Jsr Corporation

Japan Synthetic Rubber Co., Ltd.

Yasutake Inoue

Kinji Yamada

Minoru Matsubara

Michinori Nishikawa

Takahiko Kurosawa

Tomotaka Shinoda

Mayumi Kakuta

Kouhei Gotou

Kohei Goto

Junji Kawai

Igor Rozhanskii

Kentarou Tamaki

Masahiko Ebisawa

Satoko Hakamatsuka

A method of manufacturing an insulating film-forming material comprising dissolving an inorganic polymer compound or an organic polymer compound in an organic solvent having a solubility in water of 100 g/100 cc or less at 20&deg; C., and causing the solution to come in contact with water or an acidic aqueous solution to perform liquid-liquid extraction. The insulating film-forming material has a low metal impurity content and is capable of forming a silica-based film having excellent relative dielectric constant characteristics and low leakage current characteristics.

Method of manufacturing insulating film-forming material, the insulating film-forming material, and insulating film

Composition for film formation and material for insulating film formation

A curable resin composition comprising (A) a hydrolyzate or a partial condensate of an organosilane compound, or both; (B) at least one compound selected from the group consisting of polyamic acids having a hydrolyzable silyl group or carboxylic acid anhydride group, or both, and polyimides having a hydrolyzable silyl group or carboxylic acid anhydride group, or both; and (C) a chelate compound or an alkoxide compound with a metal selected from the group consisting of zirconium, titanium, and aluminum, or both the chelate compound and the alkoxide compound. The resin composition can be cured and fabricated without producing no cracks into a cured product such as a semiconductor device having a low dielectric constant, high heat resistance and moisture resistance, superior adhesion to various substrate materials, superb electrical insulation properties, and low moisture absorption. Semiconductor devices using this curable resin composition as an insulating film exhibit a low electricity consumption, work at a high speed, and have excellent reliability.

Curable resin composition cured products

Electronic parts and a process for manufacturing the electronic parts are provided. The electronic parts comprise an electric insulating material exhibiting a high heat resistance and low dielectric constant as a structural component. The electric insulating material is formed of a polyimide containing a recurring unit represented by the following general formula (1). ##STR1##

Electronic part and process for manufacturing the same

Curable resin composition and cured products

Growing community of inventors

Tsukuba, Japan

Yasutake Inoue