Kyocera Corporation

Yasushi Oode

Hiroki Ito

Noritaka Niino

Yoshimasa Sugimoto

Takuya Hayashi

Shogo Matsunaga

A measurement sensor package and a measurement sensor reduce susceptibility to noise and enable highly accurate measurement. A measurement sensor package includes a substrate. The substrate includes a first recess including a first bottom surface on which a light emitter is mountable, and a first step surface having a first connection pad thereon, a second recess including a second bottom surface on which a light receiver is mountable, and a second step surface having a second connection pad thereon. In a direction connecting a center of the first bottom surface and a center of the second bottom surface in a plan view, the first step surface is located outward from the first bottom surface and the second step surface is located outward from the second bottom surface.

Measurement sensor package and measurement sensor

A measurement sensor package and a measurement sensor reduce susceptibility to noise and enable highly accurate measurement. A measurement sensor package () includes a substrate (), a lid (), and a ground conductor layer (). The substrate () contains a light emitter and a light receiver, and includes a substrate body (), a plurality of ground via conductors (), an frame-shaped ground conductor layer (), signal wiring conductors (), and an external connection terminal (). The ground via conductors () are connectable to a ground potential, and are located outward from a first recess () and a second recess () included in the substrate body () in a plan view.

A measurement sensor package and a measurement sensor improve reliability in strength and other aspects. A measurement sensor package includes a substrate, a lid, a ground conductor layer, a metallic thin layer, and a bond. The ground conductor layer and the metallic thin layer are arranged inside the bond that extends continuously as viewed through from above. The bond directly bonds a first main surface of a substrate body and a facing surface of the lid together along the entire periphery. This improves the reliability in strength.

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Kirishima, Japan

Yasushi Oode