Taiyo Yuden Co., Ltd.

Yasutomo Suga

Masataka Watabe

Yuji Tomizawa

Takeshi Nakajima

Jun Nishikawa

Toshiya Kuji

Kimio Fujita

Yasunari Kato

Tetsuhiko Fukuoka

Yoshiaki Iijima

Shota Yajima

Yoshiyuki Motomiya

Katsuo Koizumi

Sadayoshi Kato

Masahiko Hirano

Sou Satou

A multilayer ceramic electronic device includes a ceramic main body and a pair of external electrodes respectively covering a pair of end surfaces of the ceramic main body, wherein the ceramic main body includes a laminated body including a plurality of internal electrodes laminated vertically therein, and a pair of side margin parts respectively covering a pair of side surfaces of the laminated body, and wherein a distance between a bottom surface of the ceramic main body and the bottommost internal electrode is greater than a distance between the top surface of the ceramic main body and the topmost internal electrode.

Method of making a multilayer ceramic electronic device

A multilayer ceramic electronic component includes a ceramic body, and first and second external electrodes facing each other in a second axis direction. The ceramic body includes internal electrodes, and has a rectangular parallelepiped shape having first and second end surfaces, and four connection surfaces each connecting the first and second end surfaces. The connection surface has an uneven region located between the first and second external electrodes. The uneven region includes recess portions formed along an extension direction intersecting the second axis direction and arranged along an arrangement direction orthogonal to a depth direction and the extension direction, and a protrusion portion located between the recess portions. A depth of the recess portion in the depth direction is 0.1 μm or greater and less than 2.5 μm. An arrangement pitch of the recess portions along the arrangement direction is 1 μm or greater and 80 μm or less.

Multilayer ceramic electronic component with uneven region between external electrodes

A ceramic electronic component includes an element body having a dielectric and internal electrodes, the element body having an upper surface, a lower surface, and side surfaces; external electrodes formed on multiple surfaces of the element body, and an oxide layer formed on the upper surface of the element body. Each of the external electrodes has a base layer and a plating layer, the base layer containing metal and having a lower part formed on the lower surface of the element body and a side part formed on one of the side surfaces of the element body and being connected to one or more of the internal electrodes, the plating layers being formed on the lower part of the corresponding base layer. The oxide layer has a surface roughness Ra that is equal to or greater than 0.20 micrometers.

Ceramic electronic component, substrate arrangement, and method of manufacturing ceramic electronic component

A ceramic electronic component includes an element body having a first inner electrode exposed at a first end face of the element body, and a second inner electrode exposed at a second end face of the element body. The ceramic electronic component also includes a first outer electrode formed on the first end face and its neighboring faces of the element body. The first outer electrode includes two side portions and a middle portion on each of top and bottom faces of the element body such that the middle portion extends inwardly towards a center of the element body more than the two side portions from the first end face. The ceramic electronic component also includes a second outer electrode having the same dimensions as the first outer electrode on the second end face and its neighboring faces of the element body.

Ceramic electronic component and substrate arrangement

A ceramic electronic component includes an element body and at least one external electrode formed on the element body. The element body includes a dielectric and at least one internal electrode therein. The element body has a plurality of surfaces, and these surfaces include a first surface and a second surface opposite the first surface. Each external electrode includes a base layer and a plating layer formed on the base layer. The base layer is in contact with the internal electrode, contains a metal, and has a first end face adjacent to an outer periphery of the second surface of the element body. The plating layer has a second end face adjacent to an outer periphery of the first end face such that the first and second end faces form, in combination, a multilayer structure on the outer periphery of the second surface of the element body.

Ceramic electronic component, substrate arrangement and method of manufacturing ceramic electronic component

A ceramic electronic device includes a multilayer chip having dielectric layers and internal electrode layers and having a first main face and a second main face that have a rectangular shape in a planar view, external electrodes each of which extends from the first main face to the second main face at each of two diagonal corners of the rectangular shape, the external electrodes being spaced from each other, each of the external electrodes being connected to a part of the internal electrode layers, and a conductor that is provided on the first main face, the second main face or both of the first main face and the second main face, is spaced from the external electrodes, and is provided in a region which includes an intersection point of perpendicular bisectors of two adjacent sides of the rectangular shape.

Ceramic electronic device and mounting substrate

A multi-layer ceramic electronic component includes: a ceramic body including first and second main surfaces facing in a first axis direction, first and second end surfaces facing in a second axis direction, and first and second internal electrodes; a first external electrode including a first cover portion covering the first end surface, and a first extended portion extending from the first cover portion to the second main surface; and a second external electrode including a second cover portion covering the second end surface, and a second extended portion extending from the second cover portion to the second main surface, the multi-layer ceramic electronic component satisfying that, when Trepresents a dimension of the ceramic body in the first axis direction and Trepresents a dimension of each extended portion in the first axis direction, T+Tis 50 &#x3bc;m or less, and T/(T+T) is 0.32 or less.

Multi-layer ceramic electronic component

A multi-layer ceramic electronic component that satisfies the following: 30 &#x3bc;m&#x2264;Ts&#x2264;100 &#x3bc;m, 6 &#x3bc;m&#x2264;T&#x2264;18 &#x3bc;m, and 0.19&#x2264;(2T+t)/Ts&#x2264;1.55, where Ts represents a dimension of a ceramic body measured along a first axis, T represents a mean value of thickness dimensions of upper and lower portions of an external electrode measured along the first axis that cover edges of top and bottom surfaces of the ceramic body, and t represents a sum of thickness dimensions of internal electrodes drawn to and in contact with the external electrode.

Multi-layer ceramic electronic component and circuit board

A multi-layer ceramic electronic component includes a ceramic body enclosing internal electrodes laminated in a first direction, wherein the ceramic body has a main surface having a flat face normal to the first direction, a first side surface having a flat face normal to a second direction orthogonal to the first direction, and a rounded ridge connecting the main surface and the first side surface to each other and curved in a convex shape; a maximum dimension of the ceramic body in the first direction is 120 &#x3bc;m or less; and the rounded ridge satisfies a condition of Rb/Ra&#x3e;3.0, where Ra represents a dimension of the rounded ridge in the first direction and Rb represents a dimension of the rounded ridge in the second direction on a cross-sectional surface of the ceramic body taken along a virtual cut plane parallel to the first direction and the second direction.

Multi-layer ceramic electronic component and mounting board

A multi-layer ceramic electronic component includes: a ceramic body including a main surface facing in a first direction, an end surface facing in a second direction orthogonal to the first direction, a side surface facing in a third direction orthogonal to the first and second directions, and internal electrodes laminated in the first direction; and an external electrode formed on a surface of the ceramic body, the external electrode including a base film including an end-surface-covering portion that covers the end surface, and a main-surface-covering portion that covers part of the main surface continuously from the end-surface-covering portion, an electrically conductive thin film including a base-covering portion that covers the main-surface-covering portion, and a ceramic-body-covering portion that extends from the base-covering portion in the second direction and covers part of the main surface, and a plating film that covers the electrically conductive thin film and the base film.

Multi-layer ceramic electronic component having external electrode with base film and electrically conductive thin film

A laminated ceramic capacitor has a capacitor body of roughly a rectangular solid shape defined by the length, width, and height, as well as a concaved part formed at and along the edges of one side and the other side in the height direction. An external electrode has a base conductor layer whose height-direction wrap-around part is formed inside the concaved part, and a main conductor layer whose height-direction wrap-around part is formed continuously over the height-direction wrap-around part of the base conductor layer through the planar part, except for the concaved part, of one side and the other side of the component body in the height direction. The height-direction wrap-around part of the main conductor layer has a planar connecting area constituted by a surface area over the height-direction wrap-around part of the base conductor layer and a surface area over the planar part of the component body.

Laminated ceramic electronic component

There is provided a ceramic electronic component including: a ceramic chip having a first surface, a second surface facing the first surface, and a third surface connecting the first surface to the second surface; a first electrode unit disposed on the first surface; a second electrode unit disposed on the second surface apart from the first electrode unit; and a modified zone disposed on the third surface, and modified by irradiation of a high energy beam.

Ceramic electronic component and method of producing the same

A multi-layer ceramic electronic component includes: a ceramic body including first and second main surfaces oriented in a first axial direction, first and second end surfaces oriented in a second axial direction orthogonal to the first axial direction, a first internal electrode drawn to the first end surface, and a second internal electrode facing the first internal electrode and being drawn to the second end surface, the ceramic body being formed to be long in a third axial direction orthogonal to the first and second axial directions, a dimension of the ceramic body in the first axial direction being 80 &#x3bc;m or less; a first external electrode covering the first end surface and extending from the first end surface to the first and second main surfaces; and a second external electrode covering the second end surface and extending from the second end surface to the first and second main surfaces.

A multi-layer ceramic electronic component includes: a ceramic body including first and second main surfaces oriented in a first axial direction, first and second end surfaces oriented in a second axial direction orthogonal to the first axial direction, a first internal electrode, and a second internal electrode, the ceramic body being formed to be long in a third axial direction orthogonal to the first and second axial directions; a first external electrode including a first cover portion and a first extension portion; and a second external electrode including a second cover portion and a second extension portion, the multi-layer ceramic electronic component satisfying that, when Trepresents a dimension of the ceramic body in the first axial direction, and when Trepresents a dimension of each of the first and second extension portions in the first axial direction, Tis 80 &#x3bc;m or less and T/(T+T) is 0.32 or less.

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Tokyo, Japan

Yasutomo Suga