Sumitomo Electric Industries, Limited

Sumitomo Electric Printed Circuits, Inc.

Yasushi Mochida

Takao Nishioka

Toru Maeda

Koji Nitta

Shoichiro Sakai

Yoshio Oka

Junichi Okaue

Tadahiro Kaibuki

Koji Mimura

Kazuyuki Maeda

Masahiro Nakayama

Masato Irikura

Osamu Komura

Akira Kuibira

Kentaro Yoshida

Haruhisa Toyoda

Akira Yamaguchi

Tomoharu Takeyama

Jin-Joo Park

Kazuhiro Goto

Kikuo Senoo

Mizuo Iwasaki

Mitsuyasu Ueda

A flexible printed circuit board includes a base film having an insulating property and a plurality of interconnects laminated to at least one surface side of the base film. The plurality of interconnects includes a first interconnect and a second interconnect in a same plane. An average thickness of the second interconnect being greater than an average thickness of the first interconnect. A ratio of the average thickness of the second interconnect to the average thickness of the first interconnect is greater than or equal to 1.5 and less than or equal to 50. The first interconnect includes a first conductive underlayer and a first plating layer, and the second interconnect includes a second conductive underlayer, a second plating layer, and a third plating layer.

Flexible printed circuit board and method of manufacturing flexible printed circuit board

A flexible printed circuit board includes a base film having an insulating property, and one or more interconnects laminated to at least one surface side of the base film. At least one of the one or more interconnects includes, in a longitudinal direction, a first portion and a second portion that is a portion other than the first portion, an average thickness of the second portion being greater than an average thickness of the first portion. A ratio of the average thickness of the second portion to the average thickness of the first portion is greater than or equal to 1.5 and less than or equal to 50.

A flexible printed circuit board includes a base film having an insulating property, and multiple interconnects laminated to at least one surface side of the base film. The multiple interconnects include a first interconnect and a second interconnect in a same plane. An average thickness of the second interconnect is greater than an average thickness of the first interconnect. A ratio of the average thickness of the second interconnect to the average thickness of the first interconnect is greater than or equal to 1.5 and less than or equal to 50.

A molten salt battery includes an electrode group which includes a first electrode, a second electrode, and a separator electrically insulating the first electrode and the second electrode; a molten salt electrolyte; a bottomed case which houses the electrode group and the molten salt electrolyte, the bottomed case having an opening; a cover plate which seals the opening of the case; a first external terminal of the first electrode and a second external terminal of the second electrode which are provided on the cover plate; a bus bar component fixed to the first external terminal; a first insulating part which is interposed between the first external terminal and the bus bar component so as to electrically insulate the bus bar component and the first external terminal; a thermal fuse component which is electrically connected to the bus bar component and the first external terminal and provides electrical continuity between the bus bar component and the first external terminal when the ambient temperature is lower than a reference temperature T; and a fixing member which fixes the thermal fuse component to the cover plate in such a state that the thermal fuse component is in contact with or in close vicinity to the surface of the cover plate. The molten salt battery is configured such that a charge current is input from the bus bar component to the first external terminal through the thermal fuse component.

Molten salt battery

Provided are a nonaqueous-electrolyte battery in which short circuits between the positive- and negative-electrode layers can be suppressed with certainty and a method for producing the battery. A nonaqueous-electrolyte batteryincludes a positive-electrode active-material layercontaining a Li-containing oxide; a negative-electrode active-material layeron which deposition of Li metal can occur; and a sulfide-solid-electrolyte layer (SE layer)disposed between these active-material layersand. The SE layerof the nonaqueous-electrolyte batteryincludes a powder-formed layerand a dense-film layerformed on a surface of the powder-formed layerby a vapor-phase process. In the nonaqueous-electrolyte battery, the powder-formed layeris formed by a compression-molding process on a positive-electrode body including the positive-electrode active-material layerand the dense-film layeris then formed by a vapor-phase process on the positive-electrode body that is provided with the powder-formed layerand serves as a substrate.

Nonaqueous-electrolyte battery and method for producing the same

A soft magnetic material includes a plurality of composite magnetic particles () each including a metal magnetic particle () and an insulation coating () covering the surface of the metal magnetic particle (), wherein the insulation coating () contains Si (silicon), and 80% or more of Si contained in the insulation coating constitutes a silsesquioxane skeleton. Therefore, it is possible to effectively decrease a hysteresis loss while suppressing an increase in eddy-current loss.

Soft magnetic material, powder magnetic core, method for manufacturing soft magnetic material, and method for manufacturing powder magnetic core

A soft magnetic material includes a plurality of composite magnetic particles each including a metal magnetic particle and an insulating coating film covering the metal magnetic particle. Each of the plurality of composite magnetic particles has a ratio Rof a maximum diameter to a circle-equivalent diameter of more than 1.15 and not more than 1.35. The insulating coating film is composed of a thermosetting organic material and has a pencil hardness of 5H or higher after thermosetting. With this material, an eddy current loss can be reduced, and a compact with a high strength can be formed.

Soft magnetic material and dust core produced therefrom

A soft magnetic material includes a plurality of composite magnetic particles () having metallic magnetic particles () that are composed of pure iron, and an insulation film () that surrounds the surface of the metallic magnetic particles (), wherein the manganese content of the metallic magnetic particles () is 0.013 mass % or less, and is more preferably 0.008 mass % or less. Hysteresis loss can thereby be effectively reduced.

A nitride semiconductor substrate having a rugged surface being lapped by whetting granules to roughness between Rms5 nm and Rms200 nm, which has a function of reducing dislocations of a GaN, InGaN or AlGaN layer epitaxially grown on the lapped substrate by gathering dislocations in the epi-layer to boundaries of holes, pulling the dislocations to bottoms of the holes. Higher roughness of the nitride substrate degrades morphology of an epitaxially-grown layer thereon but reduces dislocation density to a lower level. Morphology of the epi-layer contradicts the dislocation density of the epi-layer. The nitride semiconductor substrate can reduce dislocation density and can be low cost and useful substrates.

Nitride semiconductor substrate and method of producing same

Provided is a diamond-coated sliding part that is light, has excellent abrasion resistance, that prevents abrasion of the material of an opposite member, and that is effective in reducing power loss. This sliding part is especially useful as an adjusting shim for the valve train mechanism of an internal combustion engine such as an automobile engine in which the base material is silicon nitride or sialon and this base material surface is coated with a diamond coating layer. By performing finish processing on only a small part of peaks of diamond particles protruding from the surface of the diamond coating layer to reduce the height of the protrusions, or by controlling film forming conditions, etc., the profile bearing length ratio (t ) at a cutting level of 0.1 &mgr;m for the sliding surface of the diamond coating layer is made 60% or greater.

Diamond-coated sliding part

A fuel injection pump for high pressure injecting gasoline, fuel whose main component is gasoline or light oil having a sulfur content of 0.05% by weight or less by a reciprocation of a piston sliding relative to a cylinder, wherein at least a sliding surface of the piston to slide on the cylinder is made of ceramic and the surface roughness thereof, expressed in ten-point mean surface roughness R,, is 0.05-0.4 &mgr;m in a direction perpendicular to the sliding direction and 0.2-0.6 &mgr;m in a direction parallel to the sliding direction while the surface roughness expressed in the ten-point mean surface roughness R,of a cylinder sliding surface corresponding thereto is 0.2-0.8 &mgr;m in a direction parallel to the sliding direction. By using the above combination of piston and cylinder, the wear resistance of the piston and cylinder is improved, the durability thereof is improved and the production cost can be largely reduced.

Fuel injection pump

Combination of shim and cam

A silicon nitride ceramic sliding material comprising silicon nitride crystal grains and a grain boundary phase and having a porosity of 2 to 10% and a maximum pore size of 20 to 100 .mu.m. The silicon nitride ceramic sliding material preferably has a textural structure wherein the proportion of the total area of silicon nitride crystal grains of 0.1 to 10 .mu.m.sup.2 in area to the total area of all the silicon nitride crystal grains present in an arbitrary two-dimensional cross section is 30 to 90% and the proportion of the number of silicon nitride crystal grains of 2 to 10 in aspect ratio to the number of all the silicon nitride crystal grains present in that cross section is at least 20%. The material is produced by mixing a silicon nitride powder with a sintering aid powder, molding the resulting mixture, then heat-treating the resulting molded body in a nitrogen-containing atmosphere under reduced pressure at 1,000 to 1,500.degree. C., and then sintering it in a nonoxidizing atmosphere under ordinary pressure or under pressure, at 1,550 to 1,800.degree. C.

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Osaka, Japan

Yasushi Mochida