Teikoku Tsushin Kogyo Co., Ltd.

Teikoku Tsuhin Kogyo Co., Ltd.

Yasutoshi Kaku

Nobuyuki Yagi

Jiroh Inagaki

Shinji Mizuno

Takashi Shinoki

Atsushi Hari

Kozo Morita

Nobuyuki Kikuchi

Jiro Inagaki

A push-button switch keytop includes a flexible resin film deformed in such a manner that the resin film bulges upwardly to form a curved portion that is filled with a molding resin while the resin film is being deformed. The molding resin is allowed to harden to form a keytop body, whereby the top side of the keytop body consisting of the molding resin is integrated with the resin film in a state in which the top side of the keytop body is covered by the resin film. The keytop is manufactured by clamping a resin film between upper and lower molds, charging a molten resin from a pin gate provided on the lower mold into a cavity provided in the lower mold, thereby deforming and urging the resin film upward by pressure and heat produced by the molten resin and causing the resin film to adhere to the inner surface of the upper mold, filling the cavities of the upper and lower molds with the molten resin and separating the upper and lower molds after the resin hardens. An adhesive layer may be provided directly or indirectly via another printed layer on the underside of the resin film on that portion thereof where the keytop is located.

Keytop for push-button switches, and method of manufacturing same

The keytop of a push-button switch includes a keytop portion situated on the top of a resin film, and a retaining portion situated on the underside of the resin film. The keytop portion and retaining portion are formed into a unitary body by a resin-molding process in which resin is passed through a hole provided in the resin film such that the resin film is sandwiched between the keytop portion and the retaining portion. In another embodiment, the retaining portion is loop-shaped and is formed into a unitary body with the keytop portion by a resin-molding process in which the resin passes through a plurality of holes provided in the resin film in a pattern corresponding to the loop-shaped circumference of the retaining portion. The resin film is sandwiched in a water-tight state between the keytop portion and the loop-shaped retaining portion.

Push-button switch, keytop, and method of manufacturing the keytop

A terminal structure includes a portion of a flexible printed circuit board and a plurality of metal terminals each consisting of a slender, elongate metal plate. The circuit board has a plurality of electrically conductive patterns provided on a resin film, a prescribed portion of the board having a connector insertion portion of a width substantially the same as that of an insertion hole of a connector. The plurality of metal terminals are placed in parallel on the flexible printed circuit board in such a manner that distal ends thereof are situated adjacent a distal end of the connector insertion portion, and each metal terminal is fixedly bonded to a respective one of the electrically conductive patterns provided on the flexible printed circuit board. The width of the connector insertion portion of the flexible printed circuit board to which the metal terminals have been attached is such that the connector insertion portion will not extend beyond the outer sides of the two outermost metal terminals on the longitudinal side edges of the connector insertion portion.

Terminal structure of flexible printed circuit board

A molded resin casing of an electronic part equipped with a flat cable and internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part. A flexible board having various electric conductor patterns formed on a synthetic resin film is used as the board, the flexible board is formed integral with a flat cable including a synthetic resin film on which are formed electric conductor patterns electrically connected to the aforementioned various electric conductor patterns, and when the molded resin casing is molded by injecting a molten synthetic resin, the flexible board is inserted in such a manner that the electric conductor patterns are exposed within the casing, thereby integrating the flexible board and synthetic resin casing, with the flat cable extending outwardly from a side portion of the synthetic resin casing.

Method of making molded resin casing of electronic part with flat cable

Disclosed is a molded resin casing of a rotary- or sliding-type electronic part internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part, wherein a flexible board having the electric conductor patterns formed on a film comprising a synthetic resin material is used as the board, and the flexible board is inserted inside the synthetic resin casing in such a manner that the electric conductor patterns are exposed to the interior of the casing.

Molded resin casing of electronic part incorporating flexible board

A molded resin casing of a rotary- or sliding-type electronic part internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part, wherein a flexible board having the electric conductor patterns formed on a film comprising a synthetic resin material is used as the board, and the flexible board is inserted inside the synthetic resin casing in such as manner that the electric conductor patterns are exposed to the interior of the casing.

A molded resin casing of an electronic part equipped with a flexible flat cable and internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part, includes a flexible board having various electric conductor patterns formed on a synthetic resin film used as the board. The flexible board is formed integrally with a flexible flat cable comprising a synthetic resin film on which are formed electric conductor patterns electrically connected to the aforementioned various electric conductor patterns. When the molded resin casing is molded by injecting a molten synthetic resin, the flexible board is inserted in such a manner that the electric conductor patterns are exposed within the casing, thereby integrating the flexible board and synthetic resin casing, with the flexible flat cable extending outwardly from a side portion of the synthetic resin casing.

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Kanagawa, Japan

Yasutoshi Kaku