Hitachi Chemical Company, Ltd.

Yasushi Kumashiro

Kazunori Yamamoto

Yasushi Shimada

Teiichi Inada

Hiroyuki Kuriya

Maki Inada

Hideo Nakako

Naoki Maruyama

Kyoko Kuroda

Aizo Kaneda

Akira Kageyama

Yoshinori Ejiri

Katsuyuki Masuda

Keiji Sumiya

Yoshihiro Nomura

Takeo Tomiyama

Kazuhisa Otsuka

Hiroshi Kirihara

Yuko Tanaka

Takaaki Noudou

Yoichi Hosokawa

Shunya Yokosawa

Yoshitaka Hirata

Atsushi Takahashi

Naoyuki Urasaki

Shin Takanezawa

Akishi Nakaso

Nozomu Takano

Shigeharu Arike

Kazuhito Kobayashi

Daisuke Fujimoto

Youichi Machii

Koji Morita

Shunya Yokozawa

Takahiro Tanabe

The invention provides a composition set comprising: a conductor layer-forming composition comprising a dispersing medium and inorganic particles comprising a metallic oxide; and a conductive adhesive composition comprising a binder and conductive particles having a number average particle size of from 1 nm to 3000 nm.

Composition set, conductive substrate and method of producing the same, and conductive adhesive composition

There is provided a liquid composition that can form a resistor exhibiting a stable resistance value. One mode of the liquid composition of the invention is a liquid composition comprising (a) an epoxy resin, (b) carbon black particles, (c) carbon nanotubes and (d) a solvent with a vapor pressure of less than 1.34&#xd7;10Pa at 25&#xb0; C.

Liquid composition, and resistor film, resistor element and circuit board

An etching material including at least one boron compound selected from a Lewis acid that includes, in its structure, boron and a halogen that is bonded to the boron, a salt of the Lewis acid and a compound that generates the Lewis acid.

Etching material

Disclosed are: a copper metal film which has good adhesion to a substrate, low volume resistivity, and good deep-part metal properties; and a method for producing a copper metal film, wherein the copper metal film can be produced by reducing a substrate to a deep part thereof without damaging the substrate. Specifically disclosed is a copper metal film obtained by treating a copper-based particle deposition layer containing both copper oxides and a metallic transition metal or alloy, or a transition metal complex containing a metal element, with gaseous formic acid and/or formaldehyde heated to 120&#xb0; C. or higher. The copper oxide is preferably copper (I) oxide and/or copper (II) oxide. The transition metal, alloy or metal complex are preferably a metal selected from the group consisting of Cu, Pd, Pt, Ni, Ag, Au and Rh, an alloy containing the metal, or a complex containing the metal element, respectively.

Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid composition

Liquid composition, and resistor film, resistor element and circuit board using same

Provided are a copper conductor film and manufacturing method thereof, and patterned copper conductor wiring, which have superior conductivity and wiring pattern formation, and with which there is no decrease in insulation between circuits, even at narrow wiring widths and narrow inter-wiring spacing. Disclosed are a copper conductor film and manufacturing method thereof in which a copper-based particle-containing layer, which contains both a metal having catalytic activity toward a reducing agent and copper oxide, is treated using a treatment solution that contains a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complex to form metallic copper in a single solution, and patterned copper conductor wiring that is obtained by patterning a copper-based particle-containing layer using printing and by said patterned particle-containing layer being treated by a treatment method using a solution that contains both a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complexes to form metallic copper in a single solution.

Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution

The object of the invention is to provide a liquid crystal spacer-forming ink that can sufficiently reduce the dot diameter of liquid crystal spacers formed by ink jet printing, and specifically it provides a liquid crystal spacer-forming ink with a surface tension of at least 28 mN/m at 25&#xb0; C. and a viscosity of no greater than 50 mPa&#xb7;s at 25&#xb0; C.

Ink for forming liquid crystal spacer and liquid crystal display device using such ink

There is provided an insulation material having a dielectric constant of 10 or more, comprising a filler having a dielectric constant of 50 or more and having two peaks in different particle size ranges in a particle size distribution and an insulating resin combined with each other; an insulation material having a dielectric constant of 10 or more comprising, as essential components, 1) at least one filler selected from the group consisting of barium titanate, strontium titanate, potassium titanate, magnesium titanate, lead titanate, titanium dioxide, barium zirconate, calcium zirconate and lead zirconate, 2) an insulating resin and 3) a dispersant containing a carboxylic group; or an insulation material comprising a filler having a dielectric constant of 50 or more, a dispersant for dispersing the filler and an insulating resin as essential components, wherein an extract of a cured product of the insulation material obtained by extraction with water at 120&#xb0; C. for 20 hours using a pressure vessel has a pH of 6 or higher.

Insulation material, film, circuit board and method of producing them

An adhesive which comprises (1) 100 parts by weight of an epoxy resin and a hardener therefor, (2) 75 to 300 parts by weight of an epoxidized acrylic copolymer having a glycidyl (meth)acrylate unit content of 0.5 to 6 wt. %, a glass transition temperature of &#x2212;10&#xb0; C. or higher and a weight average molecular weight of 100,000 or more and (3) 0.1 to 20 parts by weight of a latent curing accelerator; an adhesive member having a layer of the adhesive; an interconnecting substrate for semiconductor mounting having the adhesive member; and a semiconductor device containing the same.

Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same

An adhesive which comprises (1) 100 parts by weight of an epoxy resin and a hardener therefor, (2) 75 to 300 parts by weight of an epoxidized acrylic copolymer having a glycidyl (meth)acrylate unit content of 0.5 to 6 wt. %, a glass transition temperature of &minus;10&deg; C. or higher and a weight average molecular weight of 100,000 or more and (3) 0.1 to 20 parts by weight of a latent curing accelerator; an adhesive member having a layer of the adhesive; an interconnecting substrate for semiconductor mounting having the adhesive member; and a semiconductor device containing the same.

The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25&deg; C. of from 10 to 2,000 MPa and a storage elastic modulus at 260&deg; C. of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process.

Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film

Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film

An insulating varnish comprising a resin component, electrical insulating whiskers, and if necessary, one or more additives such as an ion adsorbent, and/or an organic reagent for preventing injury from copper, produced by adding the additives to the resin component and the whiskers, or filtering the whiskers, or milled by using a beads mill or a three-roll mill, or the like, is excellent for producing a multilayer printed circuit board having high wiring density, high reliability and excellent other electrical properties.

Production of insulating varnishes and multilayer printed circuit boards using these varnishes

A multilayer wiring board for mounting a semiconductor device, which has a multi-bonding-deck cavity, comprises at least two wiring boards and an insulation adhesive layer having an elastic modulus of 1,400 MPa or lower having a coefficient of thermal expansion of 450 ppm/.degree. C. or lower in a direction of thickness and being a cured product of an adhesive film which is a semi-cured product of an adhesive composition comprising (a) 71 to 100 parts by weight of an epoxy group-containing acrylic rubber having a glass transition point of -10.degree. C. or above and a weight average molecular weight of 100,000 or above, (b) 50 to 70 parts by weight of an epoxy resin having a weight average molecular. weight of less than 10,000 and a curing agent, (c) 10 to 60 parts by weight of a high-molecular weight resin being compatible with the epoxy resin and having a weight average molecular weight of 30,000 or above and (d) 0.1 to 5 parts by weight of a cure accelerator.

Multilayer wiring board for mounting semiconductor device and method of

Adhesive, adhesive film and adhesive-backed metal foil

Growing community of inventors

Tsukuba, Japan

Yasushi Kumashiro