Matsushita Electric Industrial Co., Ltd.

Yasuyuki Ishitani

Makito Seno

Wataru Hirai

Susumu Takaichi

Makoto Nakashima

Kazunobu Sakai

Kiyoshi Tomita

A component mounting apparatus and a component mounting method which improve accuracy and a rate of placement of components onto a circuit-formed member. A component sucked by a suction nozzle is recognized at a component recognizing position, a deviation of the component from a normal suction status is determined on the basis of component recognition information obtained from this recognition of the component, and a velocity of conveyance of the component for a period of time following the recognition of the component and preceding placement of the component is controlled on basis of a magnitude of the deviation. By this control, the accuracy and rate of placement of components onto the circuit-formed member can be improved.

Part mounting apparatus and part mounting method

When a movable member ( ) is moved from a gripping position in which a circuit board ( ) was gripped by the movable member ( ) and a stationary member ( ), a separation mechanism ( ) forcibly separates the circuit board from the stationary member ( ), to thereby prevent the occurrence of a state in which the circuit board ( ) is stuck to the stationary member.

Circuit board holding apparatus and circuit board hold releasing method

When a movable member (,) is moved from a gripping position in which a circuit board (,) was gripped by the movable member (,) and a stationary member (,), a separation mechanism (,) forcibly separates the circuit board from the stationary member (,), to thereby prevent the occurrence of a state in which the circuit board (,) is stuck to the stationary member.

Circuit board holding apparatus

Printed circuit board positioning device

Growing community of inventors

Nakakoma-gun, Japan

Yasuyuki Ishitani