Komatsu Corporation

Cognex Technology and Investment Corporation

Yasuyoshi Suzuki

Masashi Higashi

Takahiro Ueda

Yukihiro Tsuda

Tomikazu Tanuki

Takashi Kurihara

Yoshihiko Nakakoji

Toru Inomoto

Akihiko Souda

Kazuyuki Kimura

An electronic component inspection equipment effective to prevent reflection of a virtual image in which among side walls of a vessel for accommodating an electronic component, an image pick-up direction to a first side wall is set in a direction of Brewster angle &PSgr;B of the first side wall, a first prism and a first polarized light beam splitter are disposed on the image pick-up direction, an image pick-up direction of a second side wall is set in a direction of Brewster angle &PSgr;B of the second side wall, and a second prism and a second polarized light beam splitter are disposed on the image pick-up direction.

Electronic component inspection equipment

An inspection object imaging device, which images a plurality of objects to be inspected that are located at different imaging distances from imaging means, in which a light transmitting optical member which has a predetermined refractive index and a thickness and which absorbs the differences of the imaging distances is provided in an optical path between the objects to be inspected and the imaging means. When the objects whose optical path lengths from the imaging means are different are imaged by one imaging means, all the objects can be focused simultaneously, so that the time required for the imaging can be reduced and, further, a high quality image can be obtained over the whole imaged region.

Device for imaging object to be inspected and device for inspecting semiconductor package

A semiconductor package inspection apparatus which varies the emission spectrum of an oblique imaging illumination and a plan view imaging illumination from each other, and which comprises a first filter which is provided on the optical path from a semiconductor package to an oblique imaging device, and which passes light from the oblique imaging illumination and blocks light from the plan view imaging illumination; a second filter which is provided on the optical path from a semiconductor package to the plan view imaging device, and which passes light from the plan view imaging illumination and blocks light from the oblique imaging illumination; and a control unit which simultaneously turns on the oblique imaging and plan view imaging illumination, and inspects terminals of the semiconductor package based on image data of the oblique imaging device and plan view imaging device.

Inspection apparatus for semiconductor packages

A semiconductor package inspection apparatus comprises single photographic device disposed above the semiconductor package, and comprises light splitter for splitting light in different directions according to three different wavelength ranges in the light; and three image pickup units for separately photographing light of the three wavelength ranges which has been split by the light splitter; lighting device comprising first lighting for inspecting leads of the semiconductor package; second lighting for inspecting marks printed on top face of the semiconductor package; and third lighting for inspecting defects of the semiconductor package, the first, second and third lightings being disposed at locations different from each other, and having wavelength ranges into which the light has been split by the light splitter, and inspection device for simultaneously operating the first, second and third lightings of the lighting device and the three image pickup units of the photographic device to inspect leads of the semiconductor package, marks printed on top face of the semiconductor package and defects in the semiconductor package based on the photographic data from the three image pickup units.

Semiconductor package inspection apparatus

Growing community of inventors

Fujisawa, Japan

Yasuyoshi Suzuki