Lenovo (singapore) Pte. Ltd.

Yasushi Honda

Jason Aaron Matteson

Shigefumi Odaohhara

Jonathan Randall Hinkle

Mitsuo Horiuchi

Hiroaki Agata

Tetsuya Ohtani

Shigeki Mori

Shiro Konaka

A system according to one embodiment includes opposing slide plates, and opposing guide blocks configured to receive the slide plates therebetween and push the slide plates together during a relative motion between the slide plates and the guide blocks. A system according to another embodiment includes opposing slide plates and a thermal interface material coupled to opposing inner faces of the slide plate. Opposing guide blocks are configured to receive the slide plates therebetween and push the slide plates together during a relative motion between the slide plates and the guide blocks. An interface connector is coupled to at least one of the guide blocks and the slide plates, the interface connector having electrical connectors on opposite ends thereof.

Card connector system with heat dissipation and electromagnetic interference (EMI) shielding

An apparatus for reducing weight and thickness of portable computers is disclosed. The apparatus includes a lower housing, an upper housing and a cosmetic cover. The lower housing is configured to accommodate electronic elements therein. The upper housing, which has an opening inside, includes a periphery connected to the lower housing and a main bridge structure connected from one edge of the periphery to another edge of the periphery for providing structural support to the upper housing in the opening and for accommodating a display module therein. The cosmetic cover is configured to cover the upper housing.

Apparatus for reducing weight and thickness of a portable computer

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Chigasaki, Japan

Yasushi Honda