shinichi Shinoda

Kazuyuki Kamegaki

Hideki Miyazaki

Tatsumi Yamauchi

Toshiaki Nakamura

Shinichiro Mitani

Seigoh Yukutake

Chiyoshi Kamada

Masatsugu Amishiro

Yusuke Takeuchi

Takayuki Oouchi

Koichi Tokushige

Hiroyuki Shoji

Nagaharu Hamada

Kiyohiko Tanno

Kenji Kawabata

Kazuhisa Takami

Takeshi Onaka

Koichi Taniguchi

Noriyuki Bunkou

Keiji Sato

Atsushi Ito

Akira Shimizu

Akihiko Emori

Kazuo Kato

Mikio Shiraishi

Shoji Suzuki

Kozo Nakamura

Makoto Ito

Masahiko Saito

Yasuo Otsuka

Keisuke Nakashima

Takuya Kinoshita

Yasuro Hori

Mitsuaki Horiuchi

Takanori Yokoyama

Kunihiko Tsunedomi

Naohiro Ozawa

Kunio Sato

Shogo Matsumoto

Satoru Funaki

Yasuo Shima

Hiroshi Minoda

Toyota Honda

Yasushi Yokosuka

Yukihito Ishihara

Hisashi Matsumoto

Kazuhiko Takaoka

Seigo Yukutake

Yoshiaki Yuyama

Yasunori Iwafuji

Hiroshi Kawamura

Tetsuo Doi

Kunio Ono

Tadashi Tamaoki

Toru Takei

Hideki Muroya

Katsubumi Ouchi

Toshio Tanizoe

Eizou Ebisui

Hideo Nakazawa

Takeshi Kobayashi

Kyoichi Nomura

Tomoe Sasayama

Naoki Kinoshita

Norikazu Takahashi

Atuhiko Urusihara

Kenji Yokoi

Takeshi Shimanuki

Akihiko Asada

Noriyuki Bunko

Koki Sakai

Shinichi Tanabe

Takayuki Iwasakii

Seigoh Yukitake

An air conditioning system is arranged to use a power line for communication. The air conditioning system includes one or more indoor units, one or more outdoor units, and a system controller for controlling the indoor units or outdoor units and executes communications between the indoor units and the outdoor units as overlapping a signal on the power line for supplying electric power. The outdoor units are connected with the system controller through a leased communication line. The indoor unit provides a power line communication device being connected with the power line. The outdoor unit provides a leased communication device being connected with the leased communication line. A bridge is also provided for connecting the leased communication line and the power line. The control information is exchanged mutually between the indoor units, the outdoor units and the system controller through the power line.

Indoor and outdoor unit communication via signal from a power line

A primary side circuit and a secondary side circuit are provided on first and second semiconductor substrates, respectively. A first capacitive insulator on the first substrate electrically insulates and isolates between the primary and secondary side circuits while permitting signal transmission between these circuits. A second capacitive insulator on the second semiconductor substrate electrically isolates the primary and secondary side circuit while permitting signal transmission therebetween. First and second frames are provided for input and output of signals to and from the primary and secondary side circuits. External electrodes of the first and second capacitive insulators are connected together by a third lead frame via a conductive adhesive body including more than one solder ball. The first and second substrates and the lead frames are sealed by a dielectric resin.

Semiconductor device having capacitive insulation means and communication terminal using the device

A communication system is provided including a transceiver and an application controller to transmit and receive signals through the transceiver. An isolator which insulates and separates the transceiver and application controller includes primary and secondary side circuits insulated from each other on a substrate and a capacitive insulating means to transfer signals between the primary and second sides while insulating and separating the primary side circuit from the secondary side circuit.

Isolator and a modem device using the isolator

An air conditioner and a power line communication system high in reliability and free of malfunction facilitates the installation work such as the wiring. The air conditioner for conducting communication through a power line includes a bridge unit connected to at least an outdoor unit through a transmission line, and at least an indoor unit connected from the power line through a blocking filter. A side of the bridge unit far from the outdoor unit is connected between the blocking filter and the indoor unit. The bridge unit subjects a signal from the outdoor unit to spread spectrum modulation and transmits it by superposing the resulting signal on the power line. The superposed signal is received and demodulated by the indoor unit.

Air conditioner and power line communication system

Semiconductor device including primary and secondary side circuits on first and second substrates with capacitive insulation

A plurality of tasks are managed by being classified into a communication task group, a control task group, and a management task group for management. An execution order of the plurality of tasks is switched by a group unit and, in accordance with a switched task group, information obtained from a LAN or information obtained from each device is processed by a CPU.

Controller and operating system

Wire bonding or printed wiring board leads or, alternatively, lead frames or equivalents thereof are used to electrically connect external electrodes of high withstand voltage capacitors formed on a plurality of semiconductor chips. A driver circuit for signal transmission or receiver circuit for signal receipt formed on the semiconductor chips are electrically connected with substrate-side electrodes of said high withstand voltage capacitors, causing the plurality of semiconductor chips to be received within either a single package or a single module. Using this arrangement, a semiconductor device is capable of achieving both dielectricity and size reduction.

Semiconductor device and communication terminal using thereof

A device for turning on light allowing the brightness of an inverter-type illumination apparatus to be adjusted without having to install an additional oscillation circuit. The device comprises an active converter which generates a DC voltage from the commercial AC voltage and an inverter which switches the generated DC voltage, includes a capacitor connected in parallel with a discharge tube to be lighted, and supplies a high-frequency current to the discharge tube via a resonance circuit whose resonance frequency is determined according to the equivalent impedance of the discharge tube. The active converter has a triac adjusting the DC voltage, and switching elements of the inverter perform self-oscillation under control of the phase of the resonance current flowing through the resonance circuit.

Device for turning on light and illumination apparatus

An isolator is made monolithic by forming a capacitive insulating barrier using an interlayer insulation film on the semiconductor substrate to miniaturize the modem device by the monolithic isolator.

The hardware of an over-sampling A/D and D/A converter is provided, which hardware is capable of being operated with either kind of software: one corresponding to a first method in which the over-sampling ratio is fixed and the other corresponding to a second method in which the over-sampling ratio is variable. The value N written on the pseudo-frequency-dividing-ratio-register and the value N written on the pseudo-over-sampling-ratio-register are converted through a user interface into the frequency dividing ratio N by the conversion circuit and the converted result is written in the frequency-dividing-ratio-register

Over-sampling A/D, D/A converter

A circuit region on a main surface of an SOI substrate, and a isolating region defined by insulating isolation trenches and are connected by a wiring resistor, or a diffused resistor in the SOI substrate. The isolating region and an intermediate region are connected by a wiring resistor, or a diffused resistor in the SOI substrate. Furthermore, a circuit region on a main surface of an SOI substrate, and a isolating region defined by insulating isolation trenches and are connected by a wiring resistor, or a diffused resistor in the SOI substrate. The isolating region and an intermediate region are connected by a wiring resistor, or a diffused resistor in the SOI substrate. As a result, distribution of voltage applied between the circuit regions and by the wiring resistors or the diffused resistors to can increase the withstand voltage of a semiconductor integrated circuit.

Semiconductor integrated circuit device and manufacturing method thereof

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Hitachi, Japan

Yasuyuki Kojima