Mitsui Chemicals, Inc.

Yasushi Amada

Yohzoh Yamamoto

Kuniaki Kawabe

Motoyasu Yasui

Hirotaka Uosaki

Terufumi Suzuki

Hideo Nakamura

Akihito Ohga

Masaru Kokuryou

Kenji Miharu

Hideki Kuroki

Laminating resin compositions of the invention enable excellent productivity in the lamination processes, and are free from deterioration in optical characteristics such as transparency or surface properties inherent to resins such as polypropylenes. Multilayer structures obtained by laminating the composition on a substrate have tear strength which is as high as that of multilayer structures obtained by simply laminating a polyolefin resin such as polypropylene on a substrate. The laminating resin composition includes a polyolefin resin and a polyethylene wax having a density in the range of 890 to 955 kg/mas measured by a density gradient tube method in accordance with JIS K 7112 and a number average molecular weight (Mn) in terms of polyethylene in the range of 500 to 2900 as measured by gel permeation chromatography (GPC).

Laminating resin composition and multilayer structure

A laminated film superior in the heat resistance, shock resistance, moisture-barriering property and easy hand-tearability, which comprises one or more layers of a thermoplastic polyester resin (A), one or more layers of a resin based on cycloolefin (C) and one or more interposed layers of an adhesive (B) between layer (A) and layer (C), wherein the layer(s) of the thermoplastic polyester resin (A) and optionally the layer(s) of the resin based on cycloolefin (C) have been biaxially stretched and wherein the total thickness of the layer(s) of the thermoplastic polyester resin (A), the total thickness of the layer(s) of the adhesive (B) and the total thickness of the layer(s) based on cycloolefin (C) are 0.5-50 .mu.m, 0.5-20 .mu.m and 5-150 .mu.m, respectively.

Laminated film and packaging material

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Koga, Japan

Yasushi Amada