Nitta Haas Inc.

Rohm and Haas Electronic Materials Cmp Holdings, Inc.

Yasuyuki Itai

Hiroyuki Nakano

Koichi Yoshida

Naoko Kawai

David B James

Lee Melbourne Cook

Bainian Qian

Marty W DeGroot

Naresh Kumar Penta

Fengji Yeh

James T Murnane

Masashi Teramoto

Takayuki Matsushita

Katsumasa Kawabata

Shinichi Haba

Kazutaka Miyamoto

Yoshiharu Ohta

Yoshiharu Ota

Tomoyuki Toda

Sakiko Nakashima

A chemical mechanical polishing composition for polishing silicon wafers is provided, containing: water, optionally, an abrasive; a cation according to formula (I); piperazine or a piperazine derivative according to formula (II); and, a quaternary ammonium compound; wherein the chemical mechanical polishing composition exhibits a pH of 9 to 12. Also provided are methods of making and using the chemical mechanical polishing composition.

Chemical mechanical polishing composition for polishing silicon wafers and related methods

A method for polishing a silicon wafer is provided, comprising: providing a silicon wafer; providing a polishing pad having a polishing layer which is the reaction product of raw material ingredients, including: a polyfunctional isocyanate; and, a curative package; wherein the curative package contains an amine initiated polyol curative and a high molecular weight polyol curative; wherein the polishing layer exhibits a density of greater than 0.4 g/cm; a Shore D hardness of 5 to 40; an elongation to break of 100 to 450%; and, a cut rate of 25 to 150 &#x3bc;m/hr; and, wherein the polishing layer has a polishing surface adapted for polishing the silicon wafer; and, creating dynamic contact between the polishing surface and the silicon wafer.

Method for chemical mechanical polishing silicon wafers

A semiconductor polishing composition is disclosed. The composition includes fumed silica. The semiconductor polishing composition is an aqueous dispersion solution of fumed silica. Further, the number of particles of fumed silica having a particle diameter of 0.5 &#x3bc;m or more is 600,000 pieces/ml or less and the number of particles of fumed silica having a particle diameter of 1 &#x3bc;m or more is 6000 pieces/ml or less.

Semiconductor polishing composition

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Kyoto, Japan

Yasuyuki Itai