Hitachi, Ltd.

Yasushi Neho

Tsuyoshi Nakagawa

Kenichi Saito

Masahito Suzuki

Kenichi Nagashima

Shigeo Ohashi

Naoyuki Sakamoto

Yukiko Iwama

Hitoshi Matsushima

Tadakatsu Nakajima

Yoshihiro Kondo

Shinji Matsushita

Susumu Iwai

Masaaki Eishima

Tatsuhiko Matsuoka

Yoshito Ohmura

Katsuhiro Arakawa

Hajime Yamagami

Daichi Hotta

Masato Kurita

Atsuhiko Urushihara

Koji Suso

Yukinobu Maruyama

Yoshiaki Amano

Rintaro Minamitani

Taisuke Kashima

Kenichi Saitou

Isshu Nakajima

Asako Katayama

Noriyoshi Ogura

Fumihito Takei

Tooru Kiyota

Yuichi Kondo

Electronic computer

An electronic device has a first case which houses a part of a liquid cooling system and mounted components, and a second case which houses the other part of the liquid cooling system. In one example, the second case houses and a display unit. In an all-in-one computer example, the second case may serve as the access lid. In the electronic device, the liquid cooling system has a pump which feeds cooling liquids a heat block which receives heat from an electronic component, a pipe which transfers heat from the liquid to a heat sink, and a tube which connects these parts with one another. The first case has a first board mounted with the electronic component over a part of the liquid cooling system. Methods of manufacturing electronic devices with such cooling systems also are disclosed.

Electric device with liquid cooling system and method of manufacturing thereof

An electronic device capable of preventing air from entering a pump for circulating a cooling medium is provided in a small-sized electronic computer provided with a liquid cooling system, which has a liquid cooling construction for circulating a cooling liquid with the use of a power source and for cooling a high temperature part of with the cooling liquid. The electronic device of the invention comprises a gas entering preventing mechanism provided in a part of a circulating path, through which the cooling liquid circulates, to prevent air from entering the power source.

Electronic device, liquid cooling system and tank

In an information processing apparatus such as a space-saving type personal computer having a liquid-cooling type cooling system, the presence of a cooling liquid, the presence of a frozen state of the cooling liquid and the temperature of the cooling liquid are detected. When a freeze of the cooling liquid is detected, a CPU is throttled down to defrost the cooling liquid, or the cooling liquid is heated to be prevented from being frozen. Alternatively, a warning of detection of a freeze may be displayed. Alternatively, activation of the system may be stopped or operation of the system may be interrupted. By such measures, system failure is prevented from being caused by leaking, shortage, freezing, etc. of the cooling liquid.

Method of controlling cooling system for a personal computer and personal computer

In a liquid-cooling system for a notebook personal computer having a body part including a CPU and a chip set respectively mounted on a mother board and an HDD, and a display part rotatably supported by the body part, a heat receiving head is fixed to at least one heat generation part including the CPU. A tube filled with cooling liquid is connected to the heat receiving head. The tube connected to the heat receiving head is disposed in series on at least one heat generation part including the chip set so as to collect the heat generated from each heat generation part. The tube is also laid in a meandering or zigzagging pattern between a liquid crystal panel and a housing of the display part. The heat generated from each heat generation part is absorbed at part of the tube by the cooling liquid that circulates in the tube and functions as a heat transfer medium. The absorbed heat is then radiated at another part of the tube. Consequently, the heat generated from the chip set including the CPU and other heat sources such as the HDD can be radiated together to the outside. Local temperature rising is prevented. An uniform temperature environment is attained on all the surfaces of the body part.

Liquid cooling system for notebook computer

In a liquid-cooling system for a notebook personal computer having a body part including a CPU and a chip set respectively mounted on a mother board and an HDD, and a display part rotatably supported by the body part, a heat receiving head is fixed to at least one heat generation part including the CPU. A tube filled with cooling liquid is connected to the heat receiving head. The tube connected to the heat receiving head is disposed in series on at least one heat generation part including the chip set so as to collect the heat generated from each heat generation part. The tube is also laid in a meandering or zigzagging pattern between a liquid crystal panel and a housing of the display part. The heat generated from each heat generation part is absorbed at part of the tube by the cooling liquid that circulates in the tube and functions as a heat transfer medium. The absorbed heat is then radiated at another part of the tube. Consequently, the heat generated from the chip set including the CPU and other heat sources such as the HDD can be radiated together to the outside.

Notebook computer having a liquid cooling device

Portable computer

A personal computer including a bottomed case, a keyboard, a top cover forming with said keyboard, an upper face covering said bottomed case, and a heat dissipation structure disposed between the upper face and the bottomed case. The heat dissipation structure includes a printed circuit board having a current consuming device mounted thereon, a first heat dissipation plate disposed under the keyboard, and a first heat conductive block coupled to the first heat dissipation plate and the printed circuit board. The heat conductive block conducts heat generated by the current consuming device to the first heat dissipation plate. The heat dissipation structure further includes a second heat dissipation plate disposed on the bottomed case, and a second heat conductive block coupled to the second heat dissipation plate and the printed board, wherein the second heat conductive block conducts the heat generated by the current consuming device to the second heat dissipation plate.

Heat dissipation structure for a personal computer including two heat

A personal computer comprises a heat dissipation plate installed on a floor of its case, a motherboard disposed apart from the heat dissipation plate by a predetermined distance, and a daughter board disposed in such a manner that the motherboard is positioned between the heat dissipation plate and the daughter board. The daughter board is mounted with a central processing unit which generates heat. The motherboard is provided with a hole. A heat dissipation block extends from the heat dissipation plate through the hole in the motherboard, and is connected to the central processing unit through a heat conductive coupler. This forms a heat dissipation path which passes through the central processing unit, the heat dissipation block, the heat dissipation plate, and the case. In addition, another heat dissipation block is interposed between a keyboard and the daughter board so that another heat dissipation path can be formed through the central processing unit, another heat dissipation block, another heat dissipation plate, and the keyboard.

Heat dissipation structure for electronic equipment including two heat

A personal computer comprises a heat dissipation plate installed on a floor of its case, a motherboard disposed apart from the heat dissipation plate by a predetermined distance, and a daughter board disposed in such a manner that the motherboard is positioned between the heat dissipation plate and the daughter board. The daughter board is mounted with a central processing unit which generates heat. The motherboard is provided with a hole. A heat dissipation block extends from the heat dissipation plate through the hole in the motherboard, and is connected to the central processing unit through a heat conductive coupler. This forms a heat dissipation path which passes through the central processing unit, the heat dissipation block, the heat dissipation plate, and the case. In addition, another heat dissipation block is interposed between a keyboard and the daughter board so that another heat dissipation path can be formed through the central processing unit, another heat dissipation block, another heat dissipation plate, and the keyboard. A heat pipe may be connected to a heat dissipation plate.

Heat dissipation structure in a portable computer including a heat

Growing community of inventors

Atsugi, Japan

Yasushi Neho