Shin-etsu Handotai Co., Ltd.

Yasushi Mizusawa

Hiroji Aga

Isao Yokokawa

Tsuyoshi Ohtsuki

Satoshi Tobe

An evaluation method of a silicon epitaxial wafer, including using a photoluminescence (PL) measuring apparatus to measure a PL spectrum of the mirror wafer and adjusting the apparatus so emission intensity of a TO-line becomes 30000 to 50000 counts, irradiating the silicon epitaxial wafer with an electron beam, measuring PL spectrum from an electron beam irradiation region, and sorting out and accepting a silicon epitaxial wafer which has emission intensity resulting from a CCdefect of the PL spectrum being 0.83% or less of the emission intensity of the TO-line and from a COdefect being 6.5% or less of the emission intensity of the TO-line.

Evaluation method of silicon epitaxial wafer

A method for evaluating a carbon concentration where ions of a predetermined element are implanted into a silicon wafer, and then a carbon concentration is measured by a low-temperature PL method from an emission intensity of a CiCs composite, where the ions are implanted under implantation conditions of 1.1&#xd7;10&#xd7;[atomic weight of the implanted element]&#x3c;implantation amount (cm)&#x3c;4.3&#xd7;10&#xd7;[atomic weight of the implanted element], and the carbon concentration is evaluated. A method for evaluating a carbon concentration makes it possible to measure with high sensitivity, a carbon concentration in a surface layer of 1 to 2 &#x3bc;m, which is a photodiode region in an image sensor.

Method for evaluating carbon concentration

A method for manufacturing a silicon epitaxial wafer includes: preparing a test silicon wafer in advance, forming the multilayer film on a surface of the test silicon wafer, and measuring a warp direction and a warp amount (Warp) W of the silicon wafer having the multilayer film formed thereon; and selecting a silicon wafer as a device formation substrate and conditions for forming an epitaxial layer which is formed on the silicon wafer as the device formation substrate in such a manner that a warp which cancels out the measured warp amount W is formed in a direction opposite to the measured warp direction, and forming the epitaxial layer on a surface of the selected silicon wafer as the device formation substrate where the multilayer film is formed under the selected conditions for forming the epitaxial layer.

Method for manufacturing silicon epitaxial wafer and method for manufacturing semiconductor device

A manufacturing method of a silicon epitaxial wafer having an epitaxial layer grown on a mirror wafer of silicon, including: using a PL measuring apparatus to measure photoluminescence (PL) spectrum of the mirror wafer and adjusting the apparatus so emission intensity of a TO-line becomes 30000 to 50000 counts, irradiating the silicon epitaxial wafer with an electron beam, measuring PL spectrum from an electron beam irradiation region, and sorting out and accepting a silicon epitaxial wafer which has emission intensity resulting from a CCdefect of the PL spectrum being 0.83% or less of the emission intensity of the TO-line and from a COdefect being 6.5% or less of the emission intensity of the TO-line. The method enables sorting out a silicon epitaxial wafer which realizes a negligible level of white flaw failures in case of manufacturing an imaging element with the use of the silicon epitaxial wafer.

Manufacturing method and evaluation method of silicon epitaxial wafer

A method for calculating a warpage of a bonded SOI wafer includes: assuming that the epitaxial growth SOI wafer is a silicon single crystal wafer having the same dopant concentration as dopant concentration of the bond wafer; calculating a warpage A that occurs at the time of performing the epitaxial growth relative to the assumed silicon single crystal wafer; calculating a warpage B caused due to a thickness of the BOX layer of the epitaxial growth SOI wafer; determining a measured value of a warpage of the base wafer before bonding as a warpage C; and calculating a sum of the warpages (A+B+C) as the warpage of the bonded SOI wafer.

Method for calculating warpage of bonded SOI wafer and method for manufacturing bonded SOI wafer

The present invention provides a method for forming an oxide film on a silicon wafer, comprising: measuring surface roughness of the silicon wafer and/or crystallinity in a surface layer portion of the silicon wafer in advance; adjusting oxidizing conditions for the silicon wafer based on the measurement value; and forming the oxide film on the silicon wafer under the adjusted oxidizing conditions. As a result, there can be provided the method for forming an oxide film by which the oxidizing conditions can be adjusted based on a state of the surface and/or the surface layer of the silicon wafer before forming the oxide film and even an ultrathin oxide film can be thereby accurately formed.

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Annaka, Japan

Yasushi Mizusawa