Shinko Electric Industries Co., Ltd.

Korea Shinko Microelectronics Co., Ltd.

Yasuyuki Kimura

Takumi Ikeda

Tadashi Arai

Kazutaka Kobayashi

Toshio Kobayashi

Toshiyuki Okabe

Tsuyoshi Kobayashi

Hiroshi Shimizu

Masao Kainuma

Mikio Suyama

Misuzu Machii

HaeRyong Ahn

Chang Hun Gang

Tae Uk Gang

Hyung Gon Kim

HanSu Kim

A header for a semiconductor package includes: an eyelet having an upper surface and a lower surface; a first metal block molded integrally with the eyelet, protruding at the upper surface, and having a substantially U shape; a first lead sealed in a first through hole penetrating the eyelet; a first substrate having a front surface formed with a first signal pattern electrically connected to the first lead and having a back surface fixed to a first end surface of the first metal block; a second lead sealed in a second through hole penetrating the eyelet; and a second substrate having a front surface formed with a second signal pattern electrically connected to the second lead and having a back surface fixed to a second end surface of the first metal block.

Header for semiconductor package and semiconductor package

A header for a semiconductor package, includes an eyelet having an upper surface, and a lower surface on an opposite side from the upper surface, a metal block having a side surface, and configured to protrude from the upper surface of the eyelet, a lead sealed in a through hole which penetrates the eyelet from the upper surface to the lower surface of the eyelet, and a substrate having a front surface formed with a signal pattern electrically connected to the lead, and a back surface on an opposite side from the front surface. The back surface of the substrate is fixed to the side surface of the metal block. A portion of the back surface of the substrate is exposed from the metal block, and this portion of the substrate is formed with a ground pattern.

Header for semiconductor package, and semiconductor package

A header for a semiconductor device, includes a main body section having an upper surface, and a cavity formed in the upper surface, a heat dissipation section provided on the upper surface of the main body section, and a wiring board provided inside the cavity. The wiring board includes a substrate having a first principal surface, and a second principal surface provided on an opposite side from the first principal surface, a first conductor pattern provided on the first principal surface, and having a mounting section on which a semiconductor element is mounted, and a second conductor pattern provided on the second principal surface, and bonded to an inner wall surface of the cavity and the heat dissipation section. A portion of the first conductor pattern extends beyond the heat dissipation section when viewed in a thickness direction of the wiring board.

Header for semiconductor device, and semiconductor device

A stem has a stem body that has a first surface to be placed on a flexible substrate, a second surface opposite to the first surface, and a through hole passing through the first surface and the second surface, a cylindrical body that is fitted into the through hole of the stem body, and a lead that is inserted into the cylindrical body and fixed to the cylindrical body with a fixing member and that has an end portion protruding from the first surface of the stem body. The cylindrical body has a protrusion that protrudes toward the flexible substrate from the first surface of the stem body and surrounds an outer circumferential surface of the end portion of the lead.

Stem

An optical element package includes: an eyelet including an upper surface and a lower surface opposite to the upper surface; a heat releasing part disposed on the upper surface of the eyelet; a through hole formed through the eyelet to extend from the upper surface of the eyelet to the lower surface of the eyelet; a lead sealed by a certain member provided in the through hole and including a lead portion extending from the lower surface of the eyelet and a lead wiring portion extending from the upper surface of the eyelet; and an insulating substrate disposed between the lead wiring portion and the heat releasing part and comprising a front surface and a back surface opposite to the front surface.

Optical element package and optical element device

An optical semiconductor device includes a base, a wiring substrate, and a sub-mount. The base includes a bottom wall, a side wall projecting from a peripheral edge of the bottom wall, and a flange extending outward from an upper end of the side wall. The wiring substrate includes a distal portion inserted into and fixed to the base. An optical element is mounted on the sub-mount. The bottom wall of the base includes a first seat to which the sub-mount is fixed and a second seat to which the distal portion is fixed. The second seat is located at a higher position than the first seat. An upper surface of the distal portion of the wiring substrate includes a pad connected to the optical element. An upper surface of the pad of the distal portion is flush with an upper surface of an electrode of the optical element.

Optical semiconductor device

A package for an optical semiconductor device includes an eyelet, a signal lead inserted in a through hole formed in the eyelet, and sealing glass sealing the signal lead in the through hole. The signal lead includes a first portion, a second portion and a third portion that are greater in diameter than the first portion and on opposite sides of the first portion, a first tapered portion extending from the second portion to the first portion, and a second tapered portion extending from the third portion to the first portion. The first portion and the first and second tapered portions are buried in the sealing glass. The total length of a part of the second portion in the sealing glass and a part of the third portion in the sealing glass is 0.2 mm or less.

Package for optical semiconductor device

An optical device package includes a metal base body including a cutout portion formed from an outer circumferential surface of the metal base body toward the center portion thereof, and a wiring board connected on a side surface of the cutout portion of the metal base body. The wiring board includes an optical device mounting region provided on a portion of the wiring board located inside the cutout portion of the metal base body, and a pad arranged on a portion of the wiring board located outside the optical device mounting region.

Optical device package and optical device apparatus

A wiring substrate includes a substrate, a first insulating layer formed on the substrate, wiring patterns formed on a first surface of the first insulating layer, and a second insulating layer formed on the first surface of the first insulating layer. The second insulating layer covers the wiring patterns and includes a first opening that partially exposes adjacent wiring patterns as a pad. A projection is formed in an outer portion of the substrate located outward from where the first opening is arranged. The projection rises in a thickness direction of the substrate.

Wiring substrate, light emitting device, and method for manufacturing wiring substrate

An optical semiconductor element package, includes a ceramic wiring substrate portion having a mounting area for mounting an optical semiconductor element in a center part, and including an element electrode for connecting the optical semiconductor element, and an external connection electrode connected to the element electrode, and a metal sealing ring provided on the ceramic wiring substrate portion, and including an opening portion exposing the element electrode and the mounting area, in a center part, and a ring-like protruding portion provided to an outer peripheral part of the opening portion.

Optical semiconductor element package and optical semiconductor device

A method of manufacturing a light-emitting element mounting package including laminating a metallic layer on an insulating layer; forming a light-emitting element mounting area which includes a pair of electroplating films formed by electroplating using the metallic layer as a power supply layer on the metallic layer; forming a light-emitting element mounting portion in which a plurality of wiring portions are separated by predetermined gaps, by removing predetermined portions of the metallic layer, wherein, in the forming the light-emitting element mounting portion, the metallic layer is removed so that one of the pair of electroplating films belongs to one wiring portion of the plurality of wiring portions and another of the pair of electroplating films belongs to another wiring portion adjacent to the one wiring portion.

Light-emitting element mounting package, light-emitting element package, and method of manufacturing the same

A lead frame includes a plurality of leads defined by an opening extending in a thickness direction. An insulating resin layer fills the opening to entirely cover side surfaces of each lead and to support the leads. A first surface of each lead is exposed from a first surface of the insulating resin layer.

Lead frame including an insulating resin layer entirely covering lead surface, and semiconductor device including the same

A package includes: a leadframe made of conductive material and on which the plurality of electronic components are to be mounted, the leadframe including a first surface and a second surface opposite to the first surface and including a plurality of elongate portions arranged in parallel to each other with a gap interposed between the adjacent elongate portions; a heat sink including a first surface and a second surface opposite to the first surface, wherein the leadframe is disposed above the heat sink such that the second surface of the leadframe faces the first surface of the heat sink; and a resin portion, wherein the leadframe and the heat sink are embedded in the resin portion such that the first surface of the leadframe and the second surface of the heat sink are exposed from the resin portion, respectively.

Package for mounting electronic components, electronic apparatus, and method for manufacturing the package

A package for mounting a light emitting element includes a housing and a flat plate-shaped electrode. The electrode is exposed from a lower surface of the housing. An upper surface of the electrode includes a mounting area on which the light emitting element is mounted. An insulator is arranged on the upper surface of the electrode. An element connector is connected to the insulator. A tubular reflective portion extends from the element connector to a height corresponding to the upper surface of the housing. A terminal is arranged on the side surface of the housing and connected to the reflective portion. A recess accommodates the light emitting element. The recess is formed in an upper portion of the housing, and the recess is formed by the upper surface of the electrode, the element connector, and the reflective portion.

Package for mounting a light emitting element including a flat plate-shaped electrode and method for manufacture

A substrate includes a first lead frame, a second lead frame, and a resin layer. The first lead frame includes a heat sink and a plurality of electrodes for external connection. The second lead frame is laminated on the first lead frame and includes a plurality of wirings for mounting light emitting elements. The resin layer is filled between the first lead frame and the second lead frame. The plurality of wirings are arranged above the heat sink. The plurality of electrodes and part of the plurality of wirings are joined with each other.

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Nagano, Japan

Yasuyuki Kimura