Seiko Epson Corporation

Yasutsugu Aoki

Yoshitake Kobayashi

Hisashi Fujimura

Shuji Tanaka

Takuya Miyakawa

Yoshiaki Mori

Keiji Fukuhara

Naoyuki Iwamura

An intermediate product manufacturing apparatus for carrying intermediate products and processing the intermediate products with a plurality of processing apparatuses is provided, the apparatus comprising: a plurality of carrying means for carrying the intermediate products to the processing apparatuses; a common processing apparatus provided between the plurality of carrying means, for carrying out a common process on the intermediate products carried by the carrying means; and intermediate product transfer sections provided between the plurality of carrying means, for transferring the intermediate products between the common processing apparatus and the carrying means.

Intermediate product manufacturing apparatus, and intermediate product manufacturing method

A transferring apparatus is provided between a plurality of carrying apparatuses, each carrying apparatus comprising support means for supporting carried products Wf, guide means for controlling the moving direction of the support means, the guide means being provided along processing apparatuses for processing the carried products Wf, and moving means for moving the support means along the guide means. The transferring apparatus includes synchronization control means for synchronizing the moving means of the one carrying apparatus with the moving means of the other carrying apparatus; and at least one hand-over means for receiving the carried products Wf from the support means of the one carrying apparatus and handing over the carried products Wf to the support means of the other carrying apparatus.

Transferring apparatus, carrying apparatus, and transferring method

A wafer carrying apparatusfor carrying intermediate products comprises: a conveyerfor carrying the intermediate products in the carrying direction; and a plurality of platformsarranged in the conveyeralong the carrying direction of the intermediate products on the conveyer, each platformbeing capable of mounting at least one intermediate product at a position in a direction crossing the carrying direction of the intermediate products on the conveyer

Wafer carrying apparatus and wafer carrying method

An intermediate product carrying apparatus is provided for loading a carrier, which is carried between a plurality of process systems and stores a plurality of intermediate products, into the corresponding process system, and then transferring the plurality of intermediate products of the carrier to a single wafer carrying conveyer, which carries the intermediate products in a single wafer state to an intermediate product manufacturing apparatus provided in the process system. The intermediate product carrying apparatus comprising: an intermediate product transfer means provided in the process system, for loading the carrier, which is carried between process systems and which stores the plurality of intermediate products, into the corresponding process system, and transferring the intermediate products.

Intermediate product carrying apparatus, and intermediate product carrying method

A method and apparatus for solid bonding without using a bonding agent are provided. A surface of metal, glass, or other bond members and is fluorinated by exposure to a mixture of HF gas from a HF gas supply unit and water vapor from a vapor generator in a fluorination process section The bond members and are then placed in contact at the fluorinated surface on table in bonding process section Argon is then introduced to bonding chamber Pressure is then applied to the first bond member and second bond member by a cylinder and heated to below the melting point by a heater to bond the first and second bond members together.

Method and apparatus for solid bonding, a conductor bonding method, a packaging method, and a bonding agent and a method for manufacturing a bonding agent

A method and apparatus for solid bonding without using a bonding agent are provided. A surface of metal, glass, or other bond members and is fluorinated by exposure to a mixture of HF gas from a HF gas supply unit and water vapor from a vapor generator in a fluorination process section . The bond members and are then placed in contact at the fluorinated surface on table in bonding process section . Argon is then introduced to bonding chamber . Pressure is then applied to the first bond member and second bond member by a cylinder , and heated to below the melting point by a heater , to bond the first and second bond members together.

A method and apparatus for solid bonding without using a bonding agent are provided. A surface of metal, glass, or other bond members,and,is fluorinated by exposure to a mixture of HF gas from a HF gas supply unit,and water vapor from a vapor generator,in a fluorination process section,. The bond members,and,are then placed in contact at the fluorinated surface on table,in bonding process section,. Argon is then introduced to bonding chamber,. Pressure is then applied to the first bond member,and second bond member,by a cylinder,, and heated to below the melting point by a heater,, to bond the first and second bond members together.

A plasma treatment and apparatus which enables improved uniform plasma treatment over the entire surface of an object to be treated, improved yield, and higher treatment speed is provided. In a gas introduction passage, the gas capable of plasma discharge is preexcited to raise its level of excitation. A first pair of plasma generation electrodes downstream along the gas flow passage use the preexcited gas to generate a plasma in a first plasma generation position. Further downstream, a second pair of plasma generation electrodes positioned in a second plasma generation position, where the activated state of the gas activated in the first plasma region is maintained, activates the gas to generate a plasma containing activated gas species. The object to be treated is treated by the activated gas species in the second plasma region.

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Kofu, Japan

Yasutsugu Aoki