Mitsui Chemicals, Inc.

Sharp Kabushiki Kaisha Corporation

Osaka University

Sharp Corporation

Earth Corporation

Yasushi Mizuta

Yuichi Ito

Fumito Takeuchi

Yugo Yamamoto

Yuichi Itou

Toshikazu Gomi

Satoru Suda

Kei Nagata

Tsuyoshi Inoue

Makoto Nakahara

Takatoshi Kira

Katsunori Nishiura

Daisuke Ikesugi

Kei Ohkubo

Takahisa Miyawaki

Tadashi Kitamura

Takeharu Isaki

Yoshio Kikuta

Kiyoto Takamori

Masako Yoshida

Masahiro Ota

Yasushi Takamatsu

Kenichi Yashiro

Kenji Itou

Hiroyuki Asakura

Tatsuji Murata

The present invention provides a new method by which polymers can be modified. The present invention provides a method for modifying a polymer including the step of: irradiating a reaction system containing a polymer with light to react the reaction system in a presence of a compound radical, wherein the compound radical is a radical containing one element selected from the group consisting of Group 15 elements and Group 16 elements, and a Group 17 element.

Method for modifying polymer, method for producing modified polymer using the same, and modified polymer

Disclosed are: a reinforcing fiber bundle with excellent mechanical property and handling property, which contains a propylene-based resin (A), a propylene-based resin (B) comprising at least a carboxylic acid salt bonded to the polymer chain, and a reinforcing fiber (C) wherein the propylene-based resin (A) comprises more than 70% by mass but not more than 100% by mass of a component (A-1) having a weight average molecular weight of 150,000 or more, the amount of the propylene-based resin (B) is 3 to 50 parts by mass per 100 parts by mass of the propylene-based resin (A), and the total content rate of the propylene-based resin (A) and the propylene-based resin (B) is 0.3 to 5% by mass in the whole reinforcing fiber bundle; and a molding material comprising the reinforcing fiber bundle and a matrix resin.

Reinforcing fiber bundle and molding material

The present invention provides an adhesive composition which has a cured product exhibiting high transparency and a high refractive index, and which has high adhesive strength and experiences little reduction in the adhesive strength, even when exposed to high temperatures. In order to achieve the above the adhesive composition includes: (1) a hydrocarbon polymer having a total light transmittance of visible light, as measured according to JIS K7361-1, of at least 80%; (2) at least one kind of (meth)acrylic monomer selected from a mono(meth)acrylic monomer having one (meth)acrylic group in a molecule and a di(meth)acrylic monomer having two (meth)acrylic groups in a molecule; and (3) a photoinitiator; wherein 30-190 parts by weight of component (2) are included relative to 100 parts by weight of component (1).

Adhesive composition and image display device using same

Disclosed is a photocurable resin composition which is highly sensitive to ultraviolet light or visible light having a long wavelength, in particular a photocurable resin composition which is useful as a sealing agent. Specifically disclosed is a photocurable resin composition containing a component (a) which is composed of an anthraquinone derivative represented by the formula (I) below, and a component (b) which is composed of a compound having a (meth)acryloyl group in the molecule. The photocurable resin composition is characterized in that a part or the entire of the component (b) further contains an oxiranyl group in the molecule, and the component (a) content is 0.01-10% by mass relative to the component (b) content. [chemical formula 1] (I) (In the formula (I), X represents a phenyl group, an alkyl group having 1-8 carbon atoms, an alcoholic form of the phenyl group or the alkyl group, or a derivative of the alcoholic form.)

Photocurable resin composition containing anthraquinone derivative

The invention provides a cation polymerizable resin composition excellent in curing properties and corrosion resistance with less resin coloration and less cure shrinkage, which is a material suitable as a surface protective material for optical disk. Specifically, the cation polymerizable resin composition comprises an epoxy compound (A) as an essential ingredient represented by formula 1 wherein Rand Reach represent a saturated or unsaturated carbon atom, and Rrepresents a hydrogen atom or a saturated or unsaturated carbon atom, a cation polymerizable compound (B) other than the epoxy compound represented by formula 1, a photo cation polymerization initiator (C) and a photo radical polymerization initiator (D).

Photo cation polymerizable resin composition and surface protective material for optical disk

It has been discovered that an initiation reaction is efficiently progressed to a propagation reaction by adding a compound that potentially or directly generates a carbocation to the polymerization system of a cationic ring-opening polymerizable compound, and thus the activation of polymerization is rendered. Namely, the present invention relates to a cationic polymerizable resin composition which is characterized by comprising (A) a compound having at least one functional group capable of cationic ring-opening polymerization in one molecular chain, (B) a cationic polymerization initiator, and (C) a compound to generate a carbocation by the action of active species generated from (B) the cationic polymerization initiator by electromagnetic wave or particle beam. According to the present invention, it has been discovered that the initiation reaction is efficiently progressed to the propagation reaction by adding the compound that potentially or directly generates a carbocation to the polymerization system of the cationic ring-opening polymerizable compound, and thus the activation of polymerization is rendered.

Cationic polymerizable resin composition

A liquid crystal sealing agent composition that is a one-component light and heat-curable resin composition containing: (1) a solid epoxy resin having a ring and ball method softening temperature of 40&#xb0; C. or above; (2) an acrylate monomer and/or a methacrylate monomer, or an oligomer thereof; (3) a thermoplastic polymer having a ring and ball method softening temperature of 50 to 120&#xb0; C., the thermoplastic polymer being obtained by copolymerizing an acrylate monomer and/or a methacrylate monomer with a monomer copolymerizable therewith; (4) a light-activated radical polymerization initiator; and (5) a latent epoxy curing agent. The light and heat curable liquid crystal sealing agent composition is employable in one drop fill, is excellent in properties of a cured product particularly after first-stage light curing, achieves stable cell gap after cell gap formation, permits prevention of contamination of the liquid crystal in second-stage heat curing, is excellent in curing properties in shaded area, and shows superior bonding reliability.

Liquid crystal sealing agent composition and manufacturing method of liquid crystal display panel using the same

A photocurable resin composition comprises a cationic polymerizable compound (A), an acrylic resin (B) and a cationic photopolymerization initiator (C), in which the acrylic resin (B) has a cationic polymerizable functional group, and the content of the component (A) is 30 to 95 parts by mass and the content of the component (B) is 5 to 70 parts by mass, based on 100 parts by mass of the total amount of the components (A) and (B). In addition, the functional group of the acrylic resin (B) preferably contains at least one of a cyclic ether group, a vinyloxy group, an acid adduct of a vinyloxy group, and an active hydrogen group, with the active hydrogen group preferably being a hydroxyl group. The photocurable resin composition has sufficient curability and sufficient adhesiveness to rigid plastics such as polycarbonate and PET having poor adhesive property.

Photocurable resin composition and resin composition for plastics comprising the same

It is an object of the present invention to provide a photo-curable resin composition which provides a sealing agent for a flat panel display with good moisture permeation resistance and excellent adhesion. The present inventors have conducted extensive studies to solve the above-described problems, and as a result, they have found a photo-curable resin composition which comprises a cationic photopolymerization initiator (A), a cationically polymerizable compound (B), a cyclic polyether compound (C) and another organic compound (D), wherein the amount of (B) is 1.0 to 99.9% by mass and the amount of (C) is 0.0 to 10.0% by mass, both based on the sum of (B), (C) and (D), and the sum (F) of the fluorine atoms in a fluorine-containing organic compound is 0.0 to 40.0% by mass, based on the sum of (B), (C) and (D), and wherein at least 1/1000 mass ratio of the (B) component is a compound containing an oxetanyl group, and both of the contents of (C) and (F) are not 0.0% by mass at the same time.

Photo-curable resin composition and sealing agent for flat panel display using the same

An ionic compound comprising a cationic portion having a hydroxyl group and/or a carboxylic acid group and an anionic portion of the formula (1):[BR]&#x2003;&#x2003;(1)wherein R may be the same or different and represents a phenyl group substituted with F or CF. Preferably, the anionic portion is [B(CF)], [B(CHCF)]or [B(CHF)]. In other aspects, a radiation polymerization initiator and a resin composition comprising the ionic compound are provided. A resin composition prepared by using the radiation polymerization initiator generates a small amount of outgas during reaction and has excellent reactivity and transparency.

Ionic compound, resin composition containing the same and use thereof

Pastes for circuit connections and anisotropic conductive pastes that are excellent in storage stability and dispenser application properties, can be free of voids, bubbles and bleeding on thermocompression bonding and can give cured products having high bonding and connection reliability at high temperatures and high humidity, and the ability to be repaired. The paste for circuit connection contains an epoxy resin, an acid anhydride curing agent or a phenolic curing agent, and high-softening point fine particles. The anisotropic conductive paste additionally contains conductive particles. The method of using the paste for circuit connection or the anisotropic conductive paste involves connecting an electric circuit wiring formed on a substrate with an electric circuit wiring formed on another substrate with the paste for circuit connection or the anisotropic conductive paste.

Growing community of inventors

Sodegaura, Japan

Yasushi Mizuta