Toray Industries, Inc.

Yasushi Sawamura

Masayuki Tanaka

Yukitsuna Konishi

Atsuto Tokunaga

Shoji Kigoshi

Taku Hatano

Yoshio Ando

Keiji Kayaba

Toshihiro Teshiba

Shinji Sato

Shiro Honda

Masaaki Umehara

Ken Shimizu

Satoshi Matsuba

Hideki Kojima

Hirohumi Tsuchiya

Shinsuke Kimura

A plastic optical fiber is excellent in translucency, heat resistance, resistance to environment and the like, and has highly excellent flexibility. The plastic optical fiber contains a core and at least one layer of cladding, wherein the bending elastic modulus of the innermost layer of the cladding is 20 to 70 MPa, the glass transition temperature of the innermost layer of the cladding is 10&#xb0; C. or lower, and the storage elastic modulus of the innermost layer of the cladding at 30&#xb0; C. is 1&#xd7;10Pa to 4&#xd7;10Pa.

Plastic optical fiber and plastic optical fiber cord

In order to provide an adhesive composition for electronic components that is excellent in adhesion durability under long-term high temperature conditions, thermal cyclability, and insulation reliability, designed is an adhesive composition for electronic components containing a thermoplastic resin (a), an epoxy resin (b), a hardener (c), and an organopolysiloxane (d), wherein the glass transition temperature (Tg) after curing is &#x2212;10&#xb0; C. to 50&#xb0; C. and the rate of change of Tg after heat-treating the composition at 175&#xb0; C. for 1000 hours is 15% or less.

Adhesive composition for electronic components, and adhesive sheet for electronic components using the same

An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, and (III) biphenyl skeleton-containing epoxy resins, as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.

Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for TAB, adhesive-backed tape for wire bonding connection, semiconductor connecting substrate and semiconductor device

An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110&deg; C. after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130&deg; C. and 85% RH with DC 100 V applied; and a tape with adhesive for wire bonding connection consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 120 to 170&deg; C. after having been cured, a storage elastic modulus E&prime; of 20 to 100 MPa at 150&deg; C. and an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130&deg; C. and 85% RH with DC 100 V applied. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.

Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for tab, adhesive-backed tape for wire-bonding connection, semiconductor connecting substrate, and semiconductor device

Disclosed herein is an epoxy resin compound including an epoxy resin (A), a hardener (B), and an inorganic filler, characterized in that said inorganic filler contains silica (C) as an essential component, said hardener (B) is one which contains at least two phenolic hydroxyl groups and/or naphtholic hydroxyl groups in the molecule, and said silica (C) contains 1-99 wt % of synthetic silica and 99-1 wt % of natural fused silica. Disclosed also herein is a semiconductor device having a semiconductor element sealed therein with said epoxy resin compound. The epoxy resin compound does not cause such troubles as short shot, resin peeling, wire breakage, stage shift, and vent clogging at the time of molding. In addition, when used as a sealing material, it yields semiconductor devices which have good reliability at high temperature and high humidity and good resistance to soldering heat.

Semiconductor element sealed with an epoxy resin compound

Epoxy resin composition

Epoxy resin compound

A semiconductor-encapsulating composition comprised of (i) an epoxy resin preferably containing a bifunctional biphenyl-skeletal epoxy resin and/or a bifunctional naphthalene-skeletal epoxy resin, (ii) a curing agent containing 4,4'-dihydroxybiphenyl, and (iii) 70 to 95% by weight, based on the total epoxy resin composition, of a filler.

Semiconductor device-encapsulating epoxy resin composition

Disclosed is a semiconductor-encapsulating epoxy resin composition comprising (A) an epoxy resin. (B) a curing agent, and (C) fused silica which has been surface-treated with a silane coupling agent having a secondary amino group. This composition has a good moldability and reliability, and a good solder dipping stability.

Semiconductor device-encapsulating epoxy resin composition containing

Disclosed is a semiconductor device-encapsulating epoxy resin composition comprising (i) an epoxy resin (A) containing at least one of a bifunctional epoxy resin (a1) having a biphenyl skeleton and a bifunctional epoxy resin (a2) having a naphthalene skeleton, (ii) a curing agent (B), and (iii) a filler containing fused silica (C) having a specified kind and specified mean particle diameter. This composition has an excellent heat resistance of solder, and further reliability after thermal cycles and reliability after solder-bath dipping.

Growing community of inventors

Otsu, Japan

Yasushi Sawamura