Nagano Keiki Co., Ltd.

Yasutaka Ide

Yoji Serizawa

Toshiaki Okumura

Shuji Tohyama

Yasuo Watanabe

Takayuki Yokoyama

Haruhiko Sekiya

Hayato Kobayashi

Ikuya Miyahara

Kouzou Yamagishi

Shuzi Tohyama

Hirokazu Nakasone

There is provided a load sensor that can make accurate measurement without being affected by unnecessary external force and moreover has a simple construction. The load sensor includes a strain generating element () which is formed integrally with an installation section () attached to an object to be measured and is displaced according to the weight or load of the object to be measured, a sensor plate () which is connected to the strain generating element () and is distorted according to the displacement of the strain generating element (), and a strain gauge attached to the sensor plate (). The strain generating element () is placed on one end side of the installation section () with the center thereof aligned with the axis of the installation section (). On the inside of the strain generating element, a reception section () for housing the sensor plate is formed, and the sensor plate () is housed in the reception section while being held by a holder (). At this time, the sensor plate () is connected to the center of the strain generating element () with the center thereof aligned with the axis of the installation section () and the center of the strain generating element (). On the other hand, an outer peripheral edge () of the sensor plate () is held by an inner peripheral edge () of the holder (), and an outer peripheral surface () of the holder () is joined to an upright wall at the outer edge of the reception section (). The holder () preferably has a cushioning function.

Load sensor

A pressure sensor (,) having a first terminal (,), the first terminal (,) including a horizontal portion (,) and a vertical portion (,) at an intermediate portion thereof and being elastically deformable. A portion of the first terminal (,) being inserted and soldered to a circuit substrate (,) has a collar portion (,) being abutted around a through-hole (,) of the circuit substrate (,). The first terminal (,) is fixed at a state being pressed to the circuit substrate (,) by the collar portion (,) and being slightly compressed between a base member (,). When the circuit substrate (,) and the base member (,) are spaced apart by circumambient heat, the first terminal (,) can follow by the compressed margin. When the first terminal (,) itself is thermally expanded, the first terminal (,) can follow by an elastic deformation of the horizontal portion (,) and the vertical portion (,). Accordingly, stress caused to the soldered portion by a thermal deformation and the like can be relaxed so that the pressure sensor (,) can be applied to a wider temperature range.

Pressure sensor

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Tokyo, Japan

Yasutaka Ide