Denso Corporation

Yasuyoshi Hirai

Kuniaki Mamitsu

Tomoatsu Makino

Kazuhito Nomura

Takahiko Yoshida

Takeshi Miyajima

Yutaka Fukuda

Yoshimi Nakase

Atsushi Hashikawa

Muneo Yorinaga

Masahiro Shiozawa

Kazuo Kajimoto

A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions are connected to principal electrodes of the semiconductor chips. The radiation members are made of a metallic material containing Cu or Al as a main component. The semiconductor chips and the radiation members are sealed with resin with externally exposed radiation surfaces.

Semiconductor device having radiation structure

A pressed-contact type semiconductor device in which a main electrode surface of a semiconductor element is contacted with an electrode plate by a pressed-contact, which can reduce both an electric resistance and a thermal resistance between the main electrode surface of the semiconductor element and the electrode plate. The pressed-contact type semiconductor device ( ) is provided with a semiconductor element ( ) having electrode surfaces, a pair of electrode plates ( ) contacted with the electrode surfaces by the pressed-contact, a pair of insulating plates ( ) contacted with the outer side of the pair of the electrode plates by the pressed-contact, and a pair of radiating plates ( ) contacted with the outer side of the pair of the insulating plates by the pressed-contact. A contact intermediary member ( ), which is made up of particle member having at least thermal conductivity and electric conductivity, is intercalated between the semiconductor element and the electrode plate. The particle member of the contact intermediary member includes large particles having an average particle diameter of more than 2 &mgr;m, and small particles having an average particle diameter of to or less than 2 &mgr;m. Contact intermediary members ( ) are intercalated into gaps generated between the electrode plate and the insulating plate, and between the insulating plate and the radiating plate so as to fill up these gaps. The contact intemediary members are made of powder material having at least thermal conductivity.

Electric apparatus having a contact intermediary member and method for manufacturing the same

Growing community of inventors

Gamagori, Japan

Yasuyoshi Hirai