Toppan Printing Co., Ltd.

Yasuyuki Hitsuoka

Osamu Koga

Yoshito Akutagawa

A glass core device with a wiring pattern on a first surface of a glass core and a wiring pattern on a second surface thereof being electrically connected via a wiring pattern embedded in TGVs formed in the glass core. In a state of being cut out by dicing, each glass core has a second surface and side faces which are continuously covered with an outer protective layer.

Glass core device and method of producing the same

A wiring board, a multilayer wiring board, and a method of manufacturing a wiring board adapted to make the filling of through holes and the formation of fine wiring patterns. The wiring board comprises an insulator; a through hole between front and back surfaces of the insulator; a through hole conductor for electrically connecting front and back surface side openings; through hole lands around the front and the back surface side openings, and connected to the through hole conductor; lid plating conductors on the front and the back surface sides, and placed on the respective through hole lands; and wiring patterns formed on the front are compatible and the back surface of the insulator. The thickness of the through hole lands is 1.0 &#x3bc;m or more and 10.0 &#x3bc;m or less, and the area of each lid plating conductor is less than the area of each through hole land.

Wiring board, multilayer wiring board, and method of manufacturing wiring board

A printed wiring board according to an aspect of the present invention includes an insulating resin, a plated copper formed on a front surface side of the insulating resin, and a plated copper formed on a back surface side of the insulating resin. The plated copper and the plated copper are electrically connected via a plated copper that fills a through hole penetrating the insulating resin from the front surface side to the back surface side. Furthermore, the through hole includes a conical section whose opening diameter decreases from the front surface side to the back surface side of the insulating resin, and a cylindrical section that communicates with the conical section at a bottom surface of the conical section.

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Tokyo, Japan

Yasuyuki Hitsuoka