Nitto-denko Corporation

Yasuto Ishimaru

Naoyuki Tanaka

Yuichi Tsujita

Hirofumi Ebe

Naoki Shibata

Shotaro Masuda

Mayu Ozaki

Kensuke Nishi

Yasufumi Yamamoto

Hiroshi Yamazaki

Kei Nakamura

Hiroyuki Hanazono

Emiko Tani

Toru Mizutani

Akihito Matsutomi

Toshikazu Baba

Yusuke Matsuoka

There is provided an opto-electric hybrid board with slight or no warpage. An opto-electric hybrid board according to the present disclosure includes an electric circuit board and an optical waveguide formed in a stacked manner on one surface of the electric circuit board. The optical waveguide includes an under cladding layer, cores for an optical path formed on a front surface of the under cladding layer, and over cladding layer formed on the front surface of the under cladding layer so as to cover the cores. A groove for prevention of warpage which has a bottom positioned below a top surface of the cores is formed at least in a front surface portion of the over cladding layer.

Opto-electric hybrid board

An optical circuit board sheet which has little or no warpage to have no cracking in cores, and an opto-electric hybrid board sheet including the same are provided. The optical circuit board sheet includes: an insulative sheet; an under cladding layer formed on a first surface of the insulative sheet; and at least one core formed on a surface of the under cladding layer. A hole is formed in a portion of the surface of the under cladding layer other than where the core is formed. The area percentage of an opening area of the hole is in the range of 5% to 99% with respect to the first surface of the insulative sheet.

Optical circuit board sheet and opto-electric hybrid board sheet including same

An optical sensor is installed in a device, and includes a light-emitting element, and a light-receiving element for receiving light emitted from the light-emitting element and traveling through a space. The optical sensor detects an object present in the space, based on a change of the light impinging upon the object. A first optical waveguide is connected to the light-emitting element so as to be capable of light propagation. The first optical waveguide has a front end portion serving as a light exit portion for exiting light emitted from the light-emitting element. A second optical waveguide is connected to the light-receiving element so as to be capable of light propagation. The second optical waveguide has a front end portion serving as a light entrance portion for receiving light exiting from the light exit portion of the first optical waveguide and traveling through the space.

Optical sensor

There is provided an optical sensor in which a reduction in size of a light-receiving part is achieved. This optical sensor is installed in a device, and includes a light-receiving elementfor receiving light coming from outside toward the device. The optical sensor detects the state of the received light. A linear optical waveguideis connected to the light-receiving elementso as to be capable of light propagation. The optical waveguidehas a front end portion serving as a light entrance portion on which light coming from the outside of the device is incident.

Optical sensor having light entrance portion smaller than light-receiving element

An opto-electric hybrid module is provided. In the opto-electric hybrid module, a core and an electric circuit including electric circuit body portions and mounting pads are provided on a surface of an under-cladding layer of an optical waveguide. An optical element is mounted on the mounting pads with its electrodes in abutment against the mounting pads. The core is covered with the over-cladding layer, and a center portion of the optical element is positioned above a portion of the over-cladding layer covering a top surface of the core. A portion of the electric circuit excluding the mounting pads and a surface portion of the under-cladding layer present between the electric circuit body portions of the electric circuit and present between the electric circuit body portion and the mounting pad are covered with a core material layer formed of the same material as the core.

Opto-electric hybrid module

There is provided an opto-electric hybrid board in which a metal reinforcement layer is in intimate contact with an insulative layer of a flexible circuit board without an adhesive layer interposed therebetween, the metal reinforcement layer allowing the proper mounting of an element while deformation due to pressing load applied during the mounting is suppressed. In the opto-electric hybrid board, a flexible double-sided circuit board in which electrical interconnect lines are formed on the front and back surfaces of an insulative layer having flexibility is used as an electric circuit board. A metal reinforcement layer is formed by plating on at least part of the electrical interconnect line on the back surface side which corresponds to a mounting pad on the front surface side. An optical waveguide is formed in contact with the electrical interconnect line on the back surface side of the flexible double-sided circuit board.

An opto-electric hybrid module is provided which has a linear light-path core and an electric circuit including mounting pads and an electric circuit body provided on a surface of an under-cladding layer of an optical waveguide. An optical element is mounted with its electrodes in abutment against the mounting pads. The electric circuit body and a portion of the surface of the under-cladding layer other than a core formation portion and an electric circuit formation portion are covered with a stack including a core material layer and an over-cladding material layer. A surface portion of the stack present between the mounting pads and the electric circuit body is located at a lower height position than a surface portion of the stack present on the electric circuit body.

An opto-electric hybrid module is provided, which is excellent in bending resistance and optical element mountability. In the opto-electric hybrid module, a light-path core of an optical waveguide is provided on a surface of an under-cladding layer, and non-light-path dummy cores are provided on opposite sides of the light-path core in spaced relation to the light-path core as projecting from the surface of the under-cladding layer. An electric circuit having mounting pads is provided on top surfaces of the dummy cores. An over-cladding layer is provided on side surfaces and a top surface of the light-path core, and projects to cover the core. The non-light-path dummy cores each have an elastic modulus that is set higher than the elastic modulus of the under-cladding layer and the elastic modulus of the over-cladding layer. The optical element is mounted on the mounting pads, and positioned above the projecting over-cladding layer.

An opto-electric hybrid board includes: an electric circuit board including an insulative layer having front and back surfaces, and electrical interconnect lines formed on the front surface of the insulative layer; an optical element mounted on a surface of the electric circuit board with the electrical interconnect lines formed thereon; and an optical waveguide including a core and formed on the back surface of the insulative layer of the electric circuit board. The core includes at its end portion a reflecting surface capable of reflecting alight beam to propagate the light beam between the core and the optical element. The insulative layer is made of a light-transmissive material. A portion of the insulative layer corresponding to an optical path between the reflecting surface of the core and the optical element is in the form of a lens portion.

An opto-electric hybrid board which is capable of significantly reducing stresses applied to a bent portion thereof is provided. The opto-electric hybrid board includes a stacked electric circuit board and an optical waveguide. The electric circuit board includes an insulative layer having front and back surfaces, electrical interconnect lines formed on the front surface of the insulative layer, and an insulative coverlay formed on the front surface of the insulative layer and for covering and protecting the electrical interconnect lines. The optical waveguide includes a first cladding layer having a front surface, cores formed in a pattern on the front surface of the first cladding layer, and a second cladding layer covering the cores. Part of the opto-electric hybrid board is defined as a to-be-bent portion in which the coverlay and the optical waveguide are disposed in non-overlapping relation.

An opto-electric hybrid board includes an electric circuit board, an optical waveguide, and a metal layer. The electric circuit board includes an insulative layer having front and back surfaces, and electrical interconnect lines formed on the front surface of the insulative layer. The optical waveguide includes a first cladding layer and cores, and the optical waveguide is formed on the back surface of the insulative layer of the electric circuit board. The metal layer is formed between the first cladding layer of the optical waveguide and the back surface of the insulative layer of the electric circuit board. Part of the opto-electric hybrid board is formed as a to-be-bent portion. The metal layer is partially removed in a portion corresponding to the to-be-bent portion. A first cladding layer of the optical waveguide fills a site where the metal layer is removed.

Opto-electric hybrid board and method of manufacturing same

An opto-electric hybrid board capable of suppressing the increase in light propagation losses and excellent in flexibility, and a method of manufacturing the same, are provided. The opto-electric hybrid board includes an electric circuit board, an optical waveguide, and a metal layer. The electric circuit board includes an insulative layer having front and back surfaces, and electrical interconnect lines formed on the front surface of the insulative layer. The optical waveguide is formed on the back surface of the insulative layer. The metal layer is formed between the cladding layer and the insulative layer. At least part of the metal layer is formed in one of first and second patterns. The first pattern includes a distribution of dot-shaped protrusions, and the second pattern includes a distribution of dot-shaped recesses. A first cladding layer fills a site where the metal layer is removed by the patterning.

A mounting region is provided at an approximately center of one surface of an insulating layer. A conductive trace is formed so as to outwardly extend from inside of the mounting region. A cover insulating layer is formed in a periphery of the mounting region so as to cover the conductive trace. A terminal of the conductive trace is arranged in the mounting region, and a bump of an electronic component is bonded to the terminal. A metal layer made of copper, for example, is provided on the other surface of the insulating layer. A pair of slits is formed in the metal layer such that a region being opposite to the electronic component is sandwiched therebetween. Each slit is formed so as not to divide the metal layer into a plurality of regions.

Printed circuit board and method of manufacturing the same

Each wiring pattern is composed of a conductor layer and a tin plating layer, and includes a tip portion, a connection portion and a signal transmission portion. The width of the tip portion is equal to the width of the signal transmission portion, and the width of the connection portion is smaller than the widths of the tip portion and the signal transmission portion. The connection portions of wiring patterns and bumps of an electronic component are connected to one another, respectively, by heat-sealing when the electronic component is mounted. Respective distances A, Aare set to not less than 0.5 &#x3bc;m. Respective distances B, Bare set to not less than 20 &#x3bc;m. The thickness of the tin plating layer is set to not less than 0.07 &#x3bc;m and not more than 0.25 &#x3bc;m.

Connection structure between printed circuit board and electronic component

A mounting region having a rectangular shape is provided at an approximately center of one surface of an insulating layer. A plurality of conductive traces are formed so as to outwardly extend from the inside of the mounting region. A cover insulating layer is formed so as to cover the plurality of conductive traces in a periphery of the mounting region. An electronic component is mounted on the insulating layer so as to overlap with the mounting region. A metal layer is provided on the other surface of the insulating layer. Openings having a rectangular shape are formed in the metal layer along a pair of longer sides and a pair of shorter sides of the mounting region. The openings are opposite to part of terminals of the plurality of conductive traces, respectively, with the insulating layer sandwiched therebetween.

Growing community of inventors

Ibaraki, Japan

Yasuto Ishimaru