Nippon Steel Corporation

Olympus Corporation

Hitachi, Ltd.

Nippon Sheet Glass Company, Limited

Hitachi Engineering Co., Ltd.

Nippon Kinzoku Co., Ltd.

Yasushi Nakamura

Keiji Tsunetomo

Yasuhiro Saito

Shinya Okamoto

Hirotaka Koyo

Takeshi Hidaka

Akihiro Koyama

Junji Kurachi

Shigeo Kuboki

Norihiko Sugimoto

Masahiro Ueno

Yoshiaki Ito

Masato Murakami

Kiyoshi Nakata

Hiroaki Kasai

Masamichi Hijino

Takamasa Ohno

Michihisa Itou

Toshihiko Tominaga

Kazuhisa Inada

Mikio Yamanaka

Masaki Izumi

Tomoaki Aoki

Keiichi Ohmura

Takeshi Harakawa

Shunji Inada

Hiroyuki Katayama

Tomonori Imamura

Toshiyuki Yashiro

Hiroo Suzuki

Hidetake Ishikawa

Takeshi Shinomiya

Hiroyuki Kajioka

Mitsuo Uchimura

Tetsu Sugiura

Eiki Kondoh

Michihisa Ito

Kazuumi Harashima

Makoto Inatomi

Yasunari Nagaike

Akikazu Sato

Tsutomu Mori

Motohiko Arakawa

Syunji Inada

Masataka Ayata

Yasuhiro c/o Nippon Sheet Glass Co Ltd Saito

Akihiro c/o Nippon Sheet Glass Co Ltd Koyama

Hirotaka c/o Nippon Sheet Glass Co Ltd Koyo

Junji c/o Nippon Sheet Glass Co Ltd Kurachi

Shinya c/o Nippon Sheet Glass Co Ltd Okamoto

Keiji c/o Nippon Sheet Glass Co Ltd Tsunetomo

A glass substrate processing method includes irradiating laser light L onto a glass substratesuch that the laser light L is focused within the glass substrate, thereby forming a high density areathat has a higher density than areas where the laser light L is not irradiated around the portion where the laser light L is focused; and performing chemical etching on the glass substrateusing an etching solution such that at least a portion of the high density area is allowed to remain, thereby forming a projectionon a surfaceof the glass substrate

Glass substrate processing method and glass component

The present invention improves a method of forming a surface unevenness using a difference in etching rates, and relaxes limitations on substrates in this method. In a method of the present invention, an uneven surface is formed by a method including applying pressure to a predetermined region in a surface of a thin film formed on a substrate, and etching a region including at least a portion of the predetermined region and at least a portion of the reminder of the surface that excludes the predetermined region. An etching rate difference within the thin film increases freedom in selecting a substrate material.

Method of manufacturing article having uneven surface

A processing method for glass substrate of the present invention includes: applying heat and external force to a glass substrate and then cooling it down to thereby form a compression stressed part having a different etching rate from that of other parts with respect to an etching reagent to be used, on the surface of the glass substrate and in the vicinity thereof, and performing chemical etching using the etching reagent on the glass substrate having the compression stressed part formed thereon, so as to form a relief on the surface of the glass substrate.

Processing method for glass substrate, processed glass product and stress applying apparatus

An apparatus for measuring a surface profile of an object to be measured includes a measuring probe positioned to contact the surface of the object to be measured, a guide mechanism for supporting and guiding the measuring probe in an axial direction of the measuring probe, a tilt angle adjustment mechanism for tilting the guide mechanism at a predetermined tilt angle with respect to a horizontal direction so that the measuring probe contacts the surface of the object to be measured with a predetermined contact force, and a drive mechanism for relatively driving at least one of the measuring probe and the object to scan the surface of the object to be measured with the measuring probe. The contact force is derived from a tilt direction component of the gravity of the measuring probe generated when the measuring probe is tilted.

Apparatus for measuring a surface profile

In a data communication adapter apparatus for a digital data communication connected between a signal transmission path for transmitting both receive data and transmit data, and a host processor unit for producing frame data to output the frame data therefrom, an internal host bus is newly employed in the data communication apparatus irrelevant to the employment of a CPU dedicated bus, and the transmission/reception data generated and interpreted by the host processor is transferred via the internal host bus, a bus interface, and a system data bus between a transmission memory or a reception memory and a buffer memory. Furthermore, a reception memory (host dedicated reception memory) for storing only the reception data to be interpreted by the host processor is separately provided with another reception memory (CPU dedicated reception memory) for storing only the reception data to be interpreted by a CPU, one reception data to be interpreted by the CPU is once transferred from the transmission/reception control unit to the CPU dedicated memory and thereafter read out via the CPU dedicated bus under the control of the CPU, and the other reception data to be interpreted by the host processor is one stored in the host dedicated reception memory and then read out via the internal host bus and bus interface under the control of the host processor.

Data communication adapter and data communication terminal apparatus for

In a program control apparatus with a program ROM which forms sequence control signals for executing various control actions according to specified conditions, a memory circuit is provided which is activated during a particular operation mode to successively store information corresponding to the external conditions and also information on times taken by the operation sequence of the program control apparatus.

Program control apparatus incorporating a trace function

A known Ti-Ni based and Cu-based shape memory alloy can be replaced by an Fe-based shape memory alloy. An excellent shape memory effect is attained by an Fe-based shape memory alloy with an Mn content of 20% to 40% and an Si content of 3.5% to 8%.

Shape memory alloy and method for producing same

In a carrier for a catalyst for purifying exhaust gas, a honeycomb is formed by coiling a corrugated sheet and a flat sheet together, and is mounted in an outer cylinder. An Al (alloy)-clad foil or hot-dip Al (alloy) galvanized foil is used to form the honeycomb, which is heat treated in a vacuum or a reducing atmosphere to simultaneously bond the corrugated sheet and flat sheet together and also bond the honeycomb to the outer cylinder, and to diffuse Al into the foil.

Method for producing a base of a catalyst carrier for automobile exhaust

A carbon-unsaturated molten metal or molten alloy containing elements more oxidizable than iron such as chromium and silicon is dephosphorized by addition of a flux composition comprising calcium carbide and a halide of alkali earth metal such as calcium fluoride in a non-oxidizing atmosphere, and thereafter the slag as a by-product is stabilized against formation of undesirable gases. This method when employed in refining ferrochromium or crude stainless steel makes feasible dephosphorization, and it is particularly suited for economical production of low phosphorus stainless steel.

Method of dephosphorization of metal or alloy

A low-carbon ferrochrome alloy containing a decreased amount of nitrogen can be made by this method. This method is conducted in a hydrogen stream and does not necessitate use of vacuum technique. A product of high purity can be obtained relatively simply and economically.

Method for decreasing the amount of carbon and nitrogen contained in the

Cr alloy, Mn alloy or Mo alloy can be dephosphorized and denitrified simultaneously with a flux newly prepared. The flux comprises metallic Ca, Mg, Ba or Sr and halides thereof. There is no loss of valuable alloying component in this method.

Method for dephosphorization and denitrification of an alloy containing

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Tokyo, Japan

Yasushi Nakamura